1. Product Overview
The 67-21 series represents a family of Top View LEDs housed in a compact PLCC-2 (Plastic Leaded Chip Carrier) package. This device is characterized by its white package body and a colorless, clear window lens. A key design feature is the integrated inter-reflector within the package, which serves to optimize light coupling and output efficiency. This design results in a very wide viewing angle, making the LED exceptionally well-suited for applications utilizing light pipes or requiring broad illumination patterns. The low forward current requirement further enhances its appeal for power-sensitive applications, such as portable electronic devices.
The primary function of this LED is as an optical indicator or backlight source. Its package is designed for compatibility with modern, high-volume assembly processes, including vapor-phase reflow, infrared reflow, and wave soldering. It is also compatible with automatic pick-and-place equipment and is supplied on 8mm tape and reel for efficient automated assembly.
The device is constructed using lead-free (Pb-free) materials and is compliant with relevant RoHS (Restriction of Hazardous Substances) directives, ensuring it meets contemporary environmental and regulatory standards for electronic components.
2. Technical Specifications and Objective Interpretation
2.1 Absolute Maximum Ratings
These ratings define the stress limits beyond which permanent damage to the device may occur. Operation under or at these limits is not guaranteed and should be avoided in circuit design.
- Reverse Voltage (VR): 5V. Exceeding this voltage in reverse bias can cause junction breakdown.
- Forward Current (IF): 50mA DC. The continuous DC current should not exceed this value.
- Peak Forward Current (IFP): 100mA. This is permissible only under pulsed conditions (1/10 duty cycle at 1kHz).
- Power Dissipation (Pd): 120mW. This is the maximum allowable power dissipation, calculated as VF * IF.
- Operating Temperature (Topr): -40°C to +85°C. The ambient temperature range for reliable operation.
- Storage Temperature (Tstg): -40°C to +100°C.
- Electrostatic Discharge (ESD): 2000V (Human Body Model). Proper ESD handling procedures are required.
- Soldering Temperature: For reflow, peak temperature of 260°C for up to 10 seconds is specified. For hand soldering, 350°C for 3 seconds is the limit.
2.2 Electro-Optical Characteristics
These parameters are measured at a standard test condition of 25°C ambient temperature and a forward current (IF) of 20mA, unless otherwise stated.
- Luminous Intensity (IV): Ranges from a minimum of 450 millicandelas (mcd) to a maximum of 1120 mcd. The typical value falls within this range. A tolerance of ±10% applies.
- Viewing Angle (2θ1/2): 120 degrees (typical). This is the full angle at which the luminous intensity drops to half of its peak value, confirming the \"wide viewing angle\" claim.
- Peak Wavelength (λp): 591 nm (typical). This is the wavelength at which the spectral power distribution is maximum.
- Dominant Wavelength (λd): 586 nm to 594 nm. This wavelength defines the perceived color (soft orange). A tight tolerance of ±1 nm is specified.
- Spectral Bandwidth (Δλ): 20 nm (typical). This indicates the spectral purity of the emitted light.
- Forward Voltage (VF): 1.75V to 2.35V at 20mA. The tolerance is ±0.1V. This parameter is crucial for calculating series resistor values and power dissipation.
- Reverse Current (IR): Maximum 10 µA at a reverse voltage of 5V.
3. Binning System Explanation
To ensure color and brightness consistency in production, LEDs are sorted into bins based on key parameters.
3.1 Dominant Wavelength Binning (HUE)
Defines the color consistency. The 67-21 series for soft orange is grouped under code \"F\" with four sub-bins:
- DD1: 586 - 588 nm
- DD2: 588 - 590 nm
- DD3: 590 - 592 nm
- DD4: 592 - 594 nm
3.2 Luminous Intensity Binning (CAT)
Defines the brightness output. Four bins are defined at IF=20mA:
- U1: 450 - 565 mcd
- U2: 565 - 715 mcd
- V1: 715 - 900 mcd
- V2: 900 - 1120 mcd
3.3 Forward Voltage Binning (REF)
Defines the electrical characteristic for easier circuit design. Group \"B\" has three bins at IF=20mA:
- 0: 1.75 - 1.95 V
- 1: 1.95 - 2.15 V
- 2: 2.15 - 2.35 V
The specific combination (e.g., CAT: V2, HUE: DD3, REF: 1) is indicated on the product label and reel.
4. Performance Curve Analysis
The datasheet provides several characteristic curves that are essential for understanding device behavior under non-standard conditions.
4.1 Relative Luminous Intensity vs. Forward Current
This curve shows that light output increases with current but not linearly. It helps designers choose an operating point that balances brightness with efficiency and device stress.
4.2 Forward Current Derating Curve
This critical graph shows the maximum allowable continuous forward current as a function of ambient temperature. As temperature increases, the maximum current must be reduced to stay within the 120mW power dissipation limit and prevent overheating. For example, at 85°C, the maximum IF is significantly lower than 50mA.
4.3 Forward Voltage vs. Forward Current
This IV curve illustrates the diode's exponential relationship. The voltage increases with current, and this relationship is temperature-dependent (a curve at 25°C is shown).
4.4 Spectrum Distribution
The graph shows a single peak centered around 591 nm, confirming the monochromatic orange emission with a typical bandwidth of 20 nm.
4.5 Radiation Pattern
A polar diagram visually confirms the wide 120° viewing angle, showing nearly Lambertian emission characteristics suitable for wide-area illumination.
5. Mechanical and Packaging Information
5.1 Package Dimensions
The PLCC-2 package has a body size of approximately 2.0mm (length) x 1.25mm (width) x 1.1mm (height). The lead pitch is 1.0mm. Detailed dimensional drawings with tolerances (typically ±0.1mm) are provided for PCB footprint design. The package includes a clear identification of the cathode (usually indicated by a notch or a green mark in the drawing).
5.2 Reel and Tape Packaging
The component is supplied on 8mm carrier tape for automated assembly. The reel dimensions are standardized. Each reel contains 2000 pieces. The carrier tape dimensions ensure proper component retention and feeding.
5.3 Moisture Sensitivity and Storage
The components are packaged in a moisture-resistant aluminum bag with a desiccant to prevent moisture absorption, which is critical for preventing \"popcorning\" during reflow soldering. The bag is labeled with relevant product information.
6. Soldering and Assembly Guidelines
The device is rated for standard SMD soldering processes.
- Reflow Soldering: A peak temperature profile not exceeding 260°C for a maximum of 10 seconds is recommended.
- Hand Soldering: If necessary, a soldering iron tip temperature up to 350°C can be used for a maximum of 3 seconds per lead.
- It is compatible with both infrared (IR) and vapor-phase reflow techniques.
- Following the recommended land pattern from the dimensional drawing is essential for reliable solder joint formation and self-alignment during reflow.
7. Application Suggestions and Design Considerations
7.1 Typical Application Scenarios
- Automotive Interior: Backlighting for dashboard instruments, control switches, and status indicators.
- Telecommunication Equipment: Status indicators and keypad backlighting in phones, fax machines, and networking hardware.
- Consumer Electronics: Power indicators, button backlights, and status lights in portable devices, home appliances, and audio/video equipment.
- General Panel Indicators: Any application requiring a bright, wide-angle visual indicator.
7.2 Light Pipe Applications
The wide viewing angle and optimized light coupling from the inter-reflector make this LED ideal for use with light pipes. The design efficiently captures light from the LED die and directs it into the light pipe with minimal loss, enabling bright and uniform illumination at a distance from the actual LED location.
7.3 Circuit Design Considerations
- Current Limiting Resistor: A series resistor is mandatory. Calculate its value using R = (Vsupply - VF) / IF. Use the maximum VF from the bin or datasheet to ensure sufficient current under all conditions.
- Power Dissipation: Ensure the product VF * IF does not exceed 120mW, especially at high ambient temperatures (refer to derating curve).
- ESD Protection: Implement basic ESD protection on PCB traces if the LED is exposed to user contact, as its 2kV HBM rating is relatively modest.
8. Reliability Testing
The product undergoes standard reliability tests to ensure quality and longevity. The test plan is based on a 90% confidence level with an LTPD (Lot Tolerance Percent Defective) of 10%. One specified test is reflow soldering resistance, where samples are subjected to 260°C±5°C for a minimum of 5 seconds over 6 cycles.
9. Frequently Asked Questions (Based on Technical Parameters)
Q: What resistor should I use for a 5V supply?
A: Using the maximum VF of 2.35V and a target IF of 20mA: R = (5V - 2.35V) / 0.02A = 132.5Ω. A standard 130Ω or 150Ω resistor would be appropriate. Always verify actual current with measured VF.
Q: Can I drive this LED with a 3.3V microcontroller pin?
A: Possibly, but it depends on the LED's actual VF. If the VF is near 2.35V, the voltage drop across a current-limiting resistor from a 3.3V source would be very small, making current control imprecise and sensitive to VF variations. A lower VF bin or a dedicated driver circuit is recommended for 3.3V systems.
Q: How does temperature affect brightness?
A: Like most LEDs, luminous intensity decreases as junction temperature increases. The derating curve indirectly reflects this by requiring lower current at high ambient temperatures to manage heat. For constant brightness, thermal management or feedback may be needed.
Q: Is this suitable for outdoor use?
A: The operating temperature range (-40°C to +85°C) covers most outdoor conditions. However, the package is not specifically rated for waterproofing or UV resistance. For direct outdoor exposure, additional environmental protection (conformal coating, sealed enclosure) would be necessary.
10. Technical Comparison and Positioning
The 67-21 series in PLCC-2 package positions itself as a general-purpose, cost-effective indicator LED with a strong emphasis on wide-angle performance. Compared to smaller chip LEDs (e.g., 0402, 0603), it offers significantly higher light output and wider viewing angle due to its larger die and integrated reflector. Compared to traditional \"round dome\" LEDs, it offers a much lower profile suitable for modern, thin electronic devices. Its key differentiator is the combination of good brightness, very wide viewing angle, and compatibility with automated SMT assembly, making it a versatile choice for both indicator and light-pipe backlighting tasks where broad, even illumination is desired.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |