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LTW-2S3D8 White LED Datasheet - T-1 3/4 Package - 3.1V Max - 93mW - English Technical Document

Complete technical datasheet for the LTW-2S3D8 through-hole white LED. Includes absolute maximum ratings, electrical/optical characteristics, bin tables, packaging, and application cautions.
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PDF Document Cover - LTW-2S3D8 White LED Datasheet - T-1 3/4 Package - 3.1V Max - 93mW - English Technical Document

1. Product Overview

This document details the specifications for a through-hole white LED, identified by part number LTW-2S3D8. The device is designed as a status indicator component suitable for a wide range of electronic applications. It features a popular T-1 3/4 (approximately 5mm) diameter package with a water-clear lens, constructed using InGaN technology to produce white light.

1.1 Core Advantages and Features

The LED offers several key benefits for design engineers:

1.2 Target Applications and Markets

This LED is targeted at multiple industries requiring reliable status indication. Primary application areas include:

2. In-Depth Technical Parameter Analysis

The following sections provide a detailed breakdown of the device's operational limits and performance characteristics.

2.1 Absolute Maximum Ratings

These ratings define the stress limits beyond which permanent damage to the device may occur. All values are specified at an ambient temperature (TA) of 25°C.

2.2 Electrical and Optical Characteristics

These are the typical performance parameters measured at TA=25°C under standard test conditions.

3. Bin Table Specification System

The LEDs are sorted into bins based on key performance parameters to ensure consistency within a production lot. This allows designers to select parts matching specific requirements.

3.1 Luminous Intensity (Iv) Binning

LEDs are classified into three intensity bins (Z1, Z2, Z3) measured at IF=20mA. A ±15% tolerance applies to each bin limit.

The Iv classification code is marked on each packing bag for traceability.

3.2 Forward Voltage (VF) Binning

LEDs are also binned according to their forward voltage drop at IF=20mA, with six bins (0F to 5F) covering the range from 2.5V to 3.1V. A measurement allowance of ±0.1V is permitted.

3.3 Chromaticity (Hue) Binning

The white light color is defined by chromaticity coordinates (x, y) on the CIE 1931 diagram. The datasheet provides a table of hue ranks (e.g., C0, B4, B6, B3, B5, A0) with specific coordinate quadrilaterals. A measurement allowance of ±0.01 is applied to the coordinates. A visual reference is provided via the CIE 1931 Chromaticity Diagram graphic.

4. Mechanical and Packaging Information

4.1 Outline Dimensions and Tolerances

The LED uses a standard T-1 3/4 radial leaded package. Key dimensional notes include:

4.2 Packaging Specifications

The LEDs are supplied in industry-standard packaging:

5. Application Guidelines and Cautions

Proper handling and application are critical for reliability and performance.

5.1 Storage and Handling

5.2 Assembly and Soldering

5.3 Drive Circuit Design

LEDs are current-operated devices. To ensure uniform brightness when using multiple LEDs:

5.4 Electrostatic Discharge (ESD) Protection

The LED is susceptible to damage from static electricity or power surges. Standard ESD handling precautions must be observed during assembly and handling.

6. Performance Curve Analysis and Design Considerations

While specific graphical curves are referenced in the datasheet (Typical Electrical/Optical Characteristics Curves), their implications are critical for design.

6.1 Interpretation of Typical Curves

Designers should expect curves depicting:

6.2 Thermal Management Considerations

With a maximum power dissipation of 93mW and a required derating of 0.45 mA/°C above 30°C, effective thermal design is essential for maintaining performance and longevity, especially in high ambient temperature environments or when driving the LED near its maximum current.

7. Technical Comparison and Application Notes

7.1 Product Differentiation

This LED's primary differentiators within the through-hole indicator market are its combination of a relatively high luminous intensity (up to 29,000 mcd) with a narrow 15-degree viewing angle, making it suitable for applications requiring a bright, directed beam. The comprehensive binning system for intensity, voltage, and chromaticity provides a high degree of consistency for batch production.

7.2 Typical Application Circuits and Calculations

For a standard 5V supply and targeting the typical forward current of 20mA with a typical VF of 2.8V, the series resistor value (R) can be calculated using Ohm's Law: R = (Vsupply - VF) / IF = (5V - 2.8V) / 0.020A = 110 Ohms. The nearest standard value (e.g., 100 or 120 Ohms) should be selected, and the resistor's power rating must be checked: P = (Vsupply - VF) * IF = 2.2V * 0.02A = 0.044W, so a standard 1/8W (0.125W) resistor is sufficient.

7.3 Frequently Asked Questions (FAQs) Based on Parameters

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.