SMD LED Datasheet - 0.35mm Height - 1.7-2.3V Forward Voltage - Orange Color - 75mW Power - English Technical Document

1. Product Overview

This document details the specifications for an ultra-thin, surface-mount chip LED. The device is designed for applications requiring a low-profile component with high brightness. Its primary features include an exceptionally thin package height, compatibility with automated assembly processes, and the use of AlInGaP semiconductor technology for efficient orange light emission.

The LED is packaged on tape and reel for high-volume, automated placement. It is classified as a green product and complies with relevant environmental standards.

2. Technical Parameter Deep Dive

2.1 Absolute Maximum Ratings

The device's operational limits are defined under an ambient temperature (Ta) of 25°C. Exceeding these ratings may cause permanent damage.

• Power Dissipation: 75 mW - The maximum power the device can safely dissipate as heat.
• Peak Forward Current: 80 mA - Permissible under pulsed conditions (1/10 duty cycle, 0.1ms pulse width).
• DC Forward Current: 30 mA - The maximum continuous forward current.
• Reverse Voltage: 5 V - The maximum voltage that can be applied in the reverse direction.
• Operating Temperature Range: -30°C to +85°C.
• Storage Temperature Range: -40°C to +85°C.
• Infrared Soldering Condition: Withstands 260°C for 10 seconds, suitable for lead-free reflow processes.

2.2 Electrical & Optical Characteristics

All characteristics are measured at Ta=25°C and a standard test current (IF) of 5mA, unless otherwise specified.

• Luminous Intensity (Iv): Ranges from a minimum of 11.2 mcd to a maximum of 71.0 mcd. The typical value falls within this wide binning range.
• Viewing Angle (2θ1/2): 130 degrees. This is the full angle at which the luminous intensity drops to half of its peak axial value, indicating a wide viewing pattern.
• Peak Emission Wavelength (λP): Typically 611 nm. This is the wavelength at which the spectral power distribution is at its maximum.
• Dominant Wavelength (λd): Typically 605 nm at IF=5mA. This is the single wavelength perceived by the human eye that defines the orange color of the LED, derived from the CIE chromaticity diagram.
• Spectral Line Half-Width (Δλ): Typically 17 nm. This parameter indicates the spectral purity; a smaller value means a more monochromatic light source.
• Forward Voltage (VF): Ranges from 1.7 V to 2.3 V at IF=5mA. The actual voltage depends on the specific bin code.
• Reverse Current (IR): Maximum of 10 μA when a reverse voltage (VR) of 5V is applied.

Measurement Notes: Luminous intensity is measured using a sensor and filter combination that approximates the CIE photopic (eye-response) curve. Caution against Electrostatic Discharge (ESD) is strongly advised, as it can damage the LED. Proper grounding and the use of anti-static equipment are recommended during handling.

3. Binning System Explanation

The LEDs are sorted into bins based on key parameters to ensure consistency within a production batch. Two primary binning categories are defined:

3.1 Forward Voltage Binning

Measured at a forward current of 5mA. The tolerance for each bin is +/-0.1 Volt.

• Bin Code E2: 1.70 V (Min) to 1.90 V (Max)
• Bin Code E3: 1.90 V (Min) to 2.10 V (Max)
• Bin Code E4: 2.10 V (Min) to 2.30 V (Max)

3.2 Luminous Intensity Binning

Measured at a forward current of 5mA. The tolerance for each bin is +/-15%.

• Bin Code L: 11.20 mcd (Min) to 18.00 mcd (Max)
• Bin Code M: 18.00 mcd (Min) to 28.00 mcd (Max)
• Bin Code N: 28.00 mcd (Min) to 45.00 mcd (Max)
• Bin Code P: 45.00 mcd (Min) to 71.00 mcd (Max)

Understanding these bins is crucial for design, especially when multiple LEDs are used in parallel, to minimize visible differences in brightness or forward voltage drop.

4. Performance Curve Analysis

The datasheet references typical performance curves measured at 25°C ambient temperature. While the specific graphs are not reproduced in the text, they typically include:

• Relative Luminous Intensity vs. Forward Current: Shows how light output increases with current, typically in a non-linear relationship that saturates at higher currents.
• Forward Voltage vs. Forward Current: Demonstrates the diode's I-V characteristic, crucial for designing the current-limiting circuitry.
• Relative Luminous Intensity vs. Ambient Temperature: Illustrates the decrease in light output as junction temperature rises, an important consideration for thermal management.
• Spectral Power Distribution: A graph showing the relative intensity of light emitted across different wavelengths, centered around the 611 nm peak.

These curves are essential for predicting real-world performance under conditions different from the standard test point.

5. Mechanical & Package Information

5.1 Key Package Dimensions

The LED features an EIA standard package. A primary characteristic is its extra-thin profile.

• Package Height (H): 0.35 mm. This is a critical dimension for space-constrained applications.
• General Tolerances: ±0.10 mm (0.004") unless otherwise specified on the dimensional drawing.

5.2 Polarity Identification & Pad Design

The datasheet includes a suggested soldering pad layout. Proper pad design is vital for achieving a reliable solder joint, preventing tombstoning, and ensuring correct alignment during reflow. The cathode is typically marked or identified on the package, and the pad layout reflects this polarity to prevent incorrect placement.

6. Soldering & Assembly Guidelines

6.1 Reflow Soldering Profile

A suggested infrared (IR) reflow profile is provided for lead-free (Pb-free) solder processes. Key parameters include:

• Pre-heat: 120-150°C for a maximum of 120 seconds to gradually heat the assembly and activate flux.
• Peak Temperature: Maximum of 260°C.
• Time Above Liquidus: The device can withstand the peak temperature for a maximum of 5 seconds to prevent thermal damage to the epoxy lens and semiconductor die.

6.2 Manual Soldering

If hand soldering is necessary:

• Iron Temperature: Maximum 300°C.
• Soldering Time: Maximum 3 seconds per lead.
• This should be performed only once to avoid thermal stress.

6.3 Cleaning

Only specified cleaning agents should be used. Recommended solvents include ethyl alcohol or isopropyl alcohol. The LED should be immersed at normal temperature for less than one minute. Unspecified chemicals may damage the package material.

6.4 Storage Conditions

To maintain solderability and prevent moisture absorption:

• Ambient Storage: Should not exceed 30°C and 60% relative humidity.
• Out-of-Bag Life: LEDs removed from their original moisture-barrier packaging should be reflow-soldered within 672 hours (28 days).
• Extended Storage: For periods longer than 672 hours, store in a sealed container with desiccant or in a nitrogen desiccator.
• Baking: Components stored out-of-bag for >672 hrs require baking at approximately 60°C for at least 20 hours prior to soldering to remove absorbed moisture.

7. Packaging & Ordering Information

7.1 Tape and Reel Specifications

The device is supplied in industry-standard packaging for automated pick-and-place machines.

• Reel Size: 7-inch diameter.
• Tape Width: 8 mm.
• Quantity per Reel: 5000 pieces.
• Minimum Order Quantity (MOQ): 500 pieces for remainder quantities.
• Cover Tape: Empty component pockets are sealed with a top cover tape.
• Missing Components: A maximum of two consecutive missing LEDs ("missing lamps") is allowed per the specification.
• Standard: Packaging conforms to ANSI/EIA-481 specifications.

8. Application Recommendations

8.1 Intended Use

This LED is designed for ordinary electronic equipment, including office equipment, communication devices, and household applications. It is not recommended for safety-critical systems (e.g., aviation, medical life-support, transportation control) without prior consultation and qualification, as failure could jeopardize life or health.

8.2 Drive Circuit Design

LEDs are current-operated devices. For optimal performance and uniformity:

• Recommended Circuit (Model A): Incorporate a current-limiting resistor in series with each LED when connecting multiple LEDs in parallel. This compensates for the natural variation in forward voltage (Vf) from one LED to another, ensuring uniform current and therefore uniform brightness across all devices.
• Non-Recommended Circuit (Model B): Connecting multiple LEDs in parallel directly to a voltage source with a single current-limiting resistor is discouraged. Small differences in the I-V characteristics of individual LEDs can cause significant current imbalance, leading to noticeable differences in brightness and potential over-current in some devices.

8.3 Electrostatic Discharge (ESD) Protection

The LED is sensitive to ESD and power surges. Prevention measures are critical:

• Use a conductive wrist strap or anti-static gloves when handling.
• Ensure all equipment, workstations, and storage racks are properly grounded.
• Use an ionizer to neutralize static charge that may build up on the plastic lens due to handling friction.
• Symptoms of ESD Damage: Include high reverse leakage current, abnormally low forward voltage (Vf), or failure to illuminate ("no lightup") at low currents. Suspect LEDs can be tested by checking for illumination and measuring Vf at a low test current.

9. Technical Comparison & Differentiation

Key differentiating factors of this LED include:

• Ultra-Thin Profile (0.35mm): Enables use in extremely slim devices like modern smartphones, tablets, and ultra-thin displays where z-height is severely limited.
• AlInGaP Technology: Offers higher efficiency and better temperature stability for orange/red colors compared to older technologies like GaAsP, resulting in brighter output and more consistent color over temperature and drive current.
• Full SMD Process Compatibility: Designed for high-speed automated placement, vision system recognition, and standard infrared reflow soldering, integrating seamlessly into modern electronics manufacturing lines.
• Wide Binning Options: Provides designers flexibility to select the appropriate brightness (Luminous Intensity) and voltage (Forward Voltage) bin for cost optimization or performance matching in their specific application.

10. Frequently Asked Questions (FAQ)

10.1 Why is a series resistor needed for each parallel LED?

Due to manufacturing variations, no two LEDs have identical forward voltage (Vf) characteristics. Without individual resistors, the LED with the slightly lower Vf will draw disproportionately more current in a parallel configuration, becoming brighter and potentially overheating, while others remain dim. Series resistors act as ballasts to equalize the current.

10.2 What happens if I exceed the 260°C for 10 seconds reflow condition?

Excessive temperature or time can cause several failures: degradation of the epoxy lens (yellowing, cracking), damage to the internal wire bonds, or thermal stress on the semiconductor die leading to reduced lifetime or immediate failure. Always adhere to the recommended profile.

10.3 Can I use this LED outdoors?

The operating temperature range is -30°C to +85°C. While it can function in cold environments, outdoor use requires careful consideration of the full application environment, including humidity, UV exposure (which may degrade the lens), and the need for conformal coating. The datasheet specifies ordinary electronic equipment; harsh environments may require additional protection or a different product grade.

10.4 How do I interpret the Luminous Intensity value?

Luminous Intensity (measured in millicandelas, mcd) is the amount of visible light emitted in a specific direction. The value of 11.2-71.0 mcd at 5mA is the axial intensity (straight ahead). The wide 130-degree viewing angle means this light is spread over a broad area, so the axial intensity number, while important, doesn't tell the whole story about total light output. For applications needing a wide, even glow, this is beneficial.

11. Design-in Case Study

Scenario: Designing status indicator lights for a slim, handheld medical scanner. The housing depth allows only 0.5mm for the component.

Component Selection: This LED, with its 0.35mm height, fits perfectly within the mechanical constraint. The orange color provides high visibility and contrast.

Circuit Design: Four LEDs are used to indicate different operational modes (standby, scanning, error, charging). They are driven by a microcontroller GPIO pin. Following the datasheet recommendation, each LED has its own 100-ohm series resistor connected to the common 3.3V supply. This ensures all four LEDs have identical brightness regardless of minor Vf variations.

Assembly: The PCB is designed with the suggested pad layout. The assembly house uses the provided lead-free IR reflow profile. Components are kept in sealed bags until just before the production run to comply with the 672-hour floor life requirement.

Result: Reliable, uniform indicator lights that meet the slim form factor and performance requirements.

12. Technology Principle Introduction

This LED is based on AlInGaP (Aluminum Indium Gallium Phosphide) semiconductor material. When a forward voltage is applied across the p-n junction, electrons and holes are injected into the active region where they recombine. This recombination process releases energy in the form of photons (light). The specific composition of the AlInGaP alloy determines the bandgap energy of the semiconductor, which directly dictates the wavelength (color) of the emitted light—in this case, orange (~605-611 nm). The "water clear" lens is made of epoxy or silicone that is transparent to this wavelength, allowing the light to escape efficiently. The ultra-thin design is achieved through advanced package molding and die-attach techniques that minimize the vertical stack-up of materials.

13. Industry Trends

The trend in indicator and backlighting LEDs continues toward:

• Miniaturization: Even thinner and smaller packages to enable ever-slimmer end products.
• Higher Efficiency: Improving lumens per watt (lm/W) to achieve required brightness at lower currents, saving power and reducing heat generation.
• Improved Color Consistency: Tighter binning specifications and advanced semiconductor growth techniques to reduce color variation from batch to batch.
• Enhanced Reliability: Materials and designs that offer longer lifetimes and better performance under high-temperature and high-humidity conditions.
• Broadening Spectrum: Development of efficient LEDs across more of the visible spectrum and into ultraviolet (UV) and infrared (IR) ranges for specialized sensing and lighting applications.

This particular product, with its focus on thin profile and automated assembly compatibility, aligns with the ongoing miniaturization and manufacturing efficiency trends in the electronics industry.