LTL-R42NGYADH229Y LED Lamp Datasheet - T-1 Diameter - 2.5V - 52mW - Yellow Green Diffused - English Technical Document

1. Product Overview

The LTL-R42NGYADH229Y is a Circuit Board Indicator (CBI) component designed for straightforward integration into printed circuit boards (PCBs). It consists of a black plastic right-angle holder (housing) that mates with a specific LED lamp. This design is part of a family of indicators available in various configurations, including top-view (spacer) or right-angle orientations, and can be arranged in horizontal or vertical arrays. The stackable nature of the housing facilitates easy assembly in applications requiring multiple indicators.

1.1 Key Features

• Optimized for ease of circuit board assembly and installation.
• Black housing material enhances the visual contrast ratio, making the illuminated indicator more distinct.
• Features a green diffused lens over a yellow-green light source.
• Offers low power consumption paired with high luminous efficiency.
• Manufactured as a lead-free product and is compliant with RoHS (Restriction of Hazardous Substances) directives.
• Utilizes an AlInGaP (Aluminum Indium Gallium Phosphide) semiconductor chip as the light source, housed in a T-1 (3mm) diameter package.

1.2 Target Applications

This LED lamp is suitable for a broad range of electronic equipment, including applications in computers, communication devices, consumer electronics, and industrial equipment. Its primary function is as a status or power indicator.

2. Technical Specifications Deep Dive

2.1 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. Operation under or at these limits is not guaranteed.

• Power Dissipation (Pd): 52 mW maximum. This is the total power the device can safely dissipate as heat.
• Peak Forward Current (I_FP): 60 mA, permissible only under pulsed conditions (duty cycle ≤ 1/10, pulse width ≤ 0.1ms).
• Continuous Forward Current (I_F): 20 mA DC maximum.
• Current Derating: Above an ambient temperature (T_A) of 30°C, the maximum allowable forward current must be reduced linearly at a rate of 0.27 mA per degree Celsius.
• Operating Temperature Range: -30°C to +85°C.
• Storage Temperature Range: -40°C to +100°C.
• Lead Soldering Temperature: 260°C maximum for 5 seconds, measured 2.0mm (0.079 inches) from the LED body.

2.2 Electrical & Optical Characteristics

Specified at an ambient temperature (T_A) of 25°C, unless otherwise noted. These are the typical performance parameters.

• Luminous Intensity (I_V): 8.7 mcd (Min), 19 mcd (Typ), 50 mcd (Max) at a forward current (I_F) of 10mA. Note that a ±15% testing tolerance is applied to these values.
• Viewing Angle (2θ_1/2): 100 degrees (Typical). This is the full angle at which the luminous intensity drops to half of its axial (on-center) value.
• Peak Emission Wavelength (λ_P): 572 nm (Typical). This is the wavelength at which the spectral output is strongest.
• Dominant Wavelength (λ_d): 566 nm (Min), 569 nm (Typ), 574 nm (Max) at I_F=10mA. This is the single wavelength that best represents the perceived color of the light.
• Spectral Line Half-Width (Δλ): 15 nm (Typical). This indicates the spectral purity or bandwidth of the emitted light.
• Forward Voltage (V_F): 2.0V (Min), 2.5V (Typ) at I_F=10mA.
• Reverse Current (I_R): 100 µA (Max) at a reverse voltage (V_R) of 5V. Important: This device is not designed for operation under reverse bias; this test condition is for characterization only.

3. Binning System Explanation

To ensure consistency in applications, LEDs are sorted (binned) based on key optical parameters. The LTL-R42NGYADH229Y uses two primary binning criteria.

3.1 Luminous Intensity Binning

LEDs are classified into bins based on their measured luminous intensity at I_F=10mA. Each bin has a ±15% tolerance on its limits.

• L3: 8.7 mcd to 12.6 mcd
• L2: 12.6 mcd to 19 mcd
• L1: 19 mcd to 29 mcd
• M1: 29 mcd to 50 mcd

The specific bin code (e.g., L2) is marked on the product packaging.

3.2 Dominant Wavelength (Hue) Binning

LEDs are also sorted by their dominant wavelength to control color consistency. The tolerance for each bin limit is ±1 nm.

• H06: 566.0 nm to 568.0 nm
• H07: 568.0 nm to 570.0 nm
• H08: 570.0 nm to 572.0 nm
• H09: 572.0 nm to 574.0 nm

4. Mechanical & Packaging Information

4.1 Outline Dimensions

The device features a right-angle through-hole design. The primary housing material is black plastic. The LED component itself has a T-1 (3mm) diameter. In this specific part number (LTL-R42NGYADH229Y), the LED1 position in the holder is empty, while the LED2 position is populated with a yellow-green AlInGaP chip covered by a green diffused lens. All dimensional tolerances are ±0.25mm (0.010\") unless otherwise specified on the dimensional drawing (refer to the datasheet for the detailed drawing).

4.2 Packing Specification

The LEDs are supplied in packaging suitable for automated assembly processes. The exact packing method (e.g., tape and reel, bulk) and quantities are defined in the packing specification section of the datasheet. The bin classification codes are clearly marked on the packaging bags for traceability.

5. Soldering & Assembly Guidelines

5.1 Lead Forming

If leads need to be bent, this must be done before soldering and at room temperature. The bend should be made at a point at least 3mm away from the base of the LED lens/holder. The base of the lead frame must not be used as a fulcrum during bending to avoid stress on the internal die attach.

5.2 Soldering Process

A minimum clearance of 2mm must be maintained between the base of the lens/holder and the solder joint. The lens must never be immersed in solder.

• Soldering Iron: Maximum temperature 350°C. Maximum soldering time 3 seconds per lead (one time only).
• Wave Soldering: Maximum pre-heat temperature 120°C for up to 100 seconds. Maximum solder wave temperature 260°C for a maximum of 5 seconds. The dipping position must be no lower than 2mm from the base of the epoxy lens.

Warning: Exceeding the recommended temperature or time can cause lens deformation or catastrophic LED failure.

5.3 Storage & Handling

For long-term storage outside the original packaging, it is recommended to store LEDs in a sealed container with desiccant or in a nitrogen ambient. LEDs removed from packaging should ideally be used within three months. The recommended storage environment does not exceed 30°C and 70% relative humidity.

5.4 Cleaning

If cleaning is necessary, use only alcohol-based solvents such as isopropyl alcohol.

6. Application & Design Considerations

6.1 Drive Circuit Design

LEDs are current-operated devices. To ensure uniform brightness when driving multiple LEDs in parallel, it is strongly recommended to use a individual current-limiting resistor in series with each LED (Circuit Model A). Driving LEDs in parallel without individual resistors (Circuit Model B) is not recommended, as small variations in the forward voltage (V_F) characteristic between LEDs will cause significant differences in current sharing and, consequently, brightness.

6.2 Electrostatic Discharge (ESD) Protection

The LED is sensitive to electrostatic discharge. Proper ESD controls must be implemented during handling and assembly:

• Operators should wear grounded wrist straps or anti-static gloves.
• All equipment, workbenches, and storage racks must be properly grounded.
• Use ionizers to neutralize static charge that may accumulate on the plastic lens.
• Maintain a static-safe workstation with appropriate signage.

6.3 Thermal Management

While the power dissipation is low (52mW max), adhering to the current derating curve above 30°C is crucial for long-term reliability. Ensure adequate airflow in the end application if operating near the maximum temperature limits.

7. Performance Curves & Typical Characteristics

The datasheet includes typical performance curves which provide valuable design insight. These graphs visually represent the relationship between key parameters under varying conditions. While specific curve data points are not listed here, designers should consult these curves for:

• Relative Luminous Intensity vs. Forward Current: Shows how light output increases with current, typically in a sub-linear manner at higher currents.
• Forward Voltage vs. Forward Current: Illustrates the diode's I-V characteristic.
• Relative Luminous Intensity vs. Ambient Temperature: Demonstrates the reduction in light output as junction temperature rises.
• Spectral Distribution: A graph showing the relative radiant power across wavelengths, centered around the peak wavelength of 572 nm with a typical half-width of 15 nm.

These curves are essential for predicting performance under non-standard conditions (e.g., different drive currents or ambient temperatures) and for optimizing the design for efficiency and longevity.