Top View LED 67-21 Series Technical Data Sheet - Package 2.0x1.25x1.1mm - Forward Voltage 1.75-2.35V - Brilliant Red - 60mW - English

1. Product Overview

The 67-21 series represents a family of surface-mount, top-view LEDs housed in a compact P-LCC-2 package. This device is characterized by its white package body and a colorless clear window, which contributes to its function as an efficient optical indicator. A key design feature is the wide viewing angle, achieved through the package geometry and an integrated inter-reflector. This design optimizes light coupling, making the LED particularly suitable for applications utilizing light pipes to guide illumination. The device operates at low current, enhancing its appeal for power-sensitive applications such as portable electronics. It is compliant with lead-free (Pb-free) manufacturing standards and adheres to RoHS regulations.

1.1 Core Advantages and Target Market

The primary advantages of this LED series include its compact form factor, excellent viewing angle, and compatibility with automated assembly processes. The wide 120-degree viewing angle ensures visibility from various orientations. The device is compatible with standard vapor-phase reflow, infrared reflow, and wave soldering processes, facilitating high-volume manufacturing. It is supplied on 8mm tape and reel, aligning with automated pick-and-place equipment requirements. The low forward current requirement makes it ideal for battery-operated devices where power conservation is critical. Target markets include telecommunications equipment (e.g., phones, fax machines), consumer electronics, industrial control panels, and general-purpose indicator applications where reliable, low-power status indication is needed.

2. In-Depth Technical Parameter Analysis

The performance of the LED is defined under specific ambient temperature conditions (Ta=25°C). Understanding these parameters is crucial for circuit design and ensuring long-term reliability.

2.1 Absolute Maximum Ratings

These ratings define the stress limits beyond which permanent damage to the device may occur. Operation outside these limits is not advised.

• Reverse Voltage (V_R): 5 V. Exceeding this voltage in reverse bias can cause junction breakdown.
• Continuous Forward Current (I_F): 25 mA.
• Peak Forward Current (I_FP): 60 mA, permissible under pulsed conditions (duty cycle 1/10, frequency 1 kHz).
• Power Dissipation (P_d): 60 mW. This is the maximum allowable power loss as heat.
• Electrostatic Discharge (ESD) HBM: 2000 V. This rating indicates the device's sensitivity to static electricity; proper ESD handling procedures must be followed.
• Operating Temperature (T_opr): -40°C to +85°C.
• Storage Temperature (T_stg): -40°C to +90°C.
• Soldering Temperature: For reflow soldering, a peak temperature of 260°C for up to 10 seconds is specified. For hand soldering, the iron tip temperature should not exceed 350°C for 3 seconds.

2.2 Electro-Optical Characteristics

These parameters are measured at a standard test current of I_F = 20 mA.

• Luminous Intensity (I_v): Ranges from 57 mcd (minimum) to 140 mcd (maximum), with a typical value implied by the binning system. The tolerance is ±11%.
• Viewing Angle (2θ_1/2): 120 degrees (typical). This is the full angle at which the luminous intensity drops to half of its peak value.
• Peak Wavelength (λ_p): 632 nm (typical). This is the wavelength at which the spectral emission is strongest.
• Dominant Wavelength (λ_d): Between 617.5 nm and 633.5 nm, defining the perceived color (brilliant red). The tolerance is ±1 nm.
• Spectral Bandwidth (Δλ): 20 nm (typical). This indicates the spectral purity of the emitted light.
• Forward Voltage (V_F): Between 1.75 V and 2.35 V at 20 mA, with a tolerance of ±0.1 V. This parameter is critical for determining the required current-limiting resistor value.
• Reverse Current (I_R): Maximum 10 μA when a reverse bias of 5 V is applied.

3. Binning System Explanation

To ensure color and brightness consistency in production, LEDs are sorted into bins based on key parameters.

3.1 Luminous Intensity Binning

LEDs are categorized into four bins (P2, Q1, Q2, R1) based on their measured luminous intensity at 20 mA. For example, bin R1 contains LEDs with intensity between 112 mcd and 140 mcd.

3.2 Dominant Wavelength Binning

The color (dominant wavelength) is binned into four groups (E4, E5, E6, E7), each spanning 4 nm. Group A, bin E7, for instance, covers wavelengths from 629.5 nm to 633.5 nm.

3.3 Forward Voltage Binning

Forward voltage is binned into three groups (0, 1, 2) within Group B. Bin 0 covers 1.75V to 1.95V, Bin 1 covers 1.95V to 2.15V, and Bin 2 covers 2.15V to 2.35V. This allows designers to select LEDs with tighter voltage tolerances for applications requiring uniform current distribution in parallel strings.

4. Performance Curve Analysis

The datasheet provides several characteristic curves that illustrate device behavior under varying conditions.

4.1 Relative Luminous Intensity vs. Forward Current

This curve shows that light output increases with forward current but not linearly. It highlights the importance of driving the LED at or near its rated current for optimal efficiency. Driving significantly above the rated current leads to diminished returns in brightness and excessive heat.

4.2 Forward Voltage vs. Forward Current

The IV curve demonstrates the diode's exponential relationship. The forward voltage increases with current. The curve is essential for thermal management analysis, as the power dissipated (V_F * I_F) generates heat.

4.3 Forward Current Derating Curve

This graph dictates the maximum allowable continuous forward current as a function of ambient temperature. As ambient temperature rises, the maximum permissible current must be reduced to prevent exceeding the junction temperature limit and the 60 mW power dissipation rating. For example, at 85°C, the maximum continuous current is significantly lower than the 25 mA rating at 25°C.

4.4 Relative Luminous Intensity vs. Ambient Temperature

LED light output is temperature-dependent. This curve typically shows a decrease in luminous intensity as the ambient (and thus junction) temperature increases. This characteristic must be factored into designs operating over a wide temperature range.

4.5 Spectrum Distribution

The spectral plot confirms the monochromatic nature of the AlGaInP chip, showing a dominant peak in the red region (~632 nm) with a defined bandwidth.

4.6 Radiation Pattern

The polar diagram visually represents the 120-degree viewing angle, showing the spatial distribution of light intensity. The pattern is typically Lambertian or near-Lambertian for this package type.

5. Mechanical and Packaging Information

5.1 Package Dimensions

The P-LCC-2 package has a compact footprint. Key dimensions include a body size of approximately 2.0 mm in length, 1.25 mm in width, and a height of 1.1 mm. The cathode is identified by a notch or a green marking on the package. Detailed drawings specify pad layout recommendations for PCB design to ensure proper soldering and mechanical stability. All unspecified tolerances are ±0.1 mm.

5.2 Label Explanation

The device label contains codes for its binned characteristics: CAT indicates the Luminous Intensity Rank, HUE indicates the Dominant Wavelength Rank, and REF indicates the Forward Voltage Rank. This allows for precise traceability and selection.

5.3 Reel and Tape Dimensions

The LEDs are supplied on 8mm carrier tape wound onto standard 180 mm reels. The carrier tape dimensions (pocket size, pitch) are specified to be compatible with automated assembly equipment. Each reel contains 2000 pieces.

5.4 Moisture-Resistant Packaging

For extended storage and to prevent moisture-sensitive device issues, the reels are packaged in aluminum moisture-proof bags with desiccant and humidity indicator cards.

6. Soldering and Assembly Guidelines

The device is rated for standard SMD soldering processes.

• Reflow Soldering: A peak temperature profile of 260°C ±5°C for a duration not exceeding 10 seconds is recommended.
• Hand Soldering: If necessary, a soldering iron tip temperature not exceeding 350°C should be applied for a maximum of 3 seconds per lead.
• Storage: After the sealed moisture-proof bag is opened, the components should be used within a specified timeframe (not explicitly stated but implied by the packaging) or baked according to standard MSD handling procedures if exposed to ambient humidity beyond safe limits.

7. Reliability and Qualification

The product undergoes rigorous reliability testing with a 90% confidence level and an LTPD of 10%. Standard tests include:

• Reflow Soldering Resistance: Withstands 260°C for solderability and package integrity.
• Temperature Cycling: 300 cycles between -40°C and +100°C.
• Thermal Shock: 300 cycles between -10°C and +100°C with rapid transitions.
• High-Temperature Storage: 1000 hours at 100°C.
• Low-Temperature Storage: 1000 hours at -40°C.

These tests ensure the device's robustness in harsh environmental conditions commonly encountered in electronic products.

8. Application Suggestions and Design Considerations

8.1 Typical Application Scenarios

• Status Indicators: Power, connectivity, or mode indicators in telecom devices, network hardware, and consumer appliances.
• Backlighting: Edge-lit or direct backlighting for LCD panels, keypad switches, and symbols, often coupled with light pipes.
• Light Pipe Systems: The wide viewing angle and optimized light coupling make it an ideal source for plastic or acrylic light guides.
• Portable/Battery-Powered Devices: Due to its low current consumption, it is excellent for smartphones, tablets, remote controls, and wearable technology.

8.2 Design Considerations

• Current Limiting: Always use a series resistor to limit the forward current to the desired value (e.g., 20 mA for typical brightness). Calculate the resistor value using R = (V_supply - V_F) / I_F. Consider the worst-case V_F (minimum) to avoid overcurrent.
• Thermal Management: Adhere to the current derating curve. For high ambient temperature applications or continuous operation, ensure adequate PCB copper area or thermal vias to dissipate heat, especially if driving near maximum ratings.
• ESD Protection: Implement ESD protection on signal lines connected to the LED in user-accessible applications.
• Optical Design: When using light pipes, consider the LED's radiation pattern and alignment to maximize coupling efficiency.

9. Technical Comparison and Differentiation

Compared to other SMD indicator LEDs, the 67-21 series' primary differentiators are its specific P-LCC-2 package geometry, which yields a very wide 120-degree viewing angle, and its use of AlGaInP semiconductor material for the brilliant red color. AlGaInP typically offers higher luminous efficiency and better temperature stability for red and amber colors compared to older technologies like GaAsP. The combination of a clear window (vs. diffused) and the inter-reflector design provides higher axial luminous intensity, which is beneficial for light pipe applications where light needs to be injected efficiently into a small aperture.

10. Frequently Asked Questions (Based on Technical Parameters)

Q: What resistor value should I use with a 5V supply?
A: Using the maximum V_F of 2.35V for a conservative design at 20mA: R = (5V - 2.35V) / 0.02A = 132.5Ω. A standard 130Ω or 150Ω resistor would be suitable. Always verify current with the actual V_F of your binned parts.

Q: Can I drive this LED at 30 mA for more brightness?
A: No. The absolute maximum continuous forward current is 25 mA. Exceeding this rating violates the specifications, reduces lifetime due to accelerated lumen depreciation, and risks thermal damage. Use the peak current (60 mA pulsed) only for short-duration blinking.

Q: How does temperature affect performance?
A: As temperature increases, luminous intensity decreases (see performance curve), and the forward voltage typically decreases slightly. More critically, the maximum allowable continuous current must be derated per the derating curve to avoid overheating.

Q: What is the difference between peak and dominant wavelength?
A> Peak wavelength (λ_p=632nm) is the physical wavelength of maximum spectral power. Dominant wavelength (λ_d=617.5-633.5nm) is the wavelength of a monochromatic light that would match the perceived color of the LED. Dominant wavelength is more relevant for color specification.

11. Practical Application Example

Scenario: Designing a status indicator panel for a router.
The panel has five LEDs (Power, Internet, Wi-Fi, LAN1, LAN2) behind a dark tinted acrylic fascia with molded light pipes. The 67-21 brilliant red LED is selected for the \"Power\" indicator.
Design Steps:
1. Electrical: The router's internal logic supply is 3.3V. Assuming a typical V_F of 2.0V and targeting 15 mA for adequate brightness and lower power: R = (3.3V - 2.0V) / 0.015A ≈ 86.7Ω. A 82Ω or 100Ω resistor is chosen.
2. Optical: The LED's wide viewing angle ensures light is captured effectively by the entrance face of the light pipe, even with minor placement misalignment from pick-and-place.
3. Thermal: The operating current of 15 mA is well below the 25 mA maximum, and the ambient temperature inside the router enclosure is estimated to be 50°C. Consulting the derating curve, the allowable current at 50°C is still above 20 mA, so the design is safe.
4. Binning: To ensure uniform brightness across all five indicators on the panel, specifying a tight luminous intensity bin (e.g., Q2 or R1) and a consistent dominant wavelength bin is recommended during procurement.

12. Operating Principle

The LED is a semiconductor diode based on Aluminum Gallium Indium Phosphide (AlGaInP) material. When a forward voltage exceeding the diode's junction potential (approximately 1.8-2.2V for red AlGaInP) is applied, electrons and holes are injected into the active region from the n-type and p-type materials, respectively. These charge carriers recombine radiatively, releasing energy in the form of photons. The specific bandgap energy of the AlGaInP alloy determines the wavelength (color) of the emitted light, which in this case is in the brilliant red spectrum. The package encapsulates the chip, provides mechanical protection, houses the inter-reflector to shape the light output, and incorporates the lens (clear window) to control the beam pattern.

13. Technology Trends

The general trend in SMD indicator LEDs like the P-LCC-2 format is towards ever-higher luminous efficacy (more light output per unit of electrical input power), enabling lower operating currents for the same perceived brightness, which is critical for energy-efficient designs. There is also a continuous drive for miniaturization while maintaining or improving optical performance. Manufacturing processes are optimized for higher yield and tighter binning tolerances, providing designers with more consistent color and brightness across production batches. Furthermore, enhanced reliability under higher temperature reflow profiles (e.g., for lead-free soldering) and improved ESD robustness are standard expectations in modern components. The underlying AlGaInP technology for red/orange/amber LEDs is mature but continues to see incremental improvements in efficiency and lifetime.