Table of Contents
- 1. Product Overview
- 1.1 Key Features and Compliance
- 2. Technical Parameter Deep Dive
- 2.1 Absolute Maximum Ratings
- 2.2 Electro-Optical Characteristics (Ta = 25°C)
- 3. Binning System Explanation
- 3.1 Luminous Intensity Binning (CAT Code)
- 3.2 Dominant Wavelength Binning (HUE Code)
- 3.3 Forward Voltage Binning (REF Code)
- 4. Performance Curve Analysis
- 4.1 Relative Luminous Intensity vs. Ambient Temperature
- 4.2 Forward Current vs. Forward Voltage (I-V Curve)
- 4.3 Relative Luminous Intensity vs. Forward Current
- 4.4 Spectrum Distribution
- 4.5 Radiation Pattern
- 5. Mechanical and Package Information
- 5.1 Package Dimensions
- 5.2 Polarity Identification
- 6. Soldering and Assembly Guidelines
- 6.1 Reflow Soldering Profile
- 6.2 Hand Soldering
- 6.3 Storage Conditions
- 7. Packaging and Ordering Information
- 7.1 Tape and Reel Specifications
- 7.2 Label Explanation
- 8. Application Suggestions
- 8.1 Typical Application Circuits
- 8.2 Design Considerations for Light Pipes
- 9. Reliability and Quality Assurance
- 10. Frequently Asked Questions (Based on Technical Data)
- 10.1 What is the difference between Peak and Dominant Wavelength?
- 10.2 Can I drive this LED at 30 mA for more brightness?
- 10.3 How do I interpret the device code \"67-21/S2C-F Q2R2 B/2T (SLO)\"?
- 11. Practical Design Case Study
- 11.1 Designing a Dashboard Indicator Cluster
- 12. Technology Introduction and Trends
- 12.1 P-LCC-2 Package Technology
- 12.2 Industry Trends
- LED Specification Terminology
- Photoelectric Performance
- Electrical Parameters
- Thermal Management & Reliability
- Packaging & Materials
- Quality Control & Binning
- Testing & Certification
1. Product Overview
The 67-21 series represents a family of Top View LEDs housed in a compact P-LCC-2 (Plastic Leaded Chip Carrier) surface-mount package. This device is engineered as an optical indicator, featuring a white package body with a colorless, clear window that provides a wide, uniform light emission pattern. Its core advantages include a very wide viewing angle, optimized for efficient light coupling into light pipes, and low forward current requirements, making it exceptionally suitable for power-sensitive applications. The primary target markets are automotive interior lighting (e.g., dashboard backlighting), telecommunications equipment indicators, general backlighting for switches and symbols, and any portable electronic device where space and power efficiency are critical.
1.1 Key Features and Compliance
- Package: P-LCC-2, white body, colorless clear lens.
- Optical Performance: Wide viewing angle, ideal for light pipe applications.
- Manufacturing Compatibility: Suitable for vapor-phase reflow soldering and compatible with automatic placement equipment.
- Supply Format: Available on 8mm tape and reel for automated assembly.
- Environmental Compliance: Pb-free product and compliant with RoHS directives.
- Color Options: The series is available in soft orange (as detailed in this sheet), green, blue, and yellow.
2. Technical Parameter Deep Dive
2.1 Absolute Maximum Ratings
These ratings define the stress limits beyond which permanent damage to the device may occur. Operation at or near these limits is not recommended and can affect reliability.
- Reverse Voltage (VR): 5 V - The maximum voltage that can be applied in the reverse direction.
- Forward Current (IF): 25 mA - The maximum continuous DC forward current.
- Peak Forward Current (IFP): 60 mA - The maximum pulsed forward current (1/10 duty cycle, 1 kHz).
- Power Dissipation (Pd): 60 mW - The maximum power the package can dissipate at 25°C ambient.
- Electrostatic Discharge (ESD): 2000 V (Human Body Model) - Indicates a moderate level of ESD sensitivity; proper handling procedures are required.
- Operating Temperature (Topr): -40°C to +85°C - The ambient temperature range for normal operation.
- Storage Temperature (Tstg): -40°C to +90°C.
- Soldering Temperature: Reflow: 260°C for 10 seconds max; Hand soldering: 350°C for 3 seconds max.
2.2 Electro-Optical Characteristics (Ta = 25°C)
These are the typical performance parameters under standard test conditions (IF = 20 mA).
- Luminous Intensity (Iv): 90 to 180 mcd (millicandela). The light output is binned, with a typical value likely around the middle of this range. Tolerance is ±11%.
- Viewing Angle (2θ1/2): 120 degrees (typical). This is the full angle at which the luminous intensity is half of the peak intensity. The wide angle is a key feature for indicator applications.
- Peak Wavelength (λp): 611 nm (typical). The wavelength at which the spectral emission is strongest.
- Dominant Wavelength (λd): 603 to 609 nm. This is the perceived color of the light, binned for consistency. Tolerance is ±1 nm.
- Spectral Bandwidth (Δλ): 20 nm (typical). The width of the emitted spectrum at half the maximum intensity.
- Forward Voltage (VF): 1.75 to 2.35 V. The voltage drop across the LED at 20 mA, also binned. Tolerance is ±0.1 V.
- Reverse Current (IR): 10 μA (max) at VR = 5 V.
3. Binning System Explanation
To ensure color and brightness consistency in production, LEDs are sorted into bins. The specific device code (e.g., Q2R2 B/2T) indicates its bin assignment.
3.1 Luminous Intensity Binning (CAT Code)
- Bin Q2: 90 - 112 mcd
- Bin R1: 112 - 140 mcd
- Bin R2: 140 - 180 mcd
3.2 Dominant Wavelength Binning (HUE Code)
- Group F, Bin EE1: 603 - 606 nm
- Group F, Bin EE2: 606 - 609 nm
3.3 Forward Voltage Binning (REF Code)
- Group B, Bin 0: 1.75 - 1.95 V
- Group B, Bin 1: 1.95 - 2.15 V
- Group B, Bin 2: 2.15 - 2.35 V
4. Performance Curve Analysis
The datasheet provides several characteristic curves that are crucial for design.
4.1 Relative Luminous Intensity vs. Ambient Temperature
The curve shows that luminous intensity is relatively stable from -40°C to approximately 25°C. Above 25°C, the intensity gradually decreases as temperature increases, which is typical for LED behavior due to efficiency droop. At 85°C, the output may be around 80-85% of its 25°C value. This must be accounted for in high-temperature environments.
4.2 Forward Current vs. Forward Voltage (I-V Curve)
This non-linear curve is essential for selecting the current-limiting resistor. At 20 mA, the typical VF is around 2.0V, but it can vary between 1.8V and 2.2V depending on the bin and temperature. The curve becomes steeper above 20 mA, indicating a small increase in current requires a larger increase in voltage.
4.3 Relative Luminous Intensity vs. Forward Current
The light output is approximately linear with current up to the rated 20 mA. Operating above this current will increase brightness but at the cost of higher power dissipation, reduced efficiency, and potentially shorter lifespan. The derating curve shows the maximum allowable forward current decreases as ambient temperature rises above 25°C to keep the junction temperature within safe limits.
4.4 Spectrum Distribution
The spectrum is a narrow band centered around 611 nm (peak) with a typical bandwidth of 20 nm, confirming the monochromatic \"soft orange\" color. There is minimal emission outside this band.
4.5 Radiation Pattern
The polar diagram confirms the Lambertian-like emission pattern with a very wide 120° viewing angle. The intensity is nearly uniform across a broad frontal area, making it excellent for wide-angle indicators.
5. Mechanical and Package Information
5.1 Package Dimensions
The P-LCC-2 package has the following key dimensions (tolerance ±0.1 mm unless noted):
- Overall Length: 2.0 mm
- Overall Width: 1.25 mm
- Overall Height: 0.8 mm
- Lead Pitch: 1.0 mm (distance between the centers of the two leads)
- Lead Width: 0.4 mm (typical)
- Land Pattern Recommendation: A detailed footprint is provided for PCB design, ensuring proper soldering and mechanical stability.
5.2 Polarity Identification
The cathode (negative) side is typically identified by a notch or a green marking on the package body, as shown in the top-view diagram. Correct orientation is critical for circuit operation.
6. Soldering and Assembly Guidelines
6.1 Reflow Soldering Profile
The device is rated for vapor-phase or infrared reflow soldering. The critical parameter is a peak package body temperature of 260°C (±5°C) for a maximum of 10 seconds. A standard lead-free reflow profile (ramp-up, preheat, reflow, cooling) is applicable. Avoid excessive time in the liquidus temperature range.
6.2 Hand Soldering
If hand soldering is necessary, the iron tip temperature should not exceed 350°C, and contact time with the lead should be limited to 3 seconds or less per pad. Use a low-power iron (approx. 30W) with a fine tip.
6.3 Storage Conditions
As a moisture-sensitive device (MSD), the LEDs are packaged in a moisture-proof aluminum bag with desiccant. Once the sealed bag is opened, the components must be used within a specific time frame (not specified in this sheet, but typically 168 hours at <30°C/60%RH for Level 3) or baked before reflow to prevent \"popcorn\" effect during soldering.
7. Packaging and Ordering Information
7.1 Tape and Reel Specifications
- Tape Width: 8 mm
- Pocket Pitch: 4.0 mm
- Reel Dimensions: Standard 7-inch reel (178 mm diameter) with a 13-inch (330 mm) hub.
- Quantity per Reel: 2000 pieces.
7.2 Label Explanation
The reel label contains several codes: CPN (Customer Part Number), PN (Internal Part Number), Quantity, Lot Number, and the three key binning codes: CAT (Luminous Intensity), HUE (Dominant Wavelength), and REF (Forward Voltage).
8. Application Suggestions
8.1 Typical Application Circuits
The most common drive circuit is a simple series resistor. The resistor value (Rs) is calculated as: Rs = (Vsupply - VF) / IF. For a 5V supply and a typical VF of 2.0V at 20 mA: Rs = (5 - 2.0) / 0.02 = 150 Ω. The power rating of the resistor should be at least IF2 * Rs = 0.06W; a 1/8W or 1/4W resistor is suitable. For constant brightness across a voltage range or temperature, a constant current driver is recommended.
8.2 Design Considerations for Light Pipes
- Alignment: Precise alignment between the LED and the light pipe entrance is crucial to maximize light coupling efficiency.
- Distance: Keep the distance between the LED lens and the light pipe as small as possible (ideally <0.5 mm) to minimize light loss.
- Material: Use light pipes made from high-transmittance optical-grade materials (e.g., PMMA, PC).
9. Reliability and Quality Assurance
The product undergoes a comprehensive suite of reliability tests with a 90% confidence level and 10% Lot Tolerance Percent Defective (LTPD). Test items include:
- Reflow Soldering Resistance (260°C)
- Temperature Cycling (-40°C to +100°C)
- Thermal Shock (-10°C to +100°C)
- High & Low Temperature Storage
- DC Operating Life (1000 hrs at 20mA)
- High Temperature/Humidity Operating Life (85°C/85% RH, 1000 hrs)
These tests ensure the device's robustness in harsh environmental conditions typical of automotive and industrial applications.
10. Frequently Asked Questions (Based on Technical Data)
10.1 What is the difference between Peak and Dominant Wavelength?
Peak Wavelength (λp) is the physical wavelength with the highest spectral power output (611 nm). Dominant Wavelength (λd) is the single wavelength of monochromatic light that would produce the same perceived color (603-609 nm). λd is more relevant for color specification.
10.2 Can I drive this LED at 30 mA for more brightness?
Driving at 30 mA exceeds the Absolute Maximum Rating for continuous forward current (25 mA). While it might work briefly, it will significantly increase junction temperature, accelerate lumen depreciation, and likely cause premature failure. For higher brightness, select an LED from a bin with higher luminous intensity or a product rated for higher current.
10.3 How do I interpret the device code \"67-21/S2C-F Q2R2 B/2T (SLO)\"?
This is the full part number. \"67-21\" is the series. \"S2C-F\" likely denotes package and color (Soft Orange). \"Q2R2\" indicates the luminous intensity bin (a combination likely specifying a sub-range). \"B/2T\" indicates the forward voltage bin (Group B, Bin 2). \"SLO\" confirms Soft Orange color.
11. Practical Design Case Study
11.1 Designing a Dashboard Indicator Cluster
Scenario: Designing backlighting for 5 dashboard icons in an automotive application. The supply voltage is 12V (vehicle battery), and the ambient temperature can reach 85°C.
Design Steps:
- Drive Method: Use a series resistor for each LED for simplicity and cost. A linear regulator or dedicated LED driver IC would be better for precise current control over the full voltage range.
- Current Selection: To ensure longevity at high temperature, derate the current. Using 15 mA instead of 20 mA provides a safety margin. Check the derating curve: at 85°C, the maximum allowable IF is still above 20 mA, so 15 mA is safe.
- Resistor Calculation: Use the maximum VF from Bin 2 (2.35V) for worst-case design to ensure current never exceeds the target. Rs = (12V - 2.35V) / 0.015A ≈ 643 Ω. Use the nearest standard value, 620 Ω.
- Resistor Power Rating: P = (12-2.35)^2 / 620 ≈ 0.15W. A 1/4W (0.25W) resistor is sufficient.
- PCB Layout: Place the LEDs precisely according to the recommended land pattern. Ensure the cathode markings are oriented consistently. Provide a small thermal relief on the pads if the PCB has large copper pours, but avoid excessive heat sinking which can hinder soldering.
- Light Pipe Design: Model the light pipe to capture the 120° emission cone. The entrance of the light pipe should be slightly larger than the LED's emitting area.
12. Technology Introduction and Trends
12.1 P-LCC-2 Package Technology
The P-LCC-2 package is a standard for SMD LEDs. It consists of an LED chip mounted on a leadframe, encapsulated by a white reflective plastic body (often PPA or PCT) to increase light output efficiency, and topped with a clear or diffused epoxy lens. The \"top view\" designation means the primary light emission is perpendicular to the mounting plane. The wide viewing angle is achieved through a combination of chip technology, reflector cup design, and lens geometry.
12.2 Industry Trends
The trend for indicator LEDs like the 67-21 series is towards higher efficiency (more light output per mA), improved color consistency through tighter binning, and enhanced reliability for automotive and industrial grades. There is also a move towards miniaturization (smaller packages like 0402) while maintaining or improving optical performance. Furthermore, the integration of on-chip ESD protection is becoming more common to improve robustness in handling and assembly.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |