LTW-R4NLDJDJH239 LED Lamp Datasheet - Through Hole - White Diffused Lens - 3.2V - 30mA - English Technical Document

1. Product Overview

The LTW-R4NLDJDJH239 is a through-hole mount LED lamp designed for use as a Circuit Board Indicator (CBI). It consists of a black plastic right-angle holder (housing) that mates with a white LED lamp. This design is intended for easy assembly onto printed circuit boards (PCBs). The product is characterized by its low power consumption, high efficiency, and compliance with RoHS and lead-free requirements.

1.1 Core Features

• Designed for ease of circuit board assembly.
• Black housing enhances contrast ratio for improved visibility.
• Low power consumption and high luminous efficiency.
• Lead-free product compliant with RoHS directives.
• LED emits white light using InGaN technology with a white diffused lens.

1.2 Target Applications

• Computer systems and peripherals.
• Communication equipment.
• Consumer electronics.
• Industrial control and instrumentation.

2. Technical Parameters: In-Depth Analysis

2.1 Absolute Maximum Ratings

All ratings are specified at an ambient temperature (TA) of 25°C. Exceeding these limits may cause permanent damage to the device.

• Power Dissipation: 108 mW
• Peak Forward Current: 100 mA (Duty Cycle ≤ 1/10, Pulse Width ≤ 10ms)
• DC Forward Current: 30 mA
• Current Derating: Linear from 30°C at a rate of 0.45 mA/°C.
• Operating Temperature Range: -40°C to +85°C
• Storage Temperature Range: -40°C to +100°C
• Lead Soldering Temperature: 260°C maximum for 5 seconds, measured 2.0mm from the body.

2.2 Electrical and Optical Characteristics

Key performance parameters are measured at TA=25°C and a forward current (IF) of 20 mA, unless otherwise noted.

• Luminous Intensity (Iv): Typical value is 300 mcd, with a range from 140 mcd (Min) to 520 mcd (Max). Measurement includes a ±15% testing tolerance.
• Viewing Angle (2θ1/2): Horizontal (H) is 130 degrees, Vertical (V) is 120 degrees. This is the off-axis angle where intensity drops to half the axial value.
• Chromaticity Coordinates (x, y): Typical values are x=0.30, y=0.29, derived from the CIE 1931 chromaticity diagram.
• Forward Voltage (VF): Typical value is 3.2V, ranging from 2.8V (Min) to 3.6V (Max) at IF=20mA.
• Reverse Current (IR): Maximum of 10 μA at a reverse voltage (VR) of 5V. Note: The device is not designed for reverse operation; this test condition is for characterization only.

3. Binning System Explanation

The LEDs are sorted (binned) based on their measured luminous intensity and chromaticity to ensure consistency in applications.

3.1 Luminous Intensity Binning

Bins are defined by a letter code indicating the minimum and maximum luminous intensity at IF=20mA. Each bin limit has a tolerance of ±15%.

• G: 140 mcd (Min) to 180 mcd (Max)
• H: 180 mcd to 240 mcd
• J: 240 mcd to 310 mcd
• K: 310 mcd to 400 mcd
• L: 400 mcd to 520 mcd

The Iv classification code is marked on each individual packing bag.

3.2 Hue (Chromaticity) Binning

Hue is classified into ranks (e.g., B1, B2, C1, C2, D1, D2) based on specific quadrilateral regions defined by (x, y) coordinate boundaries on the CIE 1931 chromaticity diagram. The color coordinate measurement allowance is ±0.01. The provided datasheet includes a table with the exact coordinate boundaries for each hue rank and a reference CIE chromaticity diagram for visualization.

4. Mechanical and Packaging Information

4.1 Outline Dimensions and Materials

The product features a right-angle through-hole design. Key mechanical notes include:

• All dimensions are provided in millimeters (with inches in parentheses).
• Standard tolerance is ±0.25mm (±0.010\") unless otherwise specified.
• The holder (housing) material is black plastic (PA9T).
• The LED lamp itself is white in color.

(Note: The specific dimensional drawing is referenced in the original PDF but not reproduced in text form here. The datasheet should be consulted for exact measurements).

4.2 Packing Specification

The LEDs are packed in trays for handling and shipping. The exact tray dimensions and capacity are detailed in a packing diagram within the original datasheet.

5. Assembly, Soldering, and Handling Guidelines

5.1 Storage Conditions

For optimal shelf life, LEDs should be stored in an environment not exceeding 30°C temperature or 70% relative humidity. If removed from their original moisture-barrier packaging, it is recommended to use them within three months. For longer-term storage outside the original bag, store in a sealed container with desiccant or in a nitrogen ambient.

5.2 Cleaning

If cleaning is necessary, use alcohol-based solvents such as isopropyl alcohol. Avoid using other harsh chemicals.

5.3 Lead Forming and PCB Assembly

• Bend leads at a point at least 3mm from the base of the LED lens. Do not use the base of the lead frame as a fulcrum.
• Lead forming must be performed at room temperature and before the soldering process.
• During PCB insertion, use the minimum clinch force necessary to avoid imposing excessive mechanical stress on the component.

5.4 Soldering Recommendations

Maintain a minimum distance of 2mm from the base of the lens/holder to the soldering point. Avoid dipping the lens/holder into solder.

• Soldering Iron: Maximum temperature 350°C, maximum time 3 seconds (one time only).
• Wave Soldering: Maximum pre-heat temperature 120°C for up to 100 seconds. Maximum solder wave temperature 260°C for a maximum of 5 seconds.

Warning: Excessive soldering temperature or time can cause deformation of the LED lens or catastrophic failure.

6. Application Design Considerations

6.1 Drive Circuit Design

LEDs are current-operated devices. To ensure uniform brightness when using multiple LEDs, it is strongly recommended to drive each LED with its own current-limiting resistor connected in series (Circuit Model A). Connecting multiple LEDs directly in parallel (Circuit Model B) is not recommended, as slight variations in the forward voltage (Vf) characteristic between individual LEDs can lead to significant differences in current sharing and, consequently, uneven brightness.

6.2 Electrostatic Discharge (ESD) Protection

This LED is susceptible to damage from electrostatic discharge or power surges. Preventive measures include:

• Operators should wear a conductive wrist strap or anti-static gloves when handling LEDs.
• All equipment, tools, and workstations must be properly grounded.
• Use an ionizer to neutralize static charges that may accumulate on the plastic lens surface due to handling friction.

6.3 Suitable Applications and Limitations

This LED lamp is suitable for general indicator applications in indoor and outdoor signage, as well as ordinary electronic equipment. Designers must ensure operating conditions (current, temperature) remain within the specified Absolute Maximum Ratings and recommended operating conditions outlined in this document.

7. Performance Curves and Typical Characteristics

The original datasheet references a section for \"Typical Electrical/Optical Characteristics Curves.\" These graphs typically illustrate the relationship between forward current and luminous intensity, forward voltage versus temperature, and possibly the spectral distribution. For detailed curve analysis, the graphical data in the official PDF should be consulted, as it provides visual confirmation of performance trends under varying conditions.

8. Technical Comparison and Differentiation

While a direct comparison with other specific part numbers is not provided in this standalone datasheet, the key differentiating features of this product can be inferred from its specifications:

• Right-Angle Through-Hole Design: Offers a specific mounting orientation compared to vertical or surface-mount alternatives, useful for side-view or space-constrained applications.
• Black Housing: Provides a higher contrast ratio against the illuminated lens, improving visibility in various lighting conditions.
• Wide Viewing Angle: The 130° (H) x 120° (V) viewing angle offers broad visibility, suitable for applications where the indicator may be viewed from off-axis positions.
• Comprehensive Binning: The detailed luminous intensity and chromaticity binning allow for tighter color and brightness matching in critical applications.

9. Frequently Asked Questions (Based on Technical Parameters)

9.1 What is the recommended operating current?

The typical test condition is 20mA, and the Absolute Maximum Rating for continuous DC current is 30mA. For reliable long-term operation, it is advisable to drive the LED at or below 20mA, possibly with appropriate derating if the ambient temperature exceeds 30°C.

9.2 How do I interpret the bin codes?

The letter code on the bag (G, H, J, K, L) indicates the luminous intensity range. You must cross-reference this with the Bin Table in section 7 of the datasheet to know the exact min/max mcd value for your batch. The hue rank information is typically provided on bulk packaging or in lot documentation.

9.3 Can I use this LED without a current-limiting resistor?

No. Connecting an LED directly to a voltage source is not recommended and will likely destroy the device due to overcurrent. A series resistor is mandatory to set the appropriate forward current as per the driver voltage and the LED's Vf characteristic.

9.4 What is the purpose of the derating specification?

The derating factor (0.45 mA/°C from 30°C) indicates how much the maximum allowable continuous forward current must be reduced for every degree Celsius that the ambient temperature rises above 30°C. This is critical for thermal management and ensuring device reliability at higher operating temperatures.

10. Design and Usage Case Example

Scenario: Designing a status indicator panel for an industrial controller that requires multiple white power-on indicators visible from various angles on an assembly line.

Component Selection Rationale: The LTW-R4NLDJDJH239 is chosen because its right-angle through-hole design allows it to be mounted perpendicular to the PCB, making the light output parallel to the panel surface. The wide viewing angle ensures visibility for operators standing at different positions. The black housing increases contrast against the metal panel. The designer specifies bin \"J\" or \"K\" from the manufacturer to ensure a consistently bright appearance across all indicators.

Circuit Implementation: Each LED is driven by a 5V rail through a separate 100Ω series resistor (calculated for ~18mA at a typical Vf of 3.2V), implementing the recommended Circuit Model A. The PCB layout ensures a 2mm clearance between the solder joint and the LED holder base. Wave soldering parameters are set within the datasheet limits.

11. Technical Principle Introduction

This LED is based on InGaN (Indium Gallium Nitride) semiconductor technology, which is commonly used for producing white light in modern LEDs. White light is typically generated by using a blue-emitting InGaN chip coated with a phosphor layer. The phosphor absorbs a portion of the blue light and re-emits it as yellow light. The combination of the remaining blue light and the broad-spectrum yellow phosphorescence results in the perception of white light. The diffused lens over the chip serves to scatter the light, creating a more uniform appearance and broadening the effective viewing angle.

12. Industry Trends and Context

While through-hole LEDs like this one remain essential for many applications requiring robust mechanical mounting or hand-soldering, the broader industry trend continues to shift towards surface-mount device (SMD) packages for automated assembly, higher density, and lower profile designs. However, through-hole components maintain advantages in certain scenarios: high-reliability applications where solder joint integrity is paramount, prototyping, educational use, and situations requiring the specific mechanical form factor (like right-angle mounting) offered by this product. The emphasis on RoHS compliance and lead-free soldering profiles, as seen in this datasheet, reflects global environmental regulations that are now standard across the electronics industry.