LTL750RGBHBJH292U RGB LED Lamp Datasheet - Through Hole - 20mA - Red/Green/Blue - English Technical Document

1. Product Overview

The LTL750RGBHBJH292U is a through-hole mounted, right-angle Circuit Board Indicator (CBI) lamp integrating Red, Green, and Blue (RGB) LED chips within a single black plastic housing. It features a white diffused lens for color mixing and uniform light distribution. This component is designed for versatile mounting on printed circuit boards (PCBs) or panels, offering a stackable and easy-to-assemble solution for multi-color indication needs.

1.1 Core Features

• Lead (Pb)-Free and RoHS compliant construction.
• Low power consumption with high luminous efficiency.
• Versatile mounting options suitable for PCB or panel integration.
• Integrated RGB LED chips with a white diffused lens for color blending.

1.2 Target Applications

This LED lamp is suitable for a wide range of electronic equipment requiring multi-color status indication, signaling, or backlighting. Primary application sectors include:

• Communication Equipment
• Computer Peripherals and Systems
• Consumer Electronics
• Home Appliances
• Industrial Control Systems

2. Technical Parameter Deep Dive

All specifications are defined at an ambient temperature (TA) of 25°C unless otherwise stated.

2.1 Absolute Maximum Ratings

Stresses beyond these limits may cause permanent damage to the device.

• Power Dissipation: Red: 80 mW, Green: 108 mW, Blue: 108 mW.
• Peak Forward Current: (1/10 Duty Cycle, 0.1ms Pulse) Red: 90 mA, Green: 100 mA, Blue: 100 mA.
• DC Forward Current (Continuous): 30 mA for all colors.
• Derating Factor: Linear derating from 50°C at 0.57 mA/°C for all colors.
• Operating Temperature Range: -40°C to +85°C.
• Storage Temperature Range: -40°C to +100°C.
• Lead Soldering Temperature: 260°C max for 5 seconds, measured 2.0mm from the LED body.

2.2 Electrical & Optical Characteristics

Typical performance parameters measured at a forward current (IF) of 20mA.

• Luminous Intensity (Iv):
  • Red: 140 - 725 mcd
  • Green: 170 - 870 mcd
  • Blue: 38 - 180 mcd
• Viewing Angle (2θ1/2): Approximately 110 degrees for all colors. This is the off-axis angle where luminous intensity drops to half its axial value.
• Peak Wavelength (λP):
  • Red: ~634 nm
  • Green: ~525 nm
  • Blue: ~470 nm
• Dominant Wavelength (λd):
  • Red: 618 - 630 nm
  • Green: 513 - 530 nm
  • Blue: 465 - 477 nm
• Forward Voltage (VF):
  • Red: 1.7V (Min), 2.2V (Typ), 2.7V (Max)
  • Green: 2.5V (Min), 3.2V (Typ), 3.6V (Max)
  • Blue: 2.5V (Min), 3.2V (Typ), 3.6V (Max)
• Reverse Current (IR): Measured at VR = 5V. Red: 10 μA max, Green/Blue: 50 μA max. The device is not designed for reverse bias operation.

3. Binning System Specification

The LEDs are classified into bins based on their luminous intensity at 20mA. This ensures color and brightness consistency within a defined range for production batches. A tolerance of ±15% applies to each bin limit.

3.1 Luminous Intensity Bins

• Red Bins:
  • RA: 140 - 240 mcd
  • RB: 240 - 420 mcd
  • RC: 420 - 725 mcd
• Green Bins:
  • GA: 170 - 290 mcd
  • GB: 290 - 500 mcd
  • GC: 500 - 870 mcd
• Blue Bins:
  • BA: 38 - 65 mcd
  • BB: 65 - 110 mcd
  • BC: 110 - 180 mcd

The specific bin code for luminous intensity is marked on each packing bag, allowing for precise selection in manufacturing.

4. Mechanical & Packaging Information

4.1 Outline Dimensions

The device uses a standard right-angle through-hole package. Key dimensional notes include:

• All dimensions are in millimeters (inches provided in the original drawing).
• General tolerance is ±0.25mm unless specified otherwise.
• Maximum protruded resin under the flange is 1.0mm.
• Lead spacing is measured at the point where leads emerge from the package body.

4.2 Packaging Specifications

The product is supplied in a multi-level packaging system to protect the components and facilitate handling.

