UV LED Module 25x50x5.2mm Datasheet - 40V Forward Voltage - 360W Power - 365-410nm UV-Curing English

1. Product Overview

This UV LED module utilizes a copper substrate and quartz glass package, providing excellent thermal management and optical performance. The outer dimensions are 25 mm x 50 mm x 5.2 mm. It offers a viewing angle of 60° and complies with RoHS requirements. Each module is individually packaged for protection. Typical applications include UV curing, ink curing, UV printing, ultraviolet disinfection, and general UV exposure processes.

2. Technical Parameter Analysis

2.1 Electrical & Optical Characteristics

At a solder temperature of 25°C and forward current of 6.6 A, the forward voltage is bin C02 with a typical value of 40 V (minimum 30 V, maximum 50 V). The emitting area is 25 mm x 25 mm, with a chip arrangement of 12 series and 12 parallel (12S12P). Total radiant flux (Φe) is categorized by wavelength and bin code: for the 400-410 nm variant, bin 1A14 covers 14.5-17.5 W, 1A15 covers 17.5-21 W, and similar divisions exist for other wavelength ranges (380-390 nm, 390-400 nm, and 365-370 nm). The absolute maximum power dissipation is 360 W, peak forward current is 8.4 A (at 1/10 duty, 0.1 ms pulse), and ESD withstand voltage (HBM) is 2000 V. Operating temperature ranges from -40°C to +85°C, storage from -40°C to +100°C, and maximum junction temperature is 115°C. Thermal resistance from junction to solder point is 0.4 °C/W.

2.2 Binning System

The module is available in four wavelength groups: 365-370 nm (UBP), 380-390 nm (UEP), 390-400 nm (UHP), and 400-410 nm (UIP). Each group offers multiple radiant flux bins (e.g., 1A13 to 1A17) with specified minimum and maximum power levels. Forward voltage is also binned (C02 shown, with typical 40 V). This binning enables customers to select the exact optical and electrical performance needed for their application.

3. Performance Curves Analysis

Six typical characteristic curves are provided for the four wavelength groups (365, 385, 395, 405 nm). The forward voltage vs. forward current curve shows a near-linear increase from 36 V to 44 V as current rises to 8.4 A. The forward current vs. relative power curve demonstrates that radiant intensity increases with current, approaching saturation near the maximum rating. The solder temperature vs. relative power curve indicates a gradual decrease in output (about 20% loss) as temperature rises from 25°C to 85°C. The solder temperature vs. forward current curve defines the safe operating area, showing that allowable current must be derated above 50°C. The spectrum distribution curve shows narrow peaks with full-width at half-maximum (FWHM) of approximately 10-15 nm, centered at the specified wavelengths. The radiation diagram confirms a 60° viewing angle, with intensity dropping to 50% at ±30°.

4. Mechanical and Package Information

The package outline drawing provides top and side views. All dimensions are in millimeters with a tolerance of ±0.2 mm unless otherwise noted. The module has two electrical contact pads (anode and cathode) on the bottom side. The copper substrate acts as both the thermal path and the mounting surface. Proper alignment during assembly is critical to avoid stress on the quartz glass window.

5. Handling and Storage Guidelines

The LED is sensitive to sulfur, bromine, and chlorine compounds. The environment and mating materials must contain less than 100 ppm sulfur, less than 900 ppm each of bromine and chlorine, and the total of Br+Cl below 1500 ppm. Use only materials that do not outgas volatile organic compounds (VOCs) which can penetrate the silicone encapsulant and cause discoloration. Handle the module by the side surfaces only; do not touch or press the silicone lens. ESD protection is required during handling. The driving circuit must include current limiting resistors and avoid reverse voltage. For high-density arrays, keep the lens temperature below 45°C and the lead temperature below 65°C. Storage before opening the aluminum bag: ≤30°C, ≤75% RH, for up to one year. After opening: ≤30°C, ≤60% RH, use within 24 hours. If the moisture indicator has faded or storage time exceeded, bake at 60±5°C for ≥24 hours before use.

6. Packaging and Ordering Information

The module is packaged individually: 1 piece per antistatic bag. The bag label includes the part number, specification number, lot number, bin codes for radiant flux (Φe), forward voltage (VF), wavelength (WLP), quantity, and date code. The bags are packed in a cardboard box for shipping. Reliability testing includes thermal shock (–40°C to 100°C, 100 cycles) and life test at 25°C and 6.6 A for 1000 hours, with acceptance criteria of 0 failures out of 10 samples. Failure thresholds: VF must not exceed 1.1 times the upper specification limit, and Φe must not fall below 0.7 times the lower specification limit.

7. Application Suggestions

This UV LED module is designed for high-power applications requiring intense UV radiation in a compact form. For optimal performance, mount the module on a heatsink with thermal interface material and drive it with a constant-current source set to 6.6 A (or lower depending on thermal conditions). Select the wavelength bin according to the application: 365-370 nm for deep UV curing and disinfection, 380-390 nm for adhesive curing, 395-405 nm for general UV curing and printing. Always use UV-protective eyewear and shields.

8. Frequently Asked Questions

Q: What is the recommended operating current? A: The typical current is 6.6 A. The absolute maximum peak current is 8.4 A (pulsed). For continuous operation, ensure the junction temperature stays below 115°C by providing adequate heat sinking. Q: Can I use the 365 nm version for disinfection? A: Yes, the 365-370 nm wavelength is effective for UV disinfection, but the actual dose and exposure time must be verified for the target microorganisms. Q: What is the expected lifetime? A: The product passed a 1000-hour life test at 6.6 A and 25°C ambient. With proper thermal management, lifetimes exceeding 10,000 hours are typical in many applications.

9. Typical Use Case

In a UV curing system, multiple modules can be arranged in an array to cover a larger area. Each module is attached to a water-cooled or finned heat sink. A constant-current LED driver with over-voltage protection supplies 6.6 A per module. The modules are positioned at a distance of 20-50 mm from the substrate to achieve the required irradiance (W/cm²). A reflector may be added to concentrate the light. The system can cure UV inks or adhesives in seconds.

10. Principle of UV LED Operation

UV LEDs are semiconductor devices that convert electrical energy into ultraviolet light via electroluminescence. When forward biased, electrons and holes recombine in the active region (typically AlGaN or InGaN quantum wells), emitting photons with energy corresponding to the bandgap. The wavelength is determined by the indium or aluminum concentration. The copper substrate efficiently conducts heat away from the junction, maintaining low thermal resistance and stable output.

11. Technology Development Trends

UV LED technology continues to advance toward higher wall-plug efficiency (WPE) and longer lifetimes. Current state-of-the-art modules achieve WPE > 50% at 405 nm. New substrate materials (e.g., AlN) and improved epitaxial designs are pushing output power beyond 100 W per module while reducing cost. The market is gradually replacing traditional mercury lamps due to the advantages of instant on/off, no warm-up time, environmental friendliness, and compact system design.