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LTL1DETBYJR5 LED Lamp Datasheet - T-1 Package - Blue/Yellow - 20mA - 3.8V - English Technical Document

Complete technical datasheet for the LTL1DETBYJR5 through-hole LED lamp. Includes specifications for Blue and Yellow variants, electrical/optical characteristics, binning, packaging, and application guidelines.
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PDF Document Cover - LTL1DETBYJR5 LED Lamp Datasheet - T-1 Package - Blue/Yellow - 20mA - 3.8V - English Technical Document

1. Product Overview

The LTL1DETBYJR5 is a through-hole LED lamp designed for status indication and signaling applications. It is offered in a standard T-1 type package, providing a reliable and cost-effective solution for a wide range of electronic devices.

1.1 Core Features and Advantages

This LED product is characterized by its low power consumption and high efficiency, making it suitable for energy-sensitive designs. It is compliant with RoHS (Restriction of Hazardous Substances) directives, being lead-free. Furthermore, it is classified as a halogen-free product, with chlorine (Cl) and bromine (Br) content strictly controlled below 900 ppm each, and their combined total below 1500 ppm. The device utilizes InGaN technology for the Blue chip and AlInGaP technology for the Yellow chip, both encapsulated within a white diffused lens that provides a uniform light appearance.

1.2 Target Applications and Markets

The primary application areas for this LED include communication equipment, computer peripherals, consumer electronics, and home appliances. Its versatility and standard form factor make it a common choice for power indicators, status lights, and backlighting in various electronic products.

2. Technical Parameters: In-Depth Objective Interpretation

2.1 Absolute Maximum Ratings

All ratings are specified at an ambient temperature (TA) of 25°C. Exceeding these limits may cause permanent damage.

2.2 Electrical and Optical Characteristics

Key performance parameters are measured at TA=25°C and IF=20 mA, unless otherwise stated.

3. Binning System Specification

The LEDs are sorted into bins based on their luminous intensity at 20 mA. This ensures consistency in brightness for production applications. The bin limits have a tolerance of ±30%.

Designers should specify the required bin code to guarantee the desired brightness level in their application.

4. Performance Curve Analysis

While specific graphs are referenced in the datasheet (Typical Electrical/Optical Characteristics Curves), the following trends are standard for such LEDs and can be inferred from the provided data:

4.1 Current vs. Voltage (I-V) Characteristic

The forward voltage (VF) increases with forward current (IF). The Blue LED, with its higher bandgap, exhibits a higher turn-on and operating voltage (~3.1-3.8V) compared to the Yellow LED (~2.05-2.4V).

4.2 Luminous Intensity vs. Current (L-I)

Luminous intensity is approximately proportional to the forward current up to the maximum rated current. Operating above 20mA will increase brightness but also power dissipation and junction temperature, which can affect longevity and wavelength.

4.3 Temperature Dependence

LED performance is temperature-sensitive. Typically, luminous intensity decreases as the junction temperature increases. The forward voltage also decreases slightly with rising temperature. The specified operating range of -40°C to +85°C defines the ambient conditions under which the published characteristics are guaranteed.

5. Mechanical and Package Information

5.1 Outline Dimensions

The LED uses a standard T-1 (3mm) radial leaded package. Key dimensional notes include:

5.2 Polarity Identification

For radial LEDs, the longer lead typically denotes the anode (positive), and the shorter lead denotes the cathode (negative). The flat side on the lens flange may also indicate the cathode side. Always verify polarity before soldering to prevent reverse bias damage.

6. Soldering and Assembly Guidelines

6.1 Storage Conditions

For optimal shelf life, store LEDs in an environment not exceeding 30°C and 70% relative humidity. If removed from the original moisture-barrier bag, use within three months. For longer storage outside the original packaging, use a sealed container with desiccant or a nitrogen atmosphere.

6.2 Cleaning

If cleaning is necessary, use alcohol-based solvents like isopropyl alcohol. Avoid harsh chemicals that may damage the epoxy lens.

6.3 Lead Forming

Bend leads at a point at least 3mm from the base of the LED lens. Do not use the lens base as a fulcrum. Perform all bending at room temperature and before the soldering process. Apply minimal force during PCB insertion to avoid mechanical stress.

6.4 Soldering Process

Maintain a minimum distance of 2mm from the base of the lens to the solder point. Do not immerse the lens in solder.

7. Packaging and Ordering Information

7.1 Packaging Specification

The LEDs are packed in anti-static bags. The standard packing configuration is:

8. Application Suggestions and Design Considerations

8.1 Drive Circuit Design

LEDs are current-operated devices. To ensure uniform brightness, especially when connecting multiple LEDs in parallel, it is strongly recommended to use a current-limiting resistor in series with each LED (Circuit A). Driving multiple LEDs in parallel without individual resistors (Circuit B) is not recommended due to variations in the forward voltage (VF) of individual LEDs, which will cause uneven current distribution and differing brightness levels.

8.2 Electrostatic Discharge (ESD) Protection

These LEDs are sensitive to electrostatic discharge. Implement the following ESD controls during handling and assembly:

8.3 Thermal Management

While the power dissipation is low, proper PCB layout can help dissipate heat. Avoid placing the LED near other heat-generating components. Operating the LED at currents below the maximum 30mA rating will improve long-term reliability by reducing junction temperature.

9. Technical Comparison and Differentiation

The LTL1DETBYJR5 offers a combination of features that position it for general-purpose indicator use:

10. Frequently Asked Questions (Based on Technical Parameters)

10.1 Can I drive this LED directly from a 5V supply?

No. You must use a series current-limiting resistor. For example, for the Blue LED at 20mA with a typical VF of 3.8V from a 5V supply: R = (5V - 3.8V) / 0.020A = 60 Ohms. A standard 62-ohm resistor would be suitable. Always calculate based on the maximum VF to ensure current does not exceed limits.

10.2 Why is the luminous intensity specified with a ±30% tolerance?

This tolerance accounts for normal production variations in the semiconductor chip and the encapsulation process. The binning system is used to sort LEDs into tighter brightness groups to provide consistency for the end-user who specifies a particular bin code.

10.3 What is the difference between Peak Wavelength and Dominant Wavelength?

Peak Wavelength (λP) is the wavelength at which the emission spectrum has its maximum intensity. Dominant Wavelength (λd) is derived from the CIE chromaticity diagram and represents the single wavelength of the pure spectral color that matches the perceived color of the LED. λd is more relevant for color specification in human vision.

10.4 Can I use this LED for outdoor applications?

The datasheet states it is suitable for indoor and outdoor signs. However, for harsh outdoor environments with prolonged exposure to UV radiation, moisture, and extreme temperatures, the long-term reliability of the epoxy lens material should be evaluated. Conformal coating on the PCB may be necessary for additional protection.

11. Practical Application Example

Scenario: Designing a multi-status indicator panel for a network router with Power (Green), Activity (Yellow), and Link (Blue) LEDs, all powered from a 3.3V rail.

Design Steps:

  1. Component Selection: Choose the LTL1DETBYJR5 in the Yellow and Blue variants (a separate Green LED model would be needed). Select appropriate bin codes for desired brightness consistency (e.g., JK for Yellow, HJ for Blue).
  2. Current Setting: Decide on a drive current, e.g., 15 mA for adequate brightness and lower power consumption.
  3. Resistor Calculation for Blue LED: Using max VF=3.8V, supply=3.3V. R = (3.3V - 3.8V) / 0.015A = Negative value. This indicates 3.3V is insufficient to forward bias the Blue LED at its typical voltage. The design must use a higher supply voltage (e.g., 5V) for the Blue LED or select a Blue LED with a lower VF.
  4. Resistor Calculation for Yellow LED (if using 3.3V): Using max VF=2.4V. R = (3.3V - 2.4V) / 0.015A = 60 Ohms.
  5. PCB Layout: Place LEDs on the front panel. Ensure holes for leads are sized correctly. Keep a 2mm clearance between the solder pad and the LED body. Route traces to supply and ground.
  6. Assembly: Insert LEDs, bend leads on the solder side, and clip. Use a temperature-controlled soldering iron (max 350°C) to solder each lead quickly (<3 sec).

This example highlights the importance of checking supply voltage against LED forward voltage during the design phase.

12. Operating Principle Introduction

Light Emitting Diodes (LEDs) are semiconductor devices that emit light when an electric current passes through them. This phenomenon is called electroluminescence.

13. Technology Trends and Developments

While through-hole LEDs like the T-1 package remain vital for prototyping, manual assembly, and certain applications, the broader industry trend has shifted significantly towards Surface-Mount Device (SMD) LEDs. SMD packages (e.g., 0603, 0805, 2835, 3535) offer advantages in automated assembly, smaller footprint, lower profile, and often better thermal management. For high-brightness and high-power applications, SMD packages and dedicated high-power LED packages (with metal-core PCBs) are dominant.

However, through-hole LEDs continue to be relevant due to their mechanical robustness, ease of hand-soldering, and suitability for educational kits, hobbyist projects, and applications where leads provide mechanical strain relief. Advances in materials have also improved the efficiency and lifetime of traditional through-hole packages. The focus for such components is often on achieving higher reliability, stricter environmental compliance (like halogen-free), and maintaining cost-effectiveness for high-volume, price-sensitive indicator applications.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.