T-1 3/4 Yellow LED Lamp Datasheet - 5.0mm Dia - 2.1V - 20mA - High Luminous Intensity - English Technical Document

1. Product Overview

This document details the specifications for a high-performance, yellow-emitting through-hole LED lamp. Designed for versatility and reliability, this component is suitable for a wide range of indicator and illumination applications in consumer electronics, industrial controls, and general-purpose devices. Its primary advantages include high luminous output, low power consumption, and compatibility with standard assembly processes.

The LED features a popular T-1 3/4 (5.0mm) diameter package with a water-clear lens, which enhances light output and viewing angle. It is constructed using AlInGaP (Aluminum Indium Gallium Phosphide) semiconductor technology, known for its high efficiency and stable color performance. The product is compliant with RoHS directives, indicating it is free from hazardous substances like lead (Pb).

2. Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. Operation under or at these conditions is not guaranteed and should be avoided for reliable performance.

• Power Dissipation (P_D): 125 mW maximum.
• Peak Forward Current (I_FP): 100 mA, permissible only under pulsed conditions (1/10 duty cycle, 0.1ms pulse width).
• DC Forward Current (I_F): 50 mA continuous.
• Derating: The DC forward current must be linearly reduced by 0.6 mA for every degree Celsius above 50°C ambient temperature (T_A).
• Operating Temperature Range (T_opr): -40°C to +100°C.
• Storage Temperature Range (T_stg): -50°C to +100°C.
• Lead Soldering Temperature: 260°C maximum for 5 seconds, measured at a point 2.0mm (0.078 inches) from the base of the LED body.

3. Electrical & Optical Characteristics

All parameters are specified at an ambient temperature (T_A) of 25°C unless otherwise noted. These define the typical performance under normal operating conditions.

3.1 Optical Parameters

• Luminous Intensity (I_V): Ranges from a minimum of 5500 mcd to a typical maximum of 16000 mcd at a forward current (I_F) of 20 mA. A tolerance of ±15% applies to the guaranteed intensity value.
• Viewing Angle (2θ_1/2): 30 degrees. This is the full angle at which the luminous intensity drops to half of its axial (on-center) value. A tolerance of ±2° applies.
• Peak Emission Wavelength (λ_P): Between 587 nm and 594.5 nm, with a typical value of 591 nm. This is the wavelength at which the spectral output is strongest.
• Dominant Wavelength (λ_d): Approximately 590 nm. This is the single wavelength perceived by the human eye that defines the color (yellow) of the LED, derived from the CIE chromaticity diagram.
• Spectral Line Half-Width (Δλ): Approximately 20 nm. This indicates the spectral purity, defining the range of wavelengths around the peak that contain significant optical power.

3.2 Electrical Parameters

• Forward Voltage (V_F): Between 1.8 V and 2.5 V, with a typical value of 2.1 V at I_F = 20 mA.
• Reverse Current (I_R): 10 μA maximum when a reverse voltage (V_R) of 5V is applied. Important: This device is not designed for reverse operation; this test condition is for characterization only.

4. Binning System Specifications

To ensure consistency in applications, LEDs are sorted (binned) according to key performance parameters. The bin code is marked on the packaging.

4.1 Luminous Intensity Binning

Measured at I_F = 20 mA. Tolerance for each bin limit is ±15%.

• Bin W: 5500 – 7200 mcd
• Bin X: 7200 – 9300 mcd
• Bin Y: 9300 – 12000 mcd
• Bin Z: 12000 – 16000 mcd

4.2 Dominant Wavelength Binning

Measured at I_F = 20 mA. Tolerance for each bin limit is ±1 nm.

• Bin 2: 587.0 – 589.5 nm
• Bin 3: 589.5 – 592.0 nm
• Bin 4: 592.0 – 594.5 nm

5. Mechanical & Package Information

The LED is housed in a standard T-1 3/4 (5.0mm diameter) through-hole package. Key dimensional notes include:

• All dimensions are in millimeters (inches provided as reference).
• Standard tolerance is ±0.25mm (±0.010\") unless a specific note states otherwise.
• Lead spacing is measured at the point where the leads emerge from the plastic package body.
• The lens is water-clear, optimizing light transmission.

6. Soldering & Assembly Guidelines

Proper handling is critical to prevent damage and ensure long-term reliability.

6.1 Lead Forming

• Bending must be performed at a point at least 3mm from the base of the LED lens.
• The base of the lead frame must not be used as a fulcrum.
• Forming must be done at room temperature and before the soldering process.
• During PCB insertion, use minimal clinching force to avoid mechanical stress on the leads or package.

6.2 Soldering Process

• Maintain a minimum distance of 2mm from the base of the lens to the solder point.
• Avoid immersing the lens in solder.
• Do not apply external stress to the leads while the LED is hot from soldering.
• Recommended Soldering Conditions:
  • Soldering Iron: 350°C max. temperature, 3 seconds max. contact time (one-time only per lead).
  • Wave Soldering: Pre-heat to 100°C max. for 60 seconds max.; solder wave at 260°C max. for 5 seconds max.
• Important: Excessive temperature or time can deform the lens or cause catastrophic failure. IR reflow soldering is not suitable for this through-hole type LED.

6.3 Cleaning

If cleaning is necessary, use alcohol-based solvents such as isopropyl alcohol.

6.4 Storage

For optimal shelf life:

• Store in an environment not exceeding 30°C and 70% relative humidity.
• LEDs removed from their original moisture-barrier packaging should be used within three months.
• For longer-term storage outside the original pack, place LEDs in a sealed container with desiccant or in a nitrogen-purged desiccator.

7. Drive Circuit Design

LEDs are current-operated devices. To ensure consistent brightness, especially when using multiple LEDs, proper current regulation is essential.

• Recommended Circuit (Model A): Use a series current-limiting resistor for each individual LED. This method compensates for variations in the forward voltage (V_F) characteristic between different LEDs, ensuring uniform current and thus uniform luminous intensity.
• Non-Recommended Circuit (Model B): Connecting multiple LEDs directly in parallel without individual resistors is discouraged. Small differences in V_F can cause significant current imbalance, leading to noticeable differences in brightness and potential over-current in some devices.
• The value of the series resistor (R_s) can be calculated using Ohm's Law: R_s = (V_supply - V_F) / I_F, where V_F and I_F are the desired operating points from the datasheet.

8. Electrostatic Discharge (ESD) Protection

This LED is susceptible to damage from electrostatic discharge. The following precautions must be observed during handling and assembly:

• Operators should wear a grounded wrist strap or anti-static gloves.
• All equipment, workbenches, and storage racks must be properly grounded.
• Use an ionizer to neutralize static charges that may accumulate on the plastic lens surface.

9. Packaging Specifications

The standard packaging configuration is as follows:

• Unit Pack: 500 or 250 pieces per moisture-resistant packing bag.
• Inner Carton: Contains 10 packing bags, totaling 5000 pieces.
• Outer Carton (Shipping Box): Contains 8 inner cartons, totaling 40,000 pieces.
• Note: In any shipping lot, only the final pack may contain a non-full quantity.

10. Application Notes & Cautions

• Intended Use: This product is designed for ordinary electronic equipment (e.g., office equipment, communications devices, household appliances).
• Critical Applications: For applications requiring exceptional reliability where failure could risk life or health (e.g., aviation, medical systems, safety devices), specific approval and qualification are required prior to use.
• Disclaimer: All specifications are subject to change without notice. It is the responsibility of the user to verify the suitability of the product for their specific application.

11. Performance Curve Analysis

While specific graphs are referenced in the datasheet (e.g., Figure 1 for spectral distribution, Figure 6 for viewing angle), typical characteristics can be inferred from the tabular data:

• I-V Curve: The forward voltage (V_F) shows a relatively low value (typ. 2.1V), which is characteristic of AlInGaP technology and contributes to lower power consumption.
• Temperature Dependence: The derating factor of 0.6 mA/°C above 50°C indicates that the maximum permissible DC current decreases linearly with increasing ambient temperature to prevent overheating and ensure longevity.
• Spectral Distribution: The narrow half-width (Δλ ~20 nm) and well-defined peak wavelength (λ_P ~591 nm) indicate good color saturation and purity, which is desirable for clear, distinct yellow indicators.

12. Technical Comparison & Design Considerations

Compared to older technologies like GaAsP (Gallium Arsenide Phosphide), this AlInGaP LED offers significantly higher luminous efficiency, resulting in greater intensity for the same drive current. The low forward voltage also reduces power dissipation in the series resistor, improving overall system efficiency.

Key Design Considerations:

1. Current Control: Always drive with a constant current or a voltage source with a series resistor. Never connect directly to a voltage source without current limiting.
2. Thermal Management: Although a through-hole package, consider the ambient temperature and adhere to the derating curve for high-temperature environments to maintain reliability.
3. Optical Design: The 30-degree viewing angle provides a focused beam. For wider illumination, secondary optics (diffusers) may be required.
4. Waveform for Pulsing: When using the peak current rating (100 mA), ensure the pulse width is 0.1ms or less and the duty cycle is 10% or lower to avoid exceeding the average power dissipation limits.