UV LED RF-C65S6-U※P-AR-04 Specification - Size 6.6x6.6x4.6mm - Voltage 12.8-15.2V - Power 15.2W - UV 365-410nm

1. Product Overview

The RF-C65S6-U※P-AR-04 is a high-power ultraviolet (UV) LED designed for industrial applications requiring reliable UV radiation in the 365–410 nm wavelength range. Housed in a compact ceramic package with a quartz lens, this LED delivers excellent thermal performance and high radiant flux. The package dimensions are 6.6 mm × 6.6 mm × 4.6 mm, making it suitable for automated SMT assembly. The device offers a viewing angle of 60° and is rated for a maximum power dissipation of 15.2 W. Typical forward voltage ranges from 12.8 V to 15.2 V at 700 mA, depending on the wavelength bin. The RF-C65S6 is RoHS compliant and has a moisture sensitivity level of 3 (MSL 3).

2. Technical Parameter Analysis

2.1 Electrical and Optical Characteristics

At a solder temperature of 25°C and forward current of 700 mA, the forward voltage (VF) is binned into three subgroups: D04 (12.8–13.6 V), D05 (13.6–14.4 V), and D06 (14.4–15.2 V). The reverse current (IR) is less than 5 µA at VR = 20 V. Total radiant flux (Φe) is classified by wavelength code:

• 365–370 nm (UBP): 1B42 (3550 mW min, 4500 mW max), 1B43 (4500–6300 mW), 1B44 (6300–7100 mW)
• 380–390 nm (UEP): 1B42 (3550–4500 mW), 1B43 (4500–6300 mW), 1B44 (6300–7100 mW)
• 390–400 nm (UGP): same bins as UEP
• 400–410 nm (UIP): same bins as UEP

Measurement tolerances: VF ±0.1 V, wavelength ±2 nm, radiant flux ±10%. All measurements are performed under standardized Refond test conditions.

2.2 Absolute Maximum Ratings

The device must not exceed the following limits: power dissipation PD = 15.2 W, peak forward current IFP = 1000 mA (1/10 duty cycle, 0.1 ms pulse width), reverse voltage VR = 20 V, ESD (HBM) = 2000 V. Operating temperature range: -40°C to +80°C; storage temperature: -40°C to +100°C; junction temperature: 105°C maximum. The junction temperature must not exceed 105°C; proper thermal management is essential.

2.3 Thermal Characteristics

The thermal resistance from junction to solder point (RTHJ-S) is typically 4.5 °C/W at 700 mA. This low thermal resistance is achieved through the ceramic package design, which efficiently conducts heat away from the LED die.

3. Binning System Explanation

3.1 Voltage Bins

The forward voltage is sorted into three major bins: D04 (12.8–13.6 V), D05 (13.6–14.4 V), D06 (14.4–15.2 V). This allows customers to select LEDs with closely matched forward voltages for series or parallel configurations, minimizing current imbalance.

3.2 Radiant Flux Bins

Radiant flux is binned as 1B42 (3550–4500 mW), 1B43 (4500–6300 mW), and 1B44 (6300–7100 mW) for each wavelength range. The bin code is indicated on the product label (e.g., 1B43). Higher flux bins require better thermal management to maintain reliability.

3.3 Wavelength Bins

The product series includes four wavelength variants: UBP (365–370 nm), UEP (380–390 nm), UGP (390–400 nm), and UIP (400–410 nm). The exact wavelength code is part of the part number suffix (e.g., RF-C65S6-UBP-AR-04).

4. Performance Curve Analysis

4.1 Forward Voltage vs. Forward Current

The typical VF–IF curves at 25°C show that for 365 nm, 385 nm, 395 nm, and 405 nm versions, forward voltage increases with current. At 700 mA, VF ranges from about 12.8 V to 15.2 V depending on bin. At 1000 mA peak, VF may exceed 15.5 V.

4.2 Relative Radiant Flux vs. Forward Current

Relative output (normalized at 700 mA) increases nearly linearly with current. At 700 mA, relative intensity is 100%; at 350 mA, it drops to about 50%; at 140 mA, about 20%. This linear relationship helps in dimming applications.

4.3 Temperature Dependence

As solder temperature increases, the relative radiant flux decreases. At 105°C, the output drops to approximately 70% of the value at 25°C. The maximum forward current derating curve shows that at 80°C ambient, the allowable current is reduced to about 500 mA to keep the junction temperature below 105°C.

4.4 Spectral Distribution

The spectrum is centered at the nominal wavelength with a full width at half maximum (FWHM) of about 10–15 nm. The 365 nm version has negligible emission beyond 400 nm, while the 405 nm version extends slightly into the visible violet region.

4.5 Radiation Pattern

The viewing angle (2θ1/2) is 60°, meaning the intensity is half of the peak at ±30° from the optical axis. The radiation pattern is Lambertian-like but slightly narrower, suitable for applications requiring a moderate beam spread.

5. Mechanical and Packaging Information

5.1 Package Dimensions and Pad Design

The LED has a square body of 6.6 mm × 6.6 mm with a height of 4.6 mm. The bottom view shows two large cathode and anode pads (3.94 mm × 2.90 mm each) plus a smaller thermal pad. Polarity is indicated by a chamfer on the package. Recommended soldering patterns (footprint) are provided with dimensions; the anode pad is 6.30 mm × 3.94 mm and the cathode pad is 6.30 mm × 2.90 mm, with a gap of 0.5 mm. All tolerances are ±0.2 mm unless otherwise noted.

5.2 Carrier Tape and Reel

The LED is packaged in carrier tape with a width of 16 mm, pitch 4 mm, and pocket depth accommodating the package height. Each reel contains 1000 pieces. Reel dimensions: flange diameter 325±1 mm, hub diameter 105±1 mm, width 20±0.5 mm, arbor hole 13.0±0.5 mm.

5.3 Label Information

The label includes part number, spec number, lot number, bin code (Φe, VF, WLP), quantity, and date. The bin code provides radiant flux bin (e.g., 1B43), forward voltage bin (e.g., D05), and wavelength code (e.g., 365).

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

The recommended reflow profile: preheat from 150°C to 200°C for 60–120 seconds; ramp-up to 217°C (max 3°C/s); time above 217°C up to 60 seconds; peak temperature 260°C for a maximum of 10 seconds (within 5°C of peak for max 30 seconds); cool down at max 6°C/s. The total time from 25°C to peak should not exceed 8 minutes. Only two reflow cycles are allowed, with less than 24 hours between cycles to avoid moisture absorption.

6.2 Hand Soldering and Repair

If hand soldering is necessary, use a soldering iron set below 300°C for less than 3 seconds, and only once. Repair after reflow is not recommended; if unavoidable, use a dual-head soldering iron and verify LED characteristics beforehand.

6.3 Storage and Handling Precautions

Before opening the moisture barrier bag, store at ≤30°C and ≤75% RH for up to one year. After opening, the product must be used within 24 hours at ≤30°C/≤60% RH. If the moisture indicator card shows exposure or the storage time is exceeded, bake at 60±5°C for ≥24 hours before use. Do not apply mechanical force or vibration during cooling after soldering. Avoid rapid cooling.

7. Packaging and Ordering Information

7.1 Packaging Process

Each reel is placed in a moisture barrier bag with a desiccant and humidity indicator card. The bag is sealed and then packed in a cardboard box. The box is labeled with the product specification, quantity, and handling warnings. ESD precautions are required throughout handling.

7.2 Reliability Testing

The LED meets the following reliability criteria (sample size 10 pcs, accept 0, reject 1):

• Reflow: 260°C, 10 sec, 3 cycles (JESD22-B106)
• Thermal shock: -40°C to 100°C, 15 min dwell, 100 cycles (JESD22-A106)
• Life test: 25°C, 700 mA, 1000 hours (JESD22-A108)

Failure criteria: forward voltage > 1.1× USL; reverse current > 2.0× USL; radiant flux < 0.7× LSL.

8. Application Recommendations

The RF-C65S6 is ideal for UV curing of inks, adhesives, and coatings, as well as UV disinfection (especially 365 nm and 385 nm variants). It can also be used in phototherapy, counterfeit detection, and fluorescence excitation. For best results, design the system with adequate heat sinking to keep the solder temperature below 80°C. Use constant-current drivers with appropriate current limiting resistors. Ensure the LED is never exposed to reverse voltage during operation. In high-ambient-temperature environments, derate the forward current according to the temperature versus current curve to prevent junction overheating.

9. Comparison with Competing Technologies

Compared to conventional mercury lamps, this UV LED offers instant on/off, longer lifetime (rated for 1000 hours at 700 mA under controlled conditions), lower operating voltage, and no mercury content. The ceramic package provides better thermal conductivity than plastic packages, enabling higher power density. However, the initial cost per unit may be higher than low-power UV LEDs; the total cost of ownership is often lower due to reduced maintenance and energy consumption.

10. Frequently Asked Questions

1. Can I drive this LED at currents higher than 700 mA? The peak current can be up to 1000 mA (pulsed) but continuous operation above 700 mA may exceed the maximum junction temperature. Proper thermal management is essential.
2. What is the typical lifetime? The reliability test ensures 1000 hours at 700 mA and 25°C; actual lifetime under real conditions may be longer if junction temperature is kept below 105°C.
3. Can I use this LED for water disinfection? Yes, especially the 365 nm version, but ensure the LED is properly sealed against moisture. The LED itself is not waterproof; the system must provide environmental protection.
4. What type of solder paste is recommended? Lead-free solder with a melting point around 217°C is suitable. Use a stencil thickness of 0.1–0.15 mm to ensure proper solder volume.
5. How do I clean the LED after soldering? Use isopropyl alcohol. Do not use ultrasonic cleaning as it may damage the silicone lens or wire bonds.

11. Practical Design Cases

Case 1: UV curing array for 3D printing. A linear array of 10 LEDs (365 nm, 1B43 bin) driven at 700 mA each, with a total power of about 52 W. The LEDs are mounted on a copper MCPCB with forced air cooling. The array achieves a uniform irradiance of 200 mW/cm² over a 50 mm × 10 mm area.

Case 2: UV disinfection module. Four 385 nm LEDs (1B42 bin) are arranged in a 2×2 array with a reflector to concentrate light into a 30° beam. The module is used for surface disinfection in a medical cabinet, operating at 500 mA to reduce thermal load. The system includes a timer to ensure sufficient UV dose.

12. Underlying Principles

UV LEDs generate light through electroluminescence from a semiconductor p-n junction. The active region is typically based on AlGaN or InGaN materials, with the wavelength determined by the indium/gallium ratio. The ceramic package uses a high-thermal-conductivity substrate to extract heat from the die, and the quartz lens provides high UV transmission and mechanical protection. The LED is sensitive to ESD because of the thin depletion layer; proper ESD protection in the manufacturing and assembly process is critical.

13. Technology Trends

The UV LED market is shifting toward higher power densities and lower costs. Future developments include increased wall-plug efficiency (currently around 30–40% for UVA), longer lifetimes, and improved reliability under harsh conditions. Multi-chip modules are becoming common for high-power applications. The trend also includes integration of UV LEDs with sensors and IoT connectivity for smart disinfection systems. As the technology matures, UV LEDs will continue to replace traditional mercury lamps in more applications.