• Tube: Holds 46 pieces. Dimensions: 520mm x 12.7mm x 8.9mm.
• Inner Carton: Contains 156 tubes, totaling 7,176 pieces. Dimensions: 544mm x 180mm x 141mm.
• Outer Carton: Contains 4 inner cartons, totaling 28,704 pieces. Dimensions: 550mm x 370mm x 302mm.

5. Soldering & Assembly Guidelines

Proper handling is critical to ensure device reliability and prevent damage.

5.1 Lead Forming

• Bending must be performed at a point at least 3mm from the base of the LED lens.
• Do not use the base of the lead frame as a fulcrum.
• Lead forming must be done at normal temperature, before the soldering process.
• During PCB assembly, use the minimum clinch force necessary to avoid excessive mechanical stress on the leads or package.

5.2 Soldering Process

A minimum clearance of 2mm must be maintained between the base of the lens and the soldering point. Dipping the lens into solder must be avoided.

• Soldering Iron:
  • Temperature: 350°C Max.
  • Time: 3 seconds Max. (one time only).
• Wave Soldering:
  • Pre-heat Temperature: 100°C Max.
  • Pre-heat Time: 60 seconds Max.
  • Solder Wave Temperature: 260°C Max.
  • Soldering Time: 5 seconds Max.

Important Note: Excessive soldering temperature and/or time can cause lens deformation or catastrophic LED failure. Infrared (IR) reflow soldering is not a suitable process for this through-hole type LED lamp.

5.3 Storage & Cleaning

• Storage: Recommended storage conditions are ≤30°C and ≤70% relative humidity. LEDs removed from original packaging should be used within three months. For longer storage, use a sealed container with desiccant or a nitrogen ambient.
• Cleaning: If necessary, clean only with alcohol-based solvents like isopropyl alcohol.

6. Application & Design Considerations

6.1 Drive Circuit Design

LEDs are current-operated devices. To ensure uniform brightness when driving multiple LEDs, especially in parallel configurations, it is strongly recommended to use a current-limiting resistor in series with each individual LED (Circuit Model A). Driving multiple LEDs in parallel without individual series resistors (Circuit Model B) is not recommended, as slight variations in the forward voltage (Vf) characteristics between LEDs can lead to significant differences in current sharing and, consequently, uneven brightness.

6.2 Electrostatic Discharge (ESD) Protection

These LEDs are sensitive to electrostatic discharge and power surges, which can cause immediate or latent damage. To prevent ESD damage:

• Operators should wear a conductive wrist strap or anti-static gloves when handling the LEDs.
• All equipment, machinery, work tables, and storage racks must be properly grounded.
• Use an ionizer blower to neutralize static charges in the work area.

6.3 Application Suitability

This LED lamp is suitable for general indoor and outdoor signage applications, as well as standard electronic equipment. The specified operating temperature range of -40°C to +85°C supports use in various environmental conditions.

7. Performance Curves & Typical Characteristics

The datasheet references typical performance curves which graphically represent key relationships. These curves are essential for detailed design analysis.

• Relative Luminous Intensity vs. Forward Current: Shows how light output increases with current for each color, typically up to the maximum rated current.
• Forward Voltage vs. Forward Current: Illustrates the V-I characteristic of each LED chip, crucial for calculating the appropriate series resistor value.
• Relative Luminous Intensity vs. Ambient Temperature: Demonstrates the derating of light output as junction temperature increases, highlighting the importance of thermal management in high-power or high-ambient-temperature applications.
• Spectral Distribution: Depicts the relative radiant power versus wavelength for each color, showing the peak and dominant wavelengths visually.

Designers should consult these curves to optimize drive conditions, understand efficiency trade-offs, and predict performance under non-standard temperatures.

8. Technical Comparison & Design Advantages

The LTL750RGBHBJH292U offers several design advantages for multi-color indication:

• Integrated RGB Solution: Combines three discrete color chips in one right-angle package, saving PCB space compared to using three separate single-color LEDs.
• White Diffused Lens: Provides color mixing and a wider, more uniform viewing pattern, ideal for status indicators that need to be visible from various angles.
• Standardized Binning: The defined binning system for luminous intensity allows for predictable and consistent brightness levels in production, reducing color and brightness matching issues in final assemblies.
• Robust Through-Hole Design: Offers strong mechanical attachment to the PCB, suitable for applications subject to vibration or requiring manual assembly.

9. Frequently Asked Questions (FAQ)

9.1 What is the difference between peak wavelength and dominant wavelength?

Peak wavelength (λP) is the wavelength at which the emitted optical power is maximum. Dominant wavelength (λd) is derived from the CIE chromaticity diagram and represents the single wavelength of a pure monochromatic light that would match the perceived color of the LED. For LEDs, λd is often more relevant to the human perception of color.

9.2 Can I drive this LED without a series resistor?

No. Driving an LED directly from a voltage source is not recommended and is likely to destroy the device due to excessive current. An LED must be driven with a controlled current, typically achieved using a constant current driver or, more commonly, a voltage source with a series current-limiting resistor.

9.3 Why is a 2mm minimum clearance required between the lens and solder point?

This clearance prevents thermal damage to the LED's epoxy lens during the soldering process. Excessive heat can cause the lens to crack, discolor, or deform, which would impair optical performance and potentially expose the semiconductor die to environmental contaminants.

9.4 How do I select the correct bin for my application?

Select the bin based on the required minimum luminous intensity for your design. For example, if your application requires a minimum red intensity of 300 mcd at 20mA, you would need to specify bins RB or RC. Consulting the bin table ensures you receive components that meet your brightness specifications.

10. Practical Design Case Study

Scenario: Designing a multi-status indicator panel for an industrial controller. The panel needs to display Power (steady green), Fault (flashing red), and Standby (steady blue) states using a single indicator location.

Implementation with LTL750RGBHBJH292U:

1. Circuit Design: A microcontroller drives three separate output pins, each connected to one color channel (R, G, B) of the LED. Each channel includes a series resistor calculated based on the desired current (e.g., 15mA for adequate brightness) and the typical forward voltage (Vf) of that color from the datasheet, using the supply voltage.
2. Resistor Calculation Example (Green Channel, Vcc=5V):
   • Target IF = 15mA, Typical Vf (Green) = 3.2V.
   • Resistor Value R = (Vcc - Vf) / IF = (5V - 3.2V) / 0.015A ≈ 120 Ohms.
   • Resistor Power Rating P = (Vcc - Vf) * IF = 1.8V * 0.015A = 0.027W. A standard 1/8W (0.125W) resistor is sufficient.
3. Benefits Realized:
   • Space Saving: One component replaces three.
   • Simplified Assembly: Only one component to insert and solder.
   • Consistent Appearance: The white diffused lens ensures all colors are emitted from the same point with a similar beam pattern, creating a professional look.
   • Flexibility: The microcontroller can easily create additional states like yellow (Red+Green) or cyan (Green+Blue) by activating multiple channels simultaneously.

11. Operating Principle

Light Emitting Diodes (LEDs) are semiconductor devices that emit light when an electric current passes through them. This phenomenon, called electroluminescence, occurs when electrons recombine with electron holes within the device, releasing energy in the form of photons. The color of the emitted light is determined by the energy band gap of the semiconductor material used. In the LTL750RGBHBJH292U, three different semiconductor chips—each engineered with a specific band gap—are housed together to produce red, green, and blue light independently. The white diffused lens over the chips scatters and mixes the light, providing a uniform visual output.

12. Technology Trends

The market for multi-color and RGB LEDs continues to evolve. Key trends influencing components like the LTL750RGBHBJH292U include:

• Increased Efficiency: Ongoing material science and chip design improvements lead to higher luminous efficacy (more light output per watt of electrical input), allowing for brighter indicators at lower power or reduced thermal load.
• Miniaturization: While through-hole packages remain vital for robustness, there is a parallel trend towards smaller surface-mount device (SMD) RGB LEDs for high-density PCB designs.
• Integrated Control: A growing trend is the integration of the LED chips with a miniature controller IC within the same package, creating "smart LEDs" that can be digitally addressed and programmed for complex color sequences without external microcontroller overhead.
• Color Consistency & Binning: Manufacturing processes are continually refined to produce LEDs with tighter parametric distributions, reducing the need for extensive binning and providing more consistent performance straight from production.

Through-hole RGB indicators like this one remain a fundamental and reliable solution for applications where durability, ease of manual assembly, and proven performance are paramount.