P-LCC-2 Blue LED Datasheet - Package 3.2x2.8x1.9mm - Forward Voltage 2.7-3.5V - Luminous Intensity up to 285mcd - English Technical Document

1. Product Overview

This document details the specifications for a surface-mount device (SMD) LED in a P-LCC-2 package. The primary function of this component is as an optical indicator or backlight source. Its core advantages stem from its compact white package with a colorless clear window, which facilitates a wide viewing angle of 120 degrees. This design, featuring an optimized inter-reflector for light coupling, makes it particularly suitable for light guide and light pipe applications. The target markets include telecommunications equipment (for indicators in phones/fax machines), consumer electronics for LCD backlighting, switch illumination, and general-purpose indicator use where reliable, consistent light output is required.

2. Technical Parameter Deep Dive

2.1 Absolute Maximum Ratings

The device is designed to operate reliably within the following absolute limits, beyond which permanent damage may occur. The maximum reverse voltage (V_R) is 5V. The continuous forward current (I_F) must not exceed 25mA, while a peak forward current (I_FP) of 100mA is permissible under pulsed conditions (duty cycle 1/10 at 1kHz). The maximum power dissipation (P_d) is 95mW. The component can withstand an electrostatic discharge (ESD) of 2000V per the Human Body Model (HBM). Its operational temperature range (T_opr) is from -40°C to +85°C, and it can be stored (T_stg) between -40°C and +90°C. Soldering temperature limits are defined for reflow (260°C for 10 seconds) and hand soldering (350°C for 3 seconds).

2.2 Electro-Optical Characteristics

These parameters are measured at a standard test condition of I_F = 20mA and an ambient temperature (T_a) of 25°C. The luminous intensity (I_V) has a typical range, with a minimum of 90 millicandelas (mcd) and a maximum of 285 mcd, as defined by the binning system. The dominant wavelength (λ_d) for the blue variant is specified between 464 nm and 472 nm, with a typical peak wavelength (λ_p) around 468 nm. The spectral bandwidth (Δλ) is typically 25 nm. The forward voltage (V_F) required to drive the LED at 20mA ranges from a minimum of 2.70V to a maximum of 3.50V. Tolerances are noted: ±11% for luminous intensity, ±0.1V for forward voltage, and ±1nm for peak wavelength.

3. Binning System Explanation

To ensure consistency in production, LEDs are sorted into bins based on key performance parameters.

3.1 Luminous Intensity Binning

The luminous output is categorized into five bins (Q2, R1, R2, S1, S2), with minimum values ranging from 90 mcd (Q2) to 225 mcd (S2) and maximum values from 112 mcd (Q2) to 285 mcd (S2), all measured at I_F=20mA.

3.2 Dominant Wavelength Binning

The blue color (Group F) is further divided into four wavelength bins: AA1 (464-466 nm), AA2 (466-468 nm), AA3 (468-470 nm), and AA4 (470-472 nm). This allows designers to select LEDs with very specific color points.

3.3 Forward Voltage Binning

The forward voltage is binned into four groups (10, 11, 12, 13) within the overall 2.70V to 3.50V range, with each bin covering a 0.2V span (e.g., Bin 10: 2.70-2.90V). This is crucial for designing efficient current-limiting circuits and ensuring uniform brightness in multi-LED arrays.

4. Performance Curve Analysis

The datasheet provides several characteristic curves that illustrate device behavior under varying conditions.

4.1 Relative Luminous Intensity vs. Forward Current

This curve shows that light output increases with forward current but not linearly. It helps designers understand the efficiency trade-off when driving the LED above or below the standard 20mA.

4.2 Relative Luminous Intensity vs. Ambient Temperature

The luminous intensity decreases as the ambient temperature rises. The curve is essential for applications operating in high-temperature environments, as it indicates the necessary derating to maintain performance and longevity.

4.3 Forward Current Derating Curve

This graph defines the maximum allowable continuous forward current as a function of ambient temperature. To prevent overheating and ensure reliability, the current must be reduced when operating above 25°C.

4.4 Forward Current vs. Forward Voltage

The IV curve depicts the exponential relationship between current and voltage, which is fundamental for selecting the appropriate driver topology (constant current vs. resistor-based).

4.5 Spectrum Distribution

The spectral plot confirms the monochromatic blue light output centered around 468 nm with a defined bandwidth, important for color-sensitive applications.

4.6 Radiation Diagram

This polar plot visually confirms the wide, Lambertian-like emission pattern with a 120° viewing angle, showing how light intensity distributes spatially.

5. Mechanical and Packaging Information

5.1 Package Dimensions

The P-LCC-2 package has a compact footprint. Key dimensions include a body size of approximately 3.2mm in length and 2.8mm in width, with a height of 1.9mm. The cathode is identified by a notch or a green marking on the package. Detailed drawings specify pad layout recommendations for PCB design, including land pattern and solder mask definitions, with standard tolerances of ±0.1mm unless otherwise noted.

5.2 Reel and Tape Dimensions

The component is supplied on 8mm carrier tape for automated pick-and-place assembly. The reel dimensions and tape pocket specifications are provided to ensure compatibility with standard SMT equipment. Each reel contains 2000 pieces.

6. Soldering and Assembly Guidelines

The LED is compatible with vapor-phase reflow, infrared reflow, and wave soldering processes. The critical parameter for reflow soldering is a peak temperature of 260°C for a maximum of 10 seconds. For hand soldering, the iron tip temperature should not exceed 350°C, and contact time should be limited to 3 seconds per pad. It is crucial to avoid mechanical stress on the package during and after soldering. The device is rated as Pb-free and RoHS compliant.

7. Packaging and Ordering Information

The LEDs are packaged in moisture-resistant barrier bags with desiccant to protect them from humidity during storage and transport, as they are moisture-sensitive devices (MSD). The product label on the reel includes codes for Luminous Intensity Rank (CAT), Dominant Wavelength Rank (HUE), and Forward Voltage Rank (REF), which correspond directly to the binning information. The part number 67-11/BHC-FQ2S1F/2T encodes these bin selections (e.g., F for wavelength group, Q2/S1 for intensity, etc.).

8. Application Suggestions

8.1 Typical Application Scenarios

• Status Indicators: Ideal for power, connectivity, or function status lights in consumer electronics, telecom devices, and industrial panels.
• Backlighting: Suitable for edge-lit or direct-lit backlighting of small LCD displays, keypad symbols, or membrane switches.
• Light Guides/Pipes: The wide viewing angle and clear package make it an excellent point source for plastic light pipes that channel light to a front panel.
• General Illumination: Can be used in arrays for low-level decorative or functional lighting.

8.2 Design Considerations

• Current Limiting: Always use a series resistor or constant-current driver to set the forward current. Calculate the resistor value based on the supply voltage and the maximum V_F from the bin (e.g., 3.5V) to ensure current never exceeds 25mA under worst-case conditions.
• Thermal Management: For continuous operation at high ambient temperatures or near maximum current, consider PCB thermal relief and avoid placing other heat sources nearby. Adhere to the current derating curve.
• Optical Design: Leverage the 120° viewing angle. For light pipe applications, ensure the pipe material and geometry are designed to efficiently capture and transmit this wide emission pattern.
• ESD Protection: While the device has built-in ESD protection (2000V HBM), implementing standard ESD precautions during handling and assembly is still recommended.

9. Technical Comparison

Compared to older LED packages like 5mm through-hole types, this P-LCC-2 SMD LED offers significant advantages: a much smaller footprint enabling higher-density designs, compatibility with fully automated assembly reducing cost, and a lower profile for slimmer end products. Its wide viewing angle is a key differentiator against narrower-angle SMD LEDs, making it superior for applications requiring visibility from off-axis angles without secondary optics. The defined binning structure provides tighter performance control than unbinned LEDs, ensuring color and brightness consistency in production runs.

10. Frequently Asked Questions (Based on Technical Parameters)

Q: Can I drive this LED directly from a 5V supply?
A: No. The forward voltage is only 2.7-3.5V. Connecting it directly to 5V would cause excessive current, destroying the LED. You must use a current-limiting resistor. For example, with a 5V supply and a typical V_F of 3.2V, targeting I_F=20mA requires a resistor of (5V - 3.2V) / 0.02A = 90Ω.

Q: Why is there such a wide range in luminous intensity (90 to 285 mcd)?
A> This range represents the total spread across all production bins. By specifying a specific bin (e.g., S1: 180-225 mcd) when ordering, you can guarantee LEDs within a much tighter brightness range for your application.

Q: Is a heat sink required?
A> For operation at 20mA or below within the specified temperature range, a dedicated heat sink is typically not required for a single LED. However, thermal management via the PCB copper pads becomes important for arrays or operation at elevated ambient temperatures.

Q: How do I identify the cathode?
A> The cathode is marked on the package. Refer to the package dimension drawing which shows the identification feature (typically a green dot or a notch on the cathode side).

11. Practical Use Case

Scenario: Designing a status indicator panel for a network router. The panel has four icons (Power, Internet, Wi-Fi, Ethernet) that need to be illuminated from behind using light pipes. The designer selects this P-LCC-2 blue LED. They choose bin S1 for intensity to ensure adequate brightness and bin AA2 for wavelength to get a consistent blue hue. On the PCB, four LEDs are placed directly under the entry points of the molded light pipes. A constant current of 18mA is chosen (slightly below the 20mA max for margin) using a simple resistor calculation based on the 3.3V system rail and the maximum V_F from the selected voltage bin. The wide 120° viewing angle ensures efficient coupling of light into the light pipe, providing even illumination across the icon with good off-axis visibility. The SMD package allows for a compact PCB layout and automated assembly.

12. Principle Introduction

This LED is based on a semiconductor chip made from Indium Gallium Nitride (InGaN). When a forward voltage exceeding the diode's threshold is applied, electrons and holes recombine within the active region of the semiconductor material. This recombination process releases energy in the form of photons (light). The specific composition of the InGaN alloy determines the bandgap energy, which directly corresponds to the wavelength (color) of the emitted light—in this case, blue. The light generated in the chip is then extracted through the package. The colorless clear epoxy resin acts as a lens, and the internal reflector structure (mentioned as \"inter reflector\") helps direct more of the internally generated light out of the top of the package, enhancing efficiency and creating the wide viewing angle.

13. Development Trends

The trend in indicator LEDs like this one continues towards higher efficiency (more light output per mA of current), which reduces power consumption and heat generation. Package sizes are also shrinking further, enabling even more miniaturized electronics. There is a growing emphasis on tighter binning and better color consistency to meet the demands of applications like consumer electronics where uniform appearance is critical. Furthermore, integration of drive electronics or protection features directly into the LED package is an ongoing area of development to simplify circuit design for end users. The underlying InGaN technology for blue LEDs is mature but continues to be refined for improved reliability and performance at extreme temperatures.