Table of Contents
- 1. Product Overview
- 1.1 Core Advantages
- 1.2 Target Applications
- 2. Technical Parameter Analysis
- 2.1 Absolute Maximum Ratings
- 2.2 Electrical & Optical Characteristics
- 3. Binning System Specification
- 3.1 Luminous Intensity Binning
- 3.2 Dominant Wavelength Binning
- 4. Mechanical & Packaging Information
- 4.1 Outline Dimensions
- 4.2 Packaging Specification
- 5. Assembly & Handling Guidelines
- 5.1 Storage Conditions
- 5.2 Lead Forming & PCB Assembly
- 5.3 Soldering Recommendations
- 5.4 Cleaning
- 6. Application & Circuit Design
- 6.1 Drive Circuit Design
- 6.2 Electrostatic Discharge (ESD) Protection
- 7. Performance Curves & Thermal Considerations
- 8. Frequently Asked Questions (FAQ)
- 8.1 Can I drive this LED without a series resistor?
- 8.2 What is the difference between Peak Wavelength and Dominant Wavelength?
- 8.3 Is this LED suitable for outdoor use?
- 8.4 How do I interpret the bin codes when ordering?
- 9. Design Considerations & Best Practices
- LED Specification Terminology
- Photoelectric Performance
- Electrical Parameters
- Thermal Management & Reliability
- Packaging & Materials
- Quality Control & Binning
- Testing & Certification
1. Product Overview
The LTL17KRL6D is a standard through-hole LED lamp designed for status indication and signaling applications. It features a popular T-1 (3mm) diameter package with a red, diffused lens. This device is characterized by low power consumption, high luminous efficiency, and is compliant with RoHS directives, making it a lead-free component suitable for modern electronic designs.
1.1 Core Advantages
- High Efficiency: Delivers high luminous intensity output relative to its power consumption.
- Design Flexibility: Available in standard T-1 package, compatible with common PCB layouts.
- Environmental Compliance: Manufactured as a lead-free product, adhering to RoHS standards.
- Reliability: Designed for stable operation across a wide temperature range.
1.2 Target Applications
This LED is versatile and finds use in numerous sectors requiring reliable visual indicators. Primary application areas include communication equipment, computer peripherals, consumer electronics, home appliances, and various industrial control systems.
2. Technical Parameter Analysis
2.1 Absolute Maximum Ratings
These ratings define the limits beyond which permanent damage to the device may occur. Operation under these conditions is not guaranteed.
- Power Dissipation (PD): 75 mW
- DC Forward Current (IF): 30 mA
- Peak Forward Current (IFP): 90 mA (Pulse conditions: Duty Cycle ≤ 1/10, Pulse Width ≤ 10μs)
- Operating Temperature Range (Topr): -40°C to +85°C
- Storage Temperature Range (Tstg): -40°C to +100°C
- Lead Soldering Temperature: 260°C for a maximum of 5 seconds, measured 2.0mm from the LED body.
2.2 Electrical & Optical Characteristics
These parameters are measured at an ambient temperature (TA) of 25°C and define the typical performance of the device.
- Luminous Intensity (IV): 310 mcd (Min), 460 mcd (Typ), 680 mcd (Max) at IF = 20mA. Measured with a filter approximating the CIE photopic eye response.
- Viewing Angle (2θ1/2): 60 degrees (Typical). Defined as the off-axis angle where intensity is half the axial value.
- Peak Wavelength (λP): 631 nm (Typical).
- Dominant Wavelength (λd): 617 nm (Min), 627 nm (Typ), 637 nm (Max). This defines the perceived color.
- Spectral Half-Width (Δλ): 20 nm (Typical).
- Forward Voltage (VF): 2.0 V (Typ), 2.4 V (Max) at IF = 20mA.
- Reverse Current (IR): 100 μA (Max) at VR = 5V. Note: The LED is not designed for reverse bias operation.
3. Binning System Specification
The LTL17KRL6D is classified into bins based on luminous intensity and dominant wavelength to ensure color and brightness consistency in production applications.
3.1 Luminous Intensity Binning
Binning is performed at a test current of 20mA. Each bin has a tolerance of ±15% on its limits.
- Bin K: 310 mcd (Min) to 400 mcd (Max)
- Bin L: 400 mcd (Min) to 520 mcd (Max)
- Bin M: 520 mcd (Min) to 680 mcd (Max)
3.2 Dominant Wavelength Binning
Binning ensures color uniformity. Tolerance for each bin limit is ±1 nm.
- Bin H28: 617.0 nm to 621.0 nm
- Bin H29: 621.0 nm to 625.0 nm
- Bin H30: 625.0 nm to 629.0 nm
- Bin H31: 629.0 nm to 633.0 nm
- Bin H32: 633.0 nm to 637.0 nm
4. Mechanical & Packaging Information
4.1 Outline Dimensions
The LED conforms to the standard T-1 (3mm) radial leaded package. Key dimensional notes include: all dimensions are in millimeters; tolerance is ±0.25mm unless specified; maximum resin protrusion under the flange is 1.0mm; lead spacing is measured at the point where leads exit the package.
4.2 Packaging Specification
The LEDs are supplied in anti-static packing bags. Standard packing quantities are 1000, 500, 200, or 100 pieces per bag. These are then consolidated into inner and outer cartons for bulk shipment.
- Inner Carton: Contains 10 packing bags, totaling 10,000 pieces.
- Outer Carton: Contains 8 inner cartons, totaling 80,000 pieces. The last pack in a shipping lot may not be a full pack.
5. Assembly & Handling Guidelines
5.1 Storage Conditions
For optimal shelf life, LEDs should be stored in an environment not exceeding 30°C and 70% relative humidity. Components removed from their original packaging should be used within three months. For longer storage outside the original bag, use a sealed container with desiccant or a nitrogen-filled desiccator.
5.2 Lead Forming & PCB Assembly
- Bend leads at a point at least 3mm from the base of the LED lens. Do not use the lens base as a fulcrum.
- Lead forming must be completed before soldering and at room temperature.
- During PCB insertion, apply the minimum clinch force necessary to avoid imposing excessive mechanical stress on the component.
5.3 Soldering Recommendations
Maintain a minimum distance of 2mm from the base of the lens to the solder point. Avoid immersing the lens in solder. Do not apply stress to the leads while the LED is hot.
- Soldering Iron: Maximum temperature 350°C for a maximum of 3 seconds (one time only).
- Wave Soldering: Pre-heat to a maximum of 100°C for up to 60 seconds. Solder wave temperature maximum 260°C for up to 5 seconds.
- Important: Excessive temperature or time can deform the lens or cause failure. IR reflow soldering is NOT suitable for this through-hole LED.
5.4 Cleaning
If cleaning is necessary, use alcohol-based solvents such as isopropyl alcohol.
6. Application & Circuit Design
6.1 Drive Circuit Design
LEDs are current-operated devices. To ensure uniform brightness when driving multiple LEDs, it is strongly recommended to use a current-limiting resistor in series with each LED (Circuit A). Connecting LEDs directly in parallel (Circuit B) is not advised, as slight variations in the forward voltage (VF) characteristic between individual LEDs will cause significant differences in current sharing and, consequently, perceived brightness.
6.2 Electrostatic Discharge (ESD) Protection
LEDs are sensitive to electrostatic discharge. Implement the following ESD control measures in the handling and assembly area:
- Operators must wear grounded wrist straps or anti-static gloves.
- All equipment, workstations, and storage racks must be properly grounded.
- Use ionizers to neutralize static charge that may accumulate on the plastic lens.
- Maintain a static-safe work area with all surfaces measuring less than 100V.
7. Performance Curves & Thermal Considerations
While specific graphs are referenced in the datasheet (e.g., Typical Characteristics Curves), the provided electrical parameters allow for key performance estimations. The forward voltage has a negative temperature coefficient, meaning VF will decrease slightly as the junction temperature increases. The luminous output is also temperature-dependent, typically decreasing as temperature rises. Designers should consider thermal management if operating near maximum ratings or in high ambient temperatures to maintain long-term reliability and consistent light output.
8. Frequently Asked Questions (FAQ)
8.1 Can I drive this LED without a series resistor?
No. Operating an LED directly from a voltage source is not recommended and will likely destroy the device due to overcurrent. A series resistor is mandatory to limit the current to the specified value (e.g., 20mA for typical brightness).
8.2 What is the difference between Peak Wavelength and Dominant Wavelength?
Peak Wavelength (λP): The wavelength at which the optical output power is maximum. Dominant Wavelength (λd): The single wavelength perceived by the human eye, calculated from the CIE chromaticity coordinates. λd is more relevant for color definition in indication applications.
8.3 Is this LED suitable for outdoor use?
The datasheet lists applications including outdoor signs. However, the operating temperature range is -40°C to +85°C. For harsh outdoor environments, consider additional protection against moisture, UV radiation, and thermal cycling, which may not be provided by the LED package alone.
8.4 How do I interpret the bin codes when ordering?
Specify the required Luminous Intensity Bin (K, L, M) and Dominant Wavelength Bin (H28 to H32) to ensure you receive LEDs with consistent brightness and color. If not specified, you may receive components from any production bin within the product's overall specification range.
9. Design Considerations & Best Practices
- Current Selection: For longest lifetime, operate below the absolute maximum DC current of 30mA. The typical test condition of 20mA is a good balance of brightness and reliability.
- Heat Dissipation: Although power dissipation is low, ensure adequate spacing on the PCB and avoid enclosing the LED in a way that traps heat, especially when operating at high ambient temperatures.
- Polarity: The longer lead is typically the anode (+). Always verify polarity before soldering to prevent reverse bias application.
- Optical Design: The 60-degree viewing angle provides a wide beam. For more focused light, external lenses or light pipes may be required.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |