1. Product Overview
This document details the specifications for a through-hole white LED, identified by part number LTW-2S3D8. The device is designed as a status indicator component suitable for a wide range of electronic applications. It features a popular T-1 3/4 (approximately 5mm) diameter package with a water-clear lens, constructed using InGaN technology to produce white light.
1.1 Core Advantages and Features
The LED offers several key benefits for design engineers:
- Environmental Compliance: The product is lead (Pb) free and compliant with RoHS directives.
- High Efficiency: It provides high luminous output with low power consumption, contributing to energy-efficient designs.
- Design Flexibility: The through-hole form factor allows for versatile mounting on printed circuit boards (PCBs) or panels.
- Ease of Use: It is compatible with integrated circuits (ICs) due to its low current requirement.
- Reliability: The device is designed for high reliability in various operating conditions.
1.2 Target Applications and Markets
This LED is targeted at multiple industries requiring reliable status indication. Primary application areas include:
- Computer peripherals and internal components
- Communication equipment
- Consumer electronics
- Home appliances
- Industrial control systems and instrumentation
2. In-Depth Technical Parameter Analysis
The following sections provide a detailed breakdown of the device's operational limits and performance characteristics.
2.1 Absolute Maximum Ratings
These ratings define the stress limits beyond which permanent damage to the device may occur. All values are specified at an ambient temperature (TA) of 25°C.
- Power Dissipation (Pd): 93 mW maximum.
- Forward Current:
- Continuous DC Forward Current (IF): 30 mA maximum.
- Peak Forward Current: 100 mA maximum, permissible only under pulsed conditions (duty cycle ≤ 1/10, pulse width ≤ 10ms).
- Thermal Derating: The maximum DC forward current must be linearly derated by 0.45 mA for every degree Celsius above 30°C ambient temperature.
- Temperature Ranges:
- Operating Temperature: -40°C to +85°C.
- Storage Temperature: -40°C to +100°C.
- Soldering Temperature: Leads can withstand 260°C for a maximum of 5 seconds, provided the soldering point is at least 2.0mm (0.079\") from the LED body.
2.2 Electrical and Optical Characteristics
These are the typical performance parameters measured at TA=25°C under standard test conditions.
- Luminous Intensity (Iv): Ranges from 13,000 to 29,000 millicandelas (mcd) at a forward current (IF) of 20mA. The typical value is 23,000 mcd. A ±15% testing tolerance is applied to the bin limits.
- Viewing Angle (2θ1/2): 15 degrees. This is the full angle at which the luminous intensity drops to half of its axial (on-center) value, indicating a relatively focused beam.
- Forward Voltage (VF): Ranges from 2.5V to 3.1V at IF=20mA, with a typical value of 2.8V.
- Reverse Current (IR): 10 μA maximum when a reverse voltage (VR) of 5V is applied. Important Note: The device is not designed for operation under reverse bias; this test condition is for characterization only.
- Chromaticity Coordinates (x, y): Derived from the CIE 1931 chromaticity diagram. Specific coordinate bins are defined in a separate table.
3. Bin Table Specification System
The LEDs are sorted into bins based on key performance parameters to ensure consistency within a production lot. This allows designers to select parts matching specific requirements.
3.1 Luminous Intensity (Iv) Binning
LEDs are classified into three intensity bins (Z1, Z2, Z3) measured at IF=20mA. A ±15% tolerance applies to each bin limit.
- Bin Z1: 13,000 mcd (Min) to 17,000 mcd (Max)
- Bin Z2: 17,000 mcd (Min) to 22,000 mcd (Max)
- Bin Z3: 22,000 mcd (Min) to 29,000 mcd (Max)
The Iv classification code is marked on each packing bag for traceability.
3.2 Forward Voltage (VF) Binning
LEDs are also binned according to their forward voltage drop at IF=20mA, with six bins (0F to 5F) covering the range from 2.5V to 3.1V. A measurement allowance of ±0.1V is permitted.
- Bin 0F: 2.50V to 2.60V
- Bin 1F: 2.60V to 2.70V
- ... continues to Bin 5F: 3.00V to 3.10V
3.3 Chromaticity (Hue) Binning
The white light color is defined by chromaticity coordinates (x, y) on the CIE 1931 diagram. The datasheet provides a table of hue ranks (e.g., C0, B4, B6, B3, B5, A0) with specific coordinate quadrilaterals. A measurement allowance of ±0.01 is applied to the coordinates. A visual reference is provided via the CIE 1931 Chromaticity Diagram graphic.
4. Mechanical and Packaging Information
4.1 Outline Dimensions and Tolerances
The LED uses a standard T-1 3/4 radial leaded package. Key dimensional notes include:
- All dimensions are in millimeters (inches provided in parenthesis).
- Standard tolerance is ±0.25mm (0.010\") unless otherwise specified.
- The maximum protrusion of resin under the flange is 1.0mm (0.04\").
- Lead spacing is measured at the point where leads emerge from the package body.
4.2 Packaging Specifications
The LEDs are supplied in industry-standard packaging:
- Basic Unit: 500, 200, or 100 pieces per anti-static packing bag.
- Inner Carton: Contains 10 packing bags (e.g., 5,000 pieces if using 500pc bags).
- Outer Carton (Standard): Contains 8 inner cartons, totaling 40,000 pieces. It is noted that in every shipping lot, only the final pack may be a non-full pack.
5. Application Guidelines and Cautions
Proper handling and application are critical for reliability and performance.
5.1 Storage and Handling
- Storage Environment: Should not exceed 30°C or 70% relative humidity.
- Shelf Life: LEDs removed from original packaging should be used within three months. For longer storage, they should be kept in a sealed container with desiccant or in a nitrogen ambient.
- Cleaning: Use alcohol-based solvents like isopropyl alcohol if necessary.
5.2 Assembly and Soldering
- Lead Forming: Must be done before soldering at normal temperature. Bend leads at a point at least 3mm from the base of the LED lens. Do not use the package base as a fulcrum.
- PCB Assembly: Apply minimum clinch force to avoid mechanical stress.
- Soldering:
- Maintain a minimum 2mm clearance from the lens base to the solder point. Do not immerse the lens in solder.
- Soldering Iron: Max 350°C for max 3 seconds (one time only).
- Wave Soldering: Pre-heat to max 100°C for max 60 seconds. Solder wave at max 260°C for max 5 seconds.
- Critical Warning: Excessive temperature or time can deform the lens or cause catastrophic failure. IR reflow soldering is NOT suitable for this through-hole LED.
5.3 Drive Circuit Design
LEDs are current-operated devices. To ensure uniform brightness when using multiple LEDs:
- Recommended Circuit (Circuit A): Incorporate an individual current-limiting resistor in series with each LED when connecting them in parallel. This compensates for natural variations in the forward voltage (I-V characteristic) of individual LEDs.
- Non-Recommended Practice (Circuit B): Connecting multiple LEDs directly in parallel without individual series resistors is discouraged, as it can lead to significant brightness differences and uneven current sharing.
5.4 Electrostatic Discharge (ESD) Protection
The LED is susceptible to damage from static electricity or power surges. Standard ESD handling precautions must be observed during assembly and handling.
6. Performance Curve Analysis and Design Considerations
While specific graphical curves are referenced in the datasheet (Typical Electrical/Optical Characteristics Curves), their implications are critical for design.
6.1 Interpretation of Typical Curves
Designers should expect curves depicting:
- Relative Luminous Intensity vs. Forward Current: Shows how light output increases with current, typically in a non-linear fashion. Operating above the absolute maximum current rating is prohibited.
- Forward Voltage vs. Forward Current: Illustrates the diode's I-V characteristic. The voltage binning system helps predict this curve's position for a given lot of parts.
- Relative Luminous Intensity vs. Ambient Temperature: Demonstrates the decrease in light output as junction temperature rises, emphasizing the importance of thermal management and current derating.
6.2 Thermal Management Considerations
With a maximum power dissipation of 93mW and a required derating of 0.45 mA/°C above 30°C, effective thermal design is essential for maintaining performance and longevity, especially in high ambient temperature environments or when driving the LED near its maximum current.
7. Technical Comparison and Application Notes
7.1 Product Differentiation
This LED's primary differentiators within the through-hole indicator market are its combination of a relatively high luminous intensity (up to 29,000 mcd) with a narrow 15-degree viewing angle, making it suitable for applications requiring a bright, directed beam. The comprehensive binning system for intensity, voltage, and chromaticity provides a high degree of consistency for batch production.
7.2 Typical Application Circuits and Calculations
For a standard 5V supply and targeting the typical forward current of 20mA with a typical VF of 2.8V, the series resistor value (R) can be calculated using Ohm's Law: R = (Vsupply - VF) / IF = (5V - 2.8V) / 0.020A = 110 Ohms. The nearest standard value (e.g., 100 or 120 Ohms) should be selected, and the resistor's power rating must be checked: P = (Vsupply - VF) * IF = 2.2V * 0.02A = 0.044W, so a standard 1/8W (0.125W) resistor is sufficient.
7.3 Frequently Asked Questions (FAQs) Based on Parameters
- Q: Can I drive this LED at 30mA continuously?
A: Yes, but only if the ambient temperature is at or below 30°C. Above 30°C, the current must be derated per the specification (0.45 mA/°C). At 85°C, the maximum allowable continuous current would be significantly lower. - Q: Why is a series resistor necessary even if my power supply voltage matches the LED's VF?
A: The VF is a nominal value with a range (2.5V-3.1V) and is temperature-dependent. A resistor is required to regulate the current, preventing thermal runaway which could occur if a slight increase in temperature lowers VF, causing current to increase uncontrollably. - Q: What does the \"Water Clear\" lens description imply?
A: It indicates the lens is non-diffused, resulting in a more focused beam pattern as defined by the 15-degree viewing angle, compared to a diffused lens which would create a wider, softer light pattern.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |