Table of Contents
- 1. Product Overview
- 2. Technical Parameter Deep Dive
- 2.1 Absolute Maximum Ratings
- 2.2 Electrical & Optical Characteristics
- 3. Binning System Specification
- 3.1 Luminous Intensity Binning
- 3.2 Hue (Chromaticity) Binning
- 4. Mechanical & Packaging Information
- 4.1 Outline Dimensions
- 4.2 Packaging Specification
- 5. Soldering & Assembly Guidelines
- 5.1 Lead Forming
- 5.2 Soldering Process
- 5.3 Cleaning
- 6. Storage & Handling
- 7. Drive Circuit Design & Application Notes
- 7.1 Drive Method
- 7.2 Application Scenarios
- 8. Performance Analysis & Design Considerations
- 8.1 Thermal Management
- 8.2 Optical Performance
- 8.3 Reliability & Lifespan Factors
- 9. Frequently Asked Questions (Based on Technical Parameters)
- 10. Design-in Case Study Example
1. Product Overview
This document details the specifications for a high-brightness, 5mm oval through-hole white LED lamp. Designed primarily for outdoor applications, this component offers a robust solution for signage and signaling where visibility and reliability are paramount. The lamp utilizes InGaN technology encapsulated in an advanced epoxy resin, providing enhanced moisture resistance and UV protection to ensure long-term performance in demanding environmental conditions.
The core advantages of this LED include its compliance with RoHS directives, low power consumption, high luminous efficiency, and compatibility with standard printed circuit board (PCB) mounting techniques. Its design is tailored for applications requiring consistent, bright white illumination with a specific radiation pattern.
2. Technical Parameter Deep Dive
2.1 Absolute Maximum Ratings
The device is characterized under specific maximum operational limits to ensure reliability. At an ambient temperature (TA) of 25°C, the absolute maximum ratings are as follows:
- Power Dissipation (Pd): 96 mW. This is the maximum power the LED can safely dissipate as heat.
- Peak Forward Current (IFP): 100 mA. This current is permissible only under pulsed conditions with a duty cycle ≤ 1/10 and a pulse width ≤ 10ms.
- Continuous Forward Current (IF): 30 mA. This is the maximum recommended DC current for continuous operation.
- Derating Factor: The DC forward current must be linearly derated by 0.56 mA for every degree Celsius above 47°C ambient temperature.
- Operating Temperature Range (Topr): -40°C to +85°C.
- Storage Temperature Range (Tstg): -40°C to +100°C.
- Lead Soldering Temperature: 260°C maximum for 5 seconds, measured at a point 2.0mm (0.079 inches) from the LED body.
2.2 Electrical & Optical Characteristics
The key performance parameters are measured at TA=25°C and a standard test current (IF) of 20mA.
- Luminous Intensity (Iv): Ranges from a minimum of 4200 mcd to a maximum of 9300 mcd, with a typical value of 6000 mcd. The Iv value is classified into bins (see Section 4). Measurement includes a ±15% testing tolerance.
- Viewing Angle (2θ1/2): 70 degrees (major axis) / 35 degrees (minor axis). This oval radiation pattern is suitable for applications requiring directed light.
- Forward Voltage (VF): Typically 2.9V, with a range from 2.5V (Min) to 3.2V (Max) at IF=20mA.
- Reverse Current (IR): 10 μA maximum when a reverse voltage (VR) of 5V is applied. The device is not designed for operation in reverse bias.
- Chromaticity Coordinates (x, y): Defined on the CIE 1931 chromaticity diagram. Typical values are x=0.31 and y=0.32. Specific hue ranks are defined in the bin table.
3. Binning System Specification
To ensure color and brightness consistency in production, the LEDs are sorted into bins based on luminous intensity and chromaticity coordinates.
3.1 Luminous Intensity Binning
LEDs are classified into three intensity bins (V, W, X) at IF=20mA. The bin limits have a ±15% tolerance.
- Bin V: 4200 mcd (Min) to 5500 mcd (Max)
- Bin W: 5500 mcd (Min) to 7200 mcd (Max)
- Bin X: 7200 mcd (Min) to 9300 mcd (Max)
The specific bin code is marked on each packing bag for traceability.
3.2 Hue (Chromaticity) Binning
LEDs are also sorted by their chromaticity coordinates (x, y) on the CIE diagram. The datasheet provides specific coordinate boundaries for hue ranks A0, B1, and B2. A measurement allowance of ±0.01 is applied to these coordinates. A visual reference is provided by the CIE 1931 Chromaticity Diagram included in the document, which shows the typical white region and the defined bins.
4. Mechanical & Packaging Information
4.1 Outline Dimensions
The LED features a standard 5mm oval lens package designed for through-hole mounting. Key dimensional notes include:
- All dimensions are in millimeters (inches).
- Standard tolerance is ±0.25mm (0.010") unless otherwise specified.
- The maximum protrusion of resin under the flange is 1.0mm (0.04").
- Lead spacing is measured at the point where the leads emerge from the package body.
4.2 Packaging Specification
The LEDs are supplied in a tiered packaging system:
- Basic Unit: 500, 200, or 100 pieces per anti-static packing bag.
- Inner Carton: Contains 10 packing bags, totaling 5,000 pieces.
- Outer Carton (Shipping Box): Contains 8 inner cartons, totaling 40,000 pieces. It is noted that in every shipping lot, only the final pack may be a non-full pack.
5. Soldering & Assembly Guidelines
Proper handling is critical to prevent damage and ensure long-term reliability.
5.1 Lead Forming
If leads require bending, this must be done before soldering and at room temperature. The bend should be made at a point at least 3mm from the base of the LED lens. The base of the lead frame must not be used as a fulcrum during bending.
5.2 Soldering Process
A minimum clearance of 2mm must be maintained between the base of the lens and the solder point. The lens must never be dipped into solder.
- Soldering Iron: Maximum temperature 350°C. Maximum soldering time 3 seconds per lead. This should be performed only once.
- Wave Soldering: Pre-heat to a maximum of 100°C for up to 60 seconds. Solder wave temperature maximum 260°C. Soldering time maximum 5 seconds. The dipping position must be no lower than 2mm from the base of the epoxy lens.
- Important: Infrared (IR) reflow soldering is not suitable for this through-hole LED product. Excessive temperature or time can cause lens deformation or catastrophic failure.
5.3 Cleaning
If cleaning is necessary, only alcohol-based solvents such as isopropyl alcohol should be used.
6. Storage & Handling
- Storage Environment: Should not exceed 30°C and 70% relative humidity.
- Shelf Life: LEDs removed from their original packaging should be used within three months. For longer storage outside the original pack, they should be kept in a sealed container with desiccant or in a nitrogen-purged desiccator.
- ESD Protection: LEDs are sensitive to electrostatic discharge (ESD). Handling precautions include using grounded wrist straps, anti-static gloves, ensuring all equipment and work surfaces are properly grounded, and using ion blowers to neutralize static charge on the lens.
7. Drive Circuit Design & Application Notes
7.1 Drive Method
An LED is a current-operated device. To ensure uniform brightness when using multiple LEDs, especially in parallel configurations, it is strongly recommended to use a current-limiting resistor in series with each individual LED (Circuit A).
A simple parallel connection without individual resistors (Circuit B) is not recommended, as slight variations in the forward voltage (VF) characteristics between LEDs will cause significant differences in current sharing and, consequently, perceived brightness.
7.2 Application Scenarios
This LED is well-suited for a variety of outdoor and indoor signage applications due to its high brightness, specific viewing angle, and environmental robustness. Primary applications include:
- Message Signs: For displaying dynamic or static information.
- Bus Signs: For destination or route number displays.
- Traffic Signs: For informational or regulatory signage.
- Traffic Signals: As an indicator light source, subject to appropriate optical design and regulatory approval.
8. Performance Analysis & Design Considerations
8.1 Thermal Management
With a maximum power dissipation of 96 mW and a derating factor of 0.56 mA/°C above 47°C, effective thermal management is crucial for maintaining LED lifespan and light output. Designers must consider the operating ambient temperature and ensure the forward current is appropriately derated. Adequate spacing on the PCB and avoiding enclosed spaces can help dissipate heat.
8.2 Optical Performance
The 70°/35° oval viewing angle creates a specific radiation pattern. This is advantageous for applications where light needs to be directed toward a viewer within a horizontal band (wider 70° axis) while controlling vertical spread (narrower 35° axis), improving efficiency for panel-type signs. The high luminous intensity (up to 9300 mcd) ensures good visibility even in brightly lit outdoor conditions.
8.3 Reliability & Lifespan Factors
The use of advanced epoxy with UV protection and moisture resistance is a key factor for outdoor reliability. Adherence to the specified soldering conditions and storage guidelines is essential to prevent premature failure mechanisms such as delamination, yellowing of the lens, or solder joint fatigue.
9. Frequently Asked Questions (Based on Technical Parameters)
Q: Can I drive this LED at 30mA continuously?
A: Yes, 30mA is the maximum rated continuous DC forward current. However, for optimal lifespan and reliability, especially at higher ambient temperatures, operating at or below the typical 20mA test current is advisable, and the current must be derated above 47°C ambient.
Q: Why is a series resistor necessary for each LED in parallel?
A: The forward voltage (VF) of LEDs has a manufacturing tolerance (2.5V to 3.2V). In a direct parallel connection, the LED with the lowest VF will draw disproportionately more current, leading to uneven brightness and potential overstress of that LED. A series resistor for each LED helps to ballast the current, ensuring more uniform brightness and protecting the devices.
Q: What does the bin code on the bag mean?
A: The bin code indicates the luminous intensity range (V, W, or X) of the LEDs in that bag. For consistent brightness in an assembly, it is important to use LEDs from the same or adjacent intensity bins.
Q: Is this LED suitable for automotive applications?
A: While it shares some characteristics (brightness, package), this datasheet specifies applications for signage and signals. Automotive applications typically require compliance with additional standards (e.g., AEC-Q102 for reliability) and specific temperature ranges which are not explicitly stated here. It should not be assumed suitable for automotive use without further qualification.
10. Design-in Case Study Example
Scenario: Designing a low-power, single-line text display for a bus destination sign.
Design Choices:
1. LED Selection: This 5mm oval LED is chosen for its high brightness (ensuring daytime visibility) and oval beam pattern (good for horizontal character formation). LEDs from Bin W are selected for consistent medium-high brightness.
2. Circuit Design: The sign controller provides a stable voltage rail (e.g., 12V). Each LED in the matrix is driven with its own current-limiting resistor calculated as R = (V_supply - VF_LED) / I_desired. Using a typical VF of 2.9V and a desired current of 18mA (conservative for longer life), R = (12V - 2.9V) / 0.018A ≈ 506 Ohms. A standard 510 Ohm resistor is used.
3. Layout & Assembly: LEDs are placed on a PCB with holes spaced according to the datasheet's lead spacing. During assembly, a custom lead-bending jig is used to ensure all leads are bent uniformly at the recommended >3mm point before insertion. Wave soldering is performed using the specified profile (260°C, 5s max).
4. Result: The final sign exhibits uniform, bright illumination with reliable performance across the vehicle's operating temperature range, meeting the design requirements for clarity and durability.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |