LED Lamp 334-15/X2C1-1WYB Datasheet - T-1 3/4 Package - 3.6V Max - Warm White - 110mW Power - English Technical Document

1. Product Overview

This document details the specifications for a high-performance warm white LED lamp. The device is housed in a popular T-1 3/4 round package, designed to deliver high luminous power for applications requiring bright, consistent illumination. The warm white light is achieved through a phosphor conversion process applied to an InGaN chip. Key features include robustness against electrostatic discharge (ESD up to 4KV) and compliance with relevant environmental regulations.

1.1 Core Advantages and Target Market

The primary advantage of this LED is its combination of high luminous intensity within a standard, widely adopted package. This makes it suitable for integration into existing designs without significant mechanical modifications. Its typical chromaticity coordinates (x=0.40, y=0.39) place it in the warm white region, which is often preferred for indicator and panel lighting. The target applications include message panels, optical indicators, backlighting, and marker lights, where reliability and brightness are critical.

2. Technical Parameter Deep-Dive

2.1 Absolute Maximum Ratings

The device is rated for a continuous forward current (IF) of 30 mA, with a peak forward current (IFP) of 100 mA permissible under pulsed conditions (duty cycle 1/10 at 1 kHz). The maximum reverse voltage (VR) is 5V. The total power dissipation (Pd) must not exceed 110 mW. The operational temperature range is from -40°C to +85°C, with a slightly wider storage temperature range of -40°C to +100°C. The LED can withstand an ESD (Human Body Model) voltage of up to 4 kV. The maximum soldering temperature is 260°C for 5 seconds.

2.2 Electro-Optical Characteristics

Under standard test conditions (Ta=25°C, IF=20mA), the forward voltage (VF) ranges from a minimum of 2.8V to a maximum of 3.6V. The luminous intensity (IV) has a typical value of 14250 mcd, with a maximum specified up to 28500 mcd. The viewing angle (2θ1/2) is typically 15 degrees, indicating a relatively focused beam. The reverse current (IR) at VR=5V is a maximum of 50 µA. A Zener diode feature is present, with a reverse voltage (Vz) of 5.2V typical at Iz=5mA.

3. Binning System Explanation

The LEDs are categorized into bins based on key parameters to ensure consistency in application.

3.1 Luminous Intensity Binning

Luminous intensity is sorted into three primary bins: Code W (14250 - 18000 mcd), Code X (18000 - 22500 mcd), and Code Y (22500 - 28500 mcd). A general tolerance of ±10% applies to the luminous intensity measurement.

3.2 Forward Voltage Binning

Forward voltage is classified into four bins: Code 0 (2.8 - 3.0V), Code 1 (3.0 - 3.2V), Code 2 (3.2 - 3.4V), and Code 3 (3.4 - 3.6V). The measurement uncertainty for this parameter is ±0.1V.

3.3 Color Binning

The color characteristics are defined within the CIE 1931 chromaticity diagram. Specific color ranks are provided (D1, D2, E1, E2, F1, F2), each with defined coordinate boundaries. These are grouped together (Group 1: D1+D2+E1+E2+F1+F2) for selection. The measurement uncertainty for color coordinates is ±0.01.

4. Performance Curve Analysis

The datasheet includes several characteristic curves plotted at Ta=25°C.

4.1 Relative Intensity vs. Wavelength

This curve shows the spectral power distribution of the emitted warm white light, typically peaking in the blue region from the chip and exhibiting a broad phosphor-converted emission in the yellow/red spectrum.

4.2 Directivity Pattern

The radiation pattern illustrates the spatial distribution of light, confirming the 15-degree typical viewing angle with a specific intensity profile.

4.3 Forward Current vs. Forward Voltage (IV Curve)

This graph shows the non-linear relationship between the current flowing through the LED and the voltage drop across it, which is crucial for designing appropriate current-limiting circuitry.

4.4 Relative Intensity vs. Forward Current

This curve demonstrates how the light output increases with driving current, important for understanding efficiency and setting operating points.

4.5 Chromaticity Coordinate vs. Forward Current

This plot shows the stability or shift of the color coordinates (x, y) as the driving current changes, which is vital for color-critical applications.

4.6 Forward Current vs. Ambient Temperature

This curve indicates the derating of the maximum permissible forward current as the ambient temperature increases, essential for thermal management and reliability.

5. Mechanical and Package Information

The LED uses a standard T-1 3/4 (approximately 5mm) round package with two axial leads. Key dimensional notes include: all dimensions are in millimeters with a general tolerance of ±0.25mm unless specified otherwise; lead spacing is measured at the point where the leads emerge from the package body; and the maximum protrusion of resin under the flange is 1.5mm. A detailed dimensioned drawing is provided for reference in design and footprint creation.

6. Soldering and Assembly Guidelines

6.1 Lead Forming

Leads should be bent at a point at least 3mm from the base of the epoxy bulb. Forming must be done before soldering. Stress on the package during forming must be avoided to prevent damage or breakage. Leadframes should be cut at room temperature. PCB holes must align precisely with the LED leads to avoid mounting stress.

6.2 Storage

LEDs should be stored at 30°C or less and 70% relative humidity or less. The recommended storage life after shipment is 3 months. For longer storage (up to one year), use a sealed container with a nitrogen atmosphere and desiccant. Avoid rapid temperature changes in high humidity to prevent condensation.

6.3 Soldering

Maintain a distance of more than 3mm from the solder joint to the epoxy bulb. Soldering beyond the base of the tie bar is recommended. For hand soldering, use an iron tip at a maximum of 300°C (30W max.) for no more than 3 seconds. For dip soldering, preheat to a maximum of 100°C for up to 60 seconds.

7. Packaging and Ordering Information

7.1 Packaging Specification

The LEDs are packed in anti-static bags. Each bag contains a minimum of 200 to a maximum of 500 pieces. Five bags are packed into one inner carton. Ten inner cartons are packed into one outside carton.

7.2 Label Explanation

Packaging labels include fields for: Customer's Production Number (CPN), Production Number (P/N), Packing Quantity (QTY), Ranks of Luminous Intensity and Forward Voltage (CAT), Color Rank (HUE), Reference (REF), and Lot Number (LOT No).

7.3 Model Number Designation

The part number follows the structure: 334-15/X2C1-□□□□. The blank digits likely correspond to specific binning codes for luminous intensity, forward voltage, and color rank, allowing precise selection of device characteristics.

8. Application Suggestions

8.1 Typical Application Scenarios

This LED is ideal for applications requiring a compact, bright, warm white point source. This includes status indicators on industrial equipment, backlighting for small legends on panels or switches, message displays where individual pixels need to be clearly visible, and marker or position lights.

8.2 Design Considerations

Designers must implement proper current limiting, typically using a series resistor or constant current driver, based on the forward voltage characteristics and desired brightness. The narrow viewing angle should be considered for light distribution. Thermal management is important if operating near maximum ratings or in elevated ambient temperatures; the derating curve must be followed. For color-sensitive applications, selecting a specific color bin (HUE) is recommended.

9. Technical Comparison and Differentiation

Compared to generic 5mm LEDs, this device offers significantly higher luminous intensity, making it suitable for applications where higher brightness is needed without increasing package size. The inclusion of a Zener diode for reverse voltage protection can be a differentiating factor in circuit designs sensitive to voltage transients. The detailed binning system for intensity, voltage, and color provides a level of consistency and selectivity that is advantageous for professional and volume production applications.

10. Frequently Asked Questions (Based on Technical Parameters)

Q: What is the recommended operating current?

A: The electro-optical characteristics are specified at IF=20mA, which is a common and reliable operating point. The maximum continuous current is 30 mA.

Q: How do I interpret the luminous intensity bins?

A: The bin code (W, X, Y) on the label or part number indicates the guaranteed minimum and maximum luminous intensity range for that specific LED when driven at 20mA. Select the bin that meets your application's brightness requirements.

Q: Can I drive this LED with a 5V supply?

A: Not directly without a current-limiting resistor. Since the forward voltage is typically around 3.2V, a series resistor must be calculated to limit the current to the desired value (e.g., 20mA) based on the supply voltage (5V) and the LED's VF.

Q: What does the 4KV ESD rating mean?

A: It means the LED can withstand an electrostatic discharge of up to 4000 Volts using the Human Body Model (HBM) test method. This indicates good handling robustness, but standard ESD precautions during assembly are still recommended.

11. Practical Use Case Example

Scenario: Designing a high-visibility status indicator panel for an outdoor kiosk. The panel requires small, bright indicators that are visible in daylight. The designer selects this LED for its high luminous intensity (potentially choosing bin Y for maximum brightness). A constant current driver set to 20mA is used to ensure consistent brightness across all indicators and over temperature variations. The narrow 15-degree viewing angle helps concentrate the light toward the user's expected line of sight. The warm white color is chosen for a clear, non-harsh indication. The LEDs are mounted on a PCB with correctly sized holes, and leads are formed carefully according to the guidelines before wave soldering.

12. Operating Principle Introduction

This is a phosphor-converted white LED. The core is a semiconductor chip made of Indium Gallium Nitride (InGaN), which emits blue light when forward biased (electrical current passes through it). This blue light is not emitted directly. Instead, it strikes a layer of phosphor material (a yellow-emitting phosphor like YAG:Ce) that is deposited inside the LED package's reflector cup. The phosphor absorbs a portion of the blue photons and re-emits light at longer, yellow wavelengths. The mixture of the remaining blue light and the converted yellow light is perceived by the human eye as warm white light. The specific ratios of phosphor and its composition determine the exact color temperature and chromaticity coordinates.

13. Technology Trends Context

Phosphor-converted white LEDs, especially those based on blue InGaN chips, represent the dominant technology for general white lighting and indicators. The trend in such components is towards ever-higher luminous efficacy (more light output per electrical watt), improved color rendering index (CRI) for better color accuracy, and tighter binning tolerances for greater consistency in mass production. While newer package types like surface-mount devices (SMDs) are prevalent, through-hole packages like the T-1 3/4 remain important for applications requiring manual assembly, high-power handling in a simple form factor, or easy field replacement. The integration of protection features like Zener diodes, as seen in this device, is a common practice to enhance reliability in real-world electrical environments.