Table of Contents
- 1. Product Overview
- 1.1 Core Advantages
- 1.2 Target Markets
- 2. In-Depth Technical Parameter Analysis
- 2.1 Absolute Maximum Ratings
- 2.2 Electrical & Optical Characteristics
- 3. Binning System Specification
- 3.1 Luminous Intensity Binning
- 3.2 Forward Voltage Binning
- 3.3 Hue (Chromaticity) Binning
- 4. Performance Curve Analysis
- 4.1 Forward Current vs. Forward Voltage (I-V Curve)
- 4.2 Luminous Intensity vs. Forward Current
- 4.3 Temperature Dependence
- 5. Mechanical & Package Information
- 5.1 Outline Dimensions
- 5.2 Polarity Identification
- 6. Soldering & Assembly Guidelines
- 6.1 Storage
- 6.2 Lead Forming
- 6.3 Soldering Process
- 6.4 Cleaning
- 7. Packaging & Ordering Information
- 7.1 Packaging Specification
- 8. Application Design Recommendations
- 8.1 Drive Circuit Design
- 8.2 Electrostatic Discharge (ESD) Protection
- 8.3 Thermal Management
- 9. Technical Comparison & Differentiation
- 10. Frequently Asked Questions (FAQ)
- 10.1 Can I drive this LED without a series resistor?
- 10.2 Why is there a ±15% tolerance on the luminous intensity bin limits?
- 10.3 Can I use this LED for outdoor applications?
- 10.4 What does the \"U22\" or \"V1\" code on the bag mean?
- 11. Practical Design Case Study
- 12. Operational Principle
- 13. Technology Trends
- LED Specification Terminology
- Photoelectric Performance
- Electrical Parameters
- Thermal Management & Reliability
- Packaging & Materials
- Quality Control & Binning
- Testing & Certification
1. Product Overview
The LTW-42FDV6J is a high-efficiency, through-hole white LED designed for status indication and illumination in a wide range of electronic applications. It features a standard T-1 (5mm) diameter package with a diffuse lens, providing a wide viewing angle and uniform light output. This component is RoHS compliant, ensuring environmental safety and compatibility with modern manufacturing standards.
1.1 Core Advantages
- Lead-Free & RoHS Compliant: Manufactured without hazardous substances, meeting international environmental regulations.
- High Efficiency & Low Power Consumption: Delivers high luminous intensity with minimal electrical input, contributing to energy-efficient designs.
- Versatile Mounting: Suitable for both printed circuit board (PCB) and panel mounting, offering design flexibility.
- IC Compatibility: Operates at low current levels, making it directly compatible with most integrated circuit outputs without requiring complex driver stages.
- Standard Package: The popular 5mm form factor ensures easy integration and replacement in existing designs.
1.2 Target Markets
This LED is engineered for broad applicability across multiple industries, including but not limited to:
- Computer Systems: Power, hard drive, and network status indicators.
- Communication Equipment: Signal strength, link activity, and mode indicators in routers, switches, and modems.
- Consumer Electronics: Backlighting for buttons, power indicators in appliances, and decorative lighting.
- Home Appliances: Operational status lights on microwaves, washing machines, and air conditioners.
- Industrial Controls: Machine status, fault indicators, and panel illumination in control systems.
2. In-Depth Technical Parameter Analysis
This section provides a detailed breakdown of the LED's electrical, optical, and thermal characteristics, which are critical for reliable circuit design and performance prediction.
2.1 Absolute Maximum Ratings
These ratings define the limits beyond which permanent damage to the device may occur. Operation under these conditions is not guaranteed.
- Power Dissipation (Pd): 90 mW. This is the maximum amount of power the LED can dissipate as heat.
- Peak Forward Current (IF(PEAK)): 100 mA. Permissible only under pulsed conditions (duty cycle ≤ 1/10, pulse width ≤ 10ms).
- Continuous Forward Current (IF): 30 mA DC. The standard operating current.
- Derating Factor: 0.39 mA/°C above 30°C. The maximum allowable continuous current decreases linearly as ambient temperature increases.
- Operating Temperature Range (Topr): -40°C to +85°C.
- Storage Temperature Range (Tstg): -40°C to +100°C.
- Lead Soldering Temperature: 260°C for a maximum of 5 seconds, measured 2.0mm from the LED body.
2.2 Electrical & Optical Characteristics
Measured at an ambient temperature (TA) of 25°C and a forward current (IF) of 20mA, unless otherwise specified.
- Luminous Intensity (IV): 2500 - 8500 mcd (Typical: 4800 mcd). The light output is measured using a sensor filtered to match the human eye's photopic response (CIE curve). A ±15% testing tolerance is applied to guarantee limits.
- Viewing Angle (2θ1/2): 60 degrees (typical). This is the full angle at which the light intensity drops to half of its peak axial value.
- Chromaticity Coordinates (x, y): Typical values are x=0.29, y=0.28, placing the white point within a specific region on the CIE 1931 chromaticity diagram. Actual bins are defined in Section 6.
- Forward Voltage (VF): 2.8V - 3.6V (Typical: 3.0V). The voltage drop across the LED when conducting 20mA.
- Reverse Current (IR): 10 μA maximum at a reverse voltage (VR) of 5V. Important: This device is not designed for operation under reverse bias; this parameter is for test purposes only.
3. Binning System Specification
To ensure consistency in mass production, LEDs are sorted into bins based on key performance parameters. The LTW-42FDV6J uses a three-dimensional binning system.
3.1 Luminous Intensity Binning
LEDs are classified by their light output at IF=20mA. The bin code is marked on the packaging.
- U1: 2500 - 4500 mcd
- V1: 4500 - 6500 mcd
- W1: 6500 - 8500 mcd
Tolerance on each bin limit is ±15%.
3.2 Forward Voltage Binning
LEDs are sorted by their forward voltage drop at IF=20mA.
- 3E: 2.8V - 3.0V
- 4E: 3.0V - 3.2V
- 5E: 3.2V - 3.4V
- 6E: 3.4V - 3.6V
Forward voltage measurement allowance is ±0.1V.
3.3 Hue (Chromaticity) Binning
LEDs are categorized into specific regions on the CIE chromaticity diagram to control color consistency. Five hue ranks are defined (U22, U31, U32, U41, U42), each specifying a quadrilateral area of acceptable (x, y) coordinates. The typical coordinates (x=0.29, y=0.28) fall within these defined regions. The measurement allowance for color coordinates is ±0.01.
4. Performance Curve Analysis
While specific graphical curves are not detailed in the provided text, typical performance trends for such LEDs can be inferred and are crucial for design.
4.1 Forward Current vs. Forward Voltage (I-V Curve)
The relationship is exponential, typical of a diode. At the recommended 20mA operating point, the forward voltage is typically 3.0V but can vary between 2.8V and 3.6V as per the binning table. This variance necessitates the use of current-limiting resistors in series with each LED when connected in parallel to a voltage source to ensure uniform brightness.
4.2 Luminous Intensity vs. Forward Current
Light output is approximately proportional to forward current within the operating range. Operating above the absolute maximum ratings will not yield proportional increases and risks device failure.
4.3 Temperature Dependence
Luminous intensity typically decreases as the junction temperature increases. The derating factor of 0.39 mA/°C above 30°C for the forward current is implemented to manage junction temperature and maintain reliability. High-temperature operation will reduce light output and long-term lifespan.
5. Mechanical & Package Information
5.1 Outline Dimensions
The LED conforms to the standard T-1 (5mm) round through-hole package. Key dimensional notes include:
- All dimensions are in millimeters (inches provided in tolerance).
- Standard tolerance is ±0.25mm (±0.010\") unless otherwise specified.
- Maximum protrusion of resin under the flange is 1.0mm (0.04\").
- Lead spacing is measured at the point where leads emerge from the package body.
5.2 Polarity Identification
Through-hole LEDs typically have a longer anode (+) lead and a shorter cathode (-) lead. Additionally, the cathode side often has a flat spot on the plastic lens flange. Correct polarity must be observed during assembly.
6. Soldering & Assembly Guidelines
Proper handling is essential to prevent damage during manufacturing.
6.1 Storage
For long-term storage, maintain an environment not exceeding 30°C and 70% relative humidity. LEDs removed from their original moisture-barrier bags should be used within three months. For extended storage outside original packaging, use a sealed container with desiccant or a nitrogen-filled desiccator.
6.2 Lead Forming
Bend leads at a point at least 3mm away from the base of the LED lens. Do not use the lens base as a fulcrum. Lead forming must be completed before soldering and at room temperature. Apply minimal clinch force during PCB insertion to avoid mechanical stress.
6.3 Soldering Process
Critical Rule: Maintain a minimum distance of 2mm between the solder point and the base of the epoxy lens. Do not immerse the lens in solder.
- Hand Soldering (Iron): Maximum temperature 350°C for no more than 3 seconds per lead. Solder only once.
- Wave Soldering: Pre-heat to a maximum of 100°C for up to 60 seconds. Solder wave temperature should not exceed 260°C for a maximum of 5 seconds.
Warning: Excessive temperature or time will deform the lens or cause catastrophic failure. Infrared (IR) reflow soldering is not suitable for this through-hole LED product.
6.4 Cleaning
If necessary, clean only with alcohol-based solvents such as isopropyl alcohol (IPA).
7. Packaging & Ordering Information
7.1 Packaging Specification
The product is packed in anti-static bags with the bin code marked. Standard packing quantities are:
- 1000, 500, 200, or 100 pieces per packing bag.
- 10 packing bags per inner carton (total 10,000 pcs).
- 8 inner cartons per master outer carton (total 80,000 pcs).
The last pack in a shipping lot may be a non-full pack.
8. Application Design Recommendations
8.1 Drive Circuit Design
An LED is a current-driven device. To ensure uniform brightness, especially when multiple LEDs are connected in parallel, a series current-limiting resistor must be used for each LED. Connecting LEDs directly in parallel to a voltage source (without individual resistors) is not recommended, as small variances in forward voltage (VF) will cause significant differences in current distribution and, consequently, brightness (as illustrated by Circuit B in the datasheet). The recommended circuit (Circuit A) uses a voltage source (VCC), a series resistor (RS), and the LED.
The resistor value can be calculated using Ohm's Law: RS = (VCC - VF) / IF, where VF and IF are the desired LED forward voltage and current. Use the maximum VF from the bin table for a conservative design to ensure the current does not exceed limits even with a low-VF LED.
8.2 Electrostatic Discharge (ESD) Protection
LEDs are sensitive to electrostatic discharge. Standard ESD precautions should be followed during handling and assembly: use grounded workstations, wrist straps, and conductive containers. Avoid touching the LED leads directly.
8.3 Thermal Management
Although power dissipation is low (90mW max), maintaining the LED within its operating temperature range is vital for longevity and stable light output. Ensure adequate airflow in the end application and adhere to the current derating guidelines for elevated ambient temperatures.
9. Technical Comparison & Differentiation
The LTW-42FDV6J positions itself as a general-purpose, high-reliability through-hole LED. Its key differentiators include a robust binning system for luminous intensity, voltage, and color, which allows designers to select parts tailored to their consistency requirements. The wide 60-degree viewing angle with a diffuse lens is ideal for applications requiring broad visibility rather than a focused beam. Its compliance with stringent soldering temperature profiles (260°C for 5s) indicates a package robust enough for standard wave soldering processes.
10. Frequently Asked Questions (FAQ)
10.1 Can I drive this LED without a series resistor?
No. Operating an LED directly from a voltage source is highly discouraged and will likely destroy the device due to uncontrolled current flow. A series resistor is mandatory for current regulation.
10.2 Why is there a ±15% tolerance on the luminous intensity bin limits?
This tolerance accounts for measurement system inaccuracies during production testing. It ensures that any LED falling within the tested bin range will meet the guaranteed minimum intensity when measured under standard conditions.
10.3 Can I use this LED for outdoor applications?
The datasheet states it is suitable for indoor and outdoor signs. However, for harsh outdoor environments, additional design considerations are necessary, such as conformal coating on the PCB to protect against moisture and UV-resistant lens materials (if the standard epoxy is not sufficient). The operating temperature range of -40°C to +85°C supports most outdoor conditions.
10.4 What does the \"U22\" or \"V1\" code on the bag mean?
This is the bin code. It tells you the performance group of the LEDs inside. For example, \"V1\" indicates luminous intensity between 4500 and 6500 mcd. You would cross-reference this with the bin tables (Section 3) to know the exact electrical and optical characteristics of that batch.
11. Practical Design Case Study
Scenario: Designing a control panel with 10 status indicators powered from a 5V rail. Uniform brightness is critical.
Design Steps:
- Choose Operating Point: Select IF = 20mA (standard test condition).
- Determine Worst-Case VF: For a conservative design, use the maximum VF from the widest bin, 6E: VF(max) = 3.6V.
- Calculate Series Resistor: RS = (VCC - VF(max)) / IF = (5V - 3.6V) / 0.020A = 70 Ohms. The nearest standard value is 68 Ohms or 75 Ohms.
- Recalculate Actual Current with 68Ω: Using typical VF of 3.0V, IF = (5V - 3.0V) / 68Ω ≈ 29.4mA, which is within the 30mA maximum. Using minimum VF of 2.8V gives IF ≈ 32.4mA, slightly over but acceptable for short periods given the peak rating. A 75Ω resistor would be safer for long-term reliability: IF (with VF=3.0V) ≈ 26.7mA.
- Implement Circuit: Use one 75Ω resistor in series with each of the 10 LEDs, all connected between the 5V rail and ground.
- Layout Consideration: Place the resistors close to the LED anodes on the PCB. Ensure the 2mm minimum solder-to-lens clearance is maintained in the footprint design.
12. Operational Principle
The LTW-42FDV6J is a semiconductor light source. It is based on an InGaN (Indium Gallium Nitride) chip that emits blue light when electrical current passes through it in the forward direction. This blue light then excites a phosphor coating inside the epoxy lens. The phosphor absorbs a portion of the blue light and re-emits it as yellow light. The combination of the remaining blue light and the emitted yellow light is perceived by the human eye as white light. The diffuse lens scatters this light, creating the wide 60-degree viewing angle.
13. Technology Trends
While through-hole LEDs like the LTW-42FDV6J remain vital for prototyping, repair, and certain industrial applications, the broader industry trend is moving towards surface-mount device (SMD) LEDs. SMD packages offer significant advantages in automated assembly, board space savings, and thermal management. However, through-hole components provide superior mechanical strength in high-vibration environments and are easier to manually solder and replace, ensuring their continued relevance in specific market segments, educational kits, and legacy system maintenance. Advances in phosphor technology and chip efficiency continue to improve the luminous efficacy and color rendering index (CRI) of white LEDs across all package types.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |