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LTC-2721JD LED Display Datasheet - 0.28-inch Digit Height - AlInGaP Red - 2.6V Forward Voltage - 70mW Power - English Technical Documentation

Complete technical datasheet for the LTC-2721JD, a 0.28-inch triple-digit seven-segment AlInGaP red LED display. Includes electrical/optical characteristics, pinout, dimensions, reliability tests, and application cautions.
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PDF Document Cover - LTC-2721JD LED Display Datasheet - 0.28-inch Digit Height - AlInGaP Red - 2.6V Forward Voltage - 70mW Power - English Technical Documentation

1. Product Overview

The LTC-2721JD is a compact, high-performance triple-digit seven-segment display designed for clear numeric readouts in electronic equipment. It features a 0.28-inch (7.0 mm) digit height, providing an excellent balance between size and readability. The device utilizes advanced AlInGaP (Aluminum Indium Gallium Phosphide) LED chip technology, specifically a High-Efficiency Red variant fabricated on a non-transparent GaAs substrate. This technology choice is key to its performance, offering superior brightness and efficiency compared to older LED materials. The display has a distinctive gray face with white segments, which enhances contrast and character appearance, making the numerals easy to read under various lighting conditions. Its primary target markets include consumer electronics, industrial control panels, instrumentation, test equipment, and office appliances where reliable, low-power numeric indication is required.

1.1 Key Features and Advantages

1.2 Device Identification

The part number LTC-2721JD specifically denotes a multiplexed common cathode display using AlInGaP High-Efficiency Red LEDs, featuring a right-hand decimal point. This configuration is standard for driving multiple digits with a reduced number of microcontroller I/O pins.

2. Technical Parameters: In-Depth Objective Interpretation

This section provides a detailed, objective analysis of the critical parameters defining the display's performance and operational limits.

2.1 Absolute Maximum Ratings

These are stress limits that must not be exceeded under any conditions, even momentarily. Operating at or beyond these limits may cause permanent damage.

2.2 Electrical & Optical Characteristics

These are typical performance parameters measured at Ta=25°C and specified forward current (IF).

3. Mechanical & Package Information

3.1 Package Dimensions and Tolerances

The display conforms to a standard dual in-line package (DIP) footprint. Key dimensional notes include:

3.2 Pinout and Internal Circuit

The LTC-2721JD is a multiplexed common cathode display. It has three common cathode pins (one for each digit: pins 2, 5, 8) and individual anode pins for each segment (A-G, DP) and colon segments (L1, L2, L3). Pin 13 is a common cathode for the three colon LEDs. This architecture allows a microcontroller to illuminate a specific digit by grounding its common cathode while applying a forward voltage to the desired segment anodes. By cycling through the digits rapidly (multiplexing), all three digits appear to be continuously lit. The pin connections are as follows: 1(D), 2(CC1), 3(DP), 4(E), 5(CC2), 6(C/L3), 7(G), 8(CC3), 9(NC), 10-11(NP), 12(B/L2), 13(CC L1/L2/L3), 14(NP), 15(A/L1), 16(F).

4. Performance Curves and Characteristics

The datasheet references typical performance curves (though not displayed in the provided text). Based on standard LED behavior and the given parameters, these curves would typically illustrate:

5. Reliability Testing

The device undergoes a comprehensive suite of reliability tests based on military (MIL-STD), Japanese (JIS), and internal standards to ensure robustness and longevity.

6. Soldering and Assembly Guidelines

6.1 Automated Soldering

For wave soldering, the recommended condition is to immerse the leads to a depth of 1/16 inch (1.59 mm) below the seating plane for a maximum of 5 seconds at 260°C. The body temperature of the display must not exceed the maximum storage temperature during this process.

6.2 Manual Soldering

When using a soldering iron, the tip should contact the lead (again, 1/16 inch below the seating plane) for no more than 5 seconds at a temperature of 350°C ±30°C. Using a heatsink on the lead between the joint and the package body is good practice.

7. Critical Application Cautions and Design Considerations

Important: Adherence to these cautions is essential for reliable operation and to prevent premature failure.

8. Practical Application Scenarios and Design Notes

8.1 Typical Applications

8.2 Design Implementation Case Study

Scenario: Designing a 3-digit voltmeter display using a microcontroller.

  1. Multiplexing Driver: The microcontroller will use 7-8 I/O pins for segment anodes (A-G, DP) and 3 I/O pins (configured as open-drain/low-output) for the digit cathodes (CC1, CC2, CC3).
  2. Current Limiting: Place a current-limiting resistor in series with each segment anode line. The resistor value (R) is calculated using: R = (Vsupply - VF) / IF. For a 5V supply, VF=2.6V, and a desired IF of 10 mA: R = (5 - 2.6) / 0.01 = 240 Ω. Use the nearest standard value (e.g., 220 Ω or 270 Ω).
  3. Multiplex Timing: Program the microcontroller to activate one digit cathode at a time, illuminate the required segments for that digit, wait a short period (e.g., 2-5 ms), then move to the next digit. A refresh rate of 50-200 Hz prevents visible flicker.
  4. Peak Current Check: If using a 10% duty cycle (3 digits), the peak current during the active time can be higher. For an average IF of 10 mA, the peak current during the 1/3 duty cycle would be 30 mA. This must be checked against the Absolute Maximum Rating for Peak Forward Current (90 mA) and the Continuous Current derating at the operating temperature.

9. Technical Comparison and Differentiation

The LTC-2721JD's primary advantages stem from its AlInGaP technology:

10. Frequently Asked Questions (Based on Technical Parameters)

10.1 Can I drive this display with a 3.3V microcontroller?

Answer: Possibly, but with caution. The typical forward voltage (VF) is 2.6V. With a 3.3V supply, there is only 0.7V headroom for the current-limiting resistor. This small voltage drop makes the current very sensitive to variations in VF and the supply voltage. A constant-current driver circuit is highly recommended for 3.3V operation to ensure stable brightness. Direct connection to 3.3V GPIO pins without a driver risks overcurrent if VF is at the lower end of its range.

10.2 Why is the maximum continuous current derated with temperature?

Answer: This is due to the negative temperature coefficient of the LED's forward voltage and the physical limits of the package. As temperature rises, the internal efficiency drops, and more electrical power is converted to heat instead of light. If the current is not reduced, the junction temperature can rise uncontrollably (thermal runaway), leading to rapid degradation and failure. The derating curve (0.33 mA/°C) is provided to prevent this.

10.3 What does "categorized for luminous intensity" mean?

Answer: It means the displays are tested and sorted into different brightness bins after production. For example, one batch may have IV from 200-300 μcd, another from 300-400 μcd, etc. This allows designers purchasing large quantities to ensure uniform brightness across all units in their product. The specific bin code is often marked on the package (referenced as "Z: BIN CODE" in the module marking).

11. Operating Principle and Technology Trends

11.1 Basic Operating Principle

A seven-segment LED display is an array of light-emitting diodes arranged in a figure-eight pattern. Each segment (A through G) is an individual LED. By applying a forward bias voltage (exceeding the diode's VF) and limiting the current with a resistor or constant-current source, electrons and holes recombine within the AlInGaP semiconductor's active region, releasing energy in the form of photons (light) at a wavelength characteristic of the material—in this case, red (~640 nm). Multiplexing takes advantage of the human eye's persistence of vision by illuminating only one digit at a time but cycling through them so quickly that they appear to be all on simultaneously.

11.2 Objective Technology Context

AlInGaP represents a mature and highly optimized material system for red, orange, and yellow LEDs. It offers excellent efficiency and reliability. The trend in display technology is towards higher integration (e.g., dot matrix displays, OLEDs, micro-LEDs) and direct integration with driver ICs. However, discrete seven-segment displays like the LTC-2721JD remain highly relevant due to their simplicity, low cost, high brightness, robustness, and ease of use in applications where only numeric data needs to be shown. Their design is well-understood, and they interface easily with low-cost microcontrollers, ensuring their continued use in industrial, consumer, and instrumentation fields for the foreseeable future.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.