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LTW-1GHCX4 White LED Datasheet - 5mm Diameter - 3.1V Typical - 90mW Power - English Technical Document

Complete technical datasheet for the LTW-1GHCX4 through-hole white LED. Includes specifications, ratings, binning tables, application guidelines, and packaging information.
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PDF Document Cover - LTW-1GHCX4 White LED Datasheet - 5mm Diameter - 3.1V Typical - 90mW Power - English Technical Document

1. Product Overview

The LTW-1GHCX4 is a high-brightness, through-hole white LED designed for status indication and illumination in a wide range of electronic applications. It features a standard T-1 (5mm) diameter package with a water-clear lens, offering design flexibility for various mounting configurations on printed circuit boards or panels.

1.1 Core Advantages

1.2 Target Applications

This LED is suitable for numerous sectors including:

2. Technical Parameter Analysis

2.1 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. Operation under these conditions is not guaranteed.

Thermal Derating: The DC forward current must be linearly derated by 0.36 mA for every degree Celsius above 30°C ambient temperature to ensure the power dissipation limit is not exceeded.

2.2 Electrical & Optical Characteristics

These parameters are specified at an ambient temperature (TA) of 25°C and define the typical performance of the device.

3. Binning System Specification

The LEDs are sorted into bins based on key performance parameters to ensure consistency within a production lot. The bin code is marked on each packing bag.

3.1 Luminous Intensity Binning

Bin CodeMinimum Iv (mcd)Maximum Iv (mcd)
V240005600
W256007850
X2785011000

Note: Tolerance on each bin limit is ±15%.

3.2 Forward Voltage Binning

Bin CodeMinimum VF (V)Maximum VF (V)
1E2.72.9
2E2.93.1
3E3.13.3
4E3.33.5

Note: Forward voltage measurement allowance is ±0.1V.

3.3 Hue (Color) Binning

Multiple hue ranks are defined (U91, U01, U20, U22, U31, U32, U41, U42, U51), each specifying a quadrilateral region on the CIE 1931 chromaticity diagram with specific (x, y) coordinate boundaries. This ensures tight control over the color consistency of the white light output. The color coordinates measurement allowance is ±0.01.

4. Performance Curve Analysis

Typical performance curves illustrate the relationship between key parameters. These are essential for circuit design and understanding device behavior under different conditions.

5. Mechanical & Packaging Information

5.1 Outline Dimensions

The LED conforms to the standard T-1 (5mm) radial leaded package.

Polarity Identification: The longer lead denotes the anode (positive), and the shorter lead denotes the cathode (negative). The cathode side may also be indicated by a flat spot on the LED lens flange.

5.2 Packaging Specifications

LEDs are supplied in anti-static packing bags.

6. Soldering & Assembly Guidelines

6.1 Storage

For optimal shelf life, store LEDs in an environment not exceeding 30°C and 70% relative humidity. If removed from the original packaging, use within three months. For extended storage outside original packaging, use a sealed container with desiccant or a nitrogen ambient.

6.2 Lead Forming

6.3 Soldering Process

Critical Rule: Maintain a minimum clearance of 2mm from the base of the lens to the solder point. Do not immerse the lens in solder.

ParameterHand Soldering (Iron)Wave Soldering
Temperature350°C Max.260°C Max. (Solder Wave)
Time3 seconds Max. (one time only)5 seconds Max. (in solder)
Pre-heatN/A100°C Max. for 60 sec Max.
PositionNo closer than 2mm from lens baseNo lower than 2mm from lens base

Warning: Excessive temperature or time can deform the lens or cause catastrophic failure. IR reflow soldering is not suitable for this through-hole LED.

6.4 Cleaning

If necessary, clean only with alcohol-based solvents such as isopropyl alcohol.

7. Application & Design Considerations

7.1 Drive Circuit Design

LEDs are current-operated devices. To ensure uniform brightness when driving multiple LEDs in parallel, a current-limiting resistor must be placed in series with each individual LED (Circuit A). Driving LEDs in parallel without individual resistors (Circuit B) is not recommended, as slight variations in the forward voltage (Vf) characteristic between LEDs will cause significant differences in current sharing and, consequently, brightness.

Circuit A (Recommended): [Vcc] — [Resistor] — [LED] — [GND] (per LED branch).
Circuit B (Not Recommended): [Vcc] — [Single Resistor] — [Multiple LEDs in parallel] — [GND].

7.2 ESD (Electrostatic Discharge) Precautions

Although rated for 1000V ESD, proper handling procedures should be followed. Use grounded workstations and wrist straps when handling these devices to prevent damage from static electricity or power surges.

7.3 Thermal Management

Adhere to the power dissipation (90mW) and derating specifications. In high ambient temperature applications or when driving at high currents, ensure adequate ventilation or heat sinking via the leads to prevent overheating, which reduces light output and lifespan.

8. Frequently Asked Questions (FAQ)

8.1 What is the difference between the Iv values in the characteristics table and the binning table?

The Electrical/Optical Characteristics table (Section 2.2) lists the absolute minimum, typical, and maximum values for the entire product family. The Binning Table (Section 3) shows how manufactured parts are sorted into tighter, more consistent groups (bins) based on tested performance. You select a bin code to guarantee the LEDs you receive fall within a specific, narrower performance range.

8.2 Can I drive this LED without a current-limiting resistor?

No. The forward voltage of an LED has a negative temperature coefficient and is not a fixed value. Connecting it directly to a voltage source will cause uncontrolled current flow, likely exceeding the maximum rating and destroying the device. A series resistor is mandatory for constant-voltage drive.

8.3 Why is maintaining a 2mm gap during soldering so important?

The epoxy lens material has a much higher coefficient of thermal expansion than the metal leads. Applying intense heat too close to the lens can create severe mechanical stress at the lead-epoxy interface, potentially cracking the seal, damaging the internal die bond, or allowing moisture ingress, leading to premature failure.

8.4 How do I interpret the Hue Rank table (U91, U01, etc.)?

Each hue rank (e.g., U31) defines a quadrilateral area on the CIE 1931 color space diagram using four sets of (x, y) coordinates. LEDs are tested, and their measured color coordinates must fall within the boundaries of their assigned hue rank polygon. This ensures all LEDs labeled with the same hue rank emit light of a very similar white color tone.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.