White LED 1.6x0.8x0.4mm Specification - Forward Voltage 2.6-3.4V - Power 68mW - English Datasheet

1. Product Overview

This product is a white light emitting diode (LED) fabricated using a blue chip and phosphor conversion technology. It comes in an ultra-compact surface mount package with dimensions of 1.6mm x 0.8mm x 0.4mm, making it suitable for space-constrained applications. The LED is designed for all SMT assembly and soldering processes, offering an extremely wide viewing angle of 140 degrees. It is RoHS compliant and has a moisture sensitivity level of 3.

Key Features:

• Extremely wide viewing angle for uniform illumination.
• Compatible with standard SMT assembly and reflow soldering.
• Moisture sensitivity level: Level 3 (168 hours floor life after opening bag).
• RoHS compliant, free from hazardous substances.

Applications:

• Optical indicators in consumer electronics.
• Switches, symbols, and display backlighting.
• General purpose lighting and decorative illumination.

2. Technical Parameters

The following parameters are measured at a test condition of IF = 5 mA and Ts = 25°C unless otherwise noted.

2.1 Electrical & Optical Characteristics

2.2 Absolute Maximum Ratings

3. Binning System (Forward Voltage & Luminous Intensity)

The LEDs are sorted into bins based on forward voltage and luminous intensity to ensure consistency in applications. At IF=5mA, forward voltage is divided into 8 bins (F1, F2, G1, G2, H1, H2, I1, I2) covering a range from 2.6V to 3.4V in increments of 0.1V per bin. Luminous intensity is sorted into 4 bins (1AP: 90-120 mcd, G20: 120-150 mcd, 1AW: 150-200 mcd, 1AX: 200-250 mcd). Additionally, color coordinates are binned according to the CIE 1931 chromaticity diagram, with specific bins such as B01-B06 and K01-K06 covering correlated color temperature regions.

4. Performance Curves & Analysis

The datasheet provides typical optical and electrical characteristics curves for engineering reference:

• Forward Voltage vs Forward Current: Shows the typical VF increase with current, indicating the diode behavior.
• Forward Current vs Relative Intensity: Demonstrates that relative luminous intensity increases roughly linearly with forward current up to 20 mA.
• Pin Temperature vs Relative Intensity: Illustrates intensity drop as junction temperature rises, with about 10% reduction at 85°C relative to 25°C.
• Pin Temperature vs Forward Current: Provides derating information for safe operation at higher temperatures.
• Forward Current vs Dominant Wavelength: Shows a slight shift in dominant wavelength with current; for white LEDs this is minimal.
• Relative Intensity vs Wavelength: The spectrum shows a broad emission peak centered around 450 nm (blue) and a wider peak from phosphor, producing white light.
• Radiation Pattern: Wide viewing angle of 140° (half-intensity angle), with symmetric distribution.

5. Mechanical & Packaging Information

The LED package dimensions are 1.6 mm (L) × 0.8 mm (W) × 0.4 mm (H) with tolerances of ±0.2 mm. The package has two terminals (anode and cathode) marked by a polarity indicator on the bottom view. Recommended soldering pad pattern is provided in the datasheet: two rectangular pads of 0.8 mm × 0.8 mm spaced at 2.4 mm pitch.

5.1 Carrier Tape & Reel

LEDs are packaged in carrier tape with 8 mm width, 4 mm pitch, and 1.75 mm sprocket hole spacing. The reel diameter is 178 mm, width 8 mm, with a hub diameter of 60 mm. Each reel contains 4,000 pieces. The label includes part number, spec number, lot number, bin code (flux, chromaticity, VF, wavelength), quantity, and date.

5.2 Moisture Resistant Packaging

The reel is placed in a moisture barrier bag with desiccant and humidity indicator card, then sealed. Recommended storage conditions before opening: ≤30°C and ≤75% RH, valid for 1 year from date of sealing. After opening, floor life is 168 hours at ≤30°C/≤60% RH. If the floor life is exceeded, baking at 60±5°C for ≥24 hours is required before use.

6. Soldering & Assembly Guidelines

Recommended reflow soldering profile is based on JEDEC standard. Key parameters: preheat from 150°C to 200°C for 60-120 seconds; ramp-up rate ≤3°C/s; time above 217°C (TL) ≤60 seconds; peak temperature 260°C for ≤10 seconds; cooling rate ≤6°C/s. Total time from 25°C to peak ≤8 minutes. Reflow soldering should not exceed two times. If the interval between two reflows exceeds 24 hours, baking is required to avoid moisture damage.

For hand soldering, use a soldering iron at ≤300°C for ≤3 seconds, and only once. Do not apply mechanical stress during cooling.

7. Reliability Test & Qualification

The LED has passed standard reliability tests per JEDEC specifications:

• Reflow soldering: 260°C, 10 sec, 2 cycles (0/1 reject).
• Temperature cycle: -40°C ↔ 100°C, 100 cycles.
• Thermal shock: -40°C ↔ 100°C, 300 cycles.
• High temperature storage: 100°C for 1000 hours.
• Low temperature storage: -40°C for 1000 hours.
• Life test: Ta=25°C, IF=5mA for 1000 hours.

Failure criteria: VF > 1.1×USL, IR > 2.0×USL, flux < 0.7×LSL.

8. Application Design Considerations

To ensure optimal performance and reliability, the following points should be considered:

• Current Limiting: Always use a series resistor to limit forward current to ≤20 mA. Small voltage variations can cause large current changes without proper ballasting.
• Thermal Management: Heat generation degrades luminous efficiency and color stability. Adequate PCB copper area and thermal vias are recommended. The junction temperature must not exceed 95°C.
• Protection Against Reverse Voltage: The LED must not be subjected to reverse voltage above 5V. Use proper driver design to avoid reverse bias during switching.
• Environmental Compatibility: Avoid exposure to sulfur compounds (>100 ppm), bromine (>900 ppm), chlorine (>900 ppm), and VOCs that can attack the silicone encapsulant. Adhesives must not outgas organic vapors.
• ESD Protection: The LED has an ESD rating of 1000V (HBM). Use proper ESD control measures during handling and assembly.

9. Comparison with Similar Products

The key differentiator of this LED is its extremely wide viewing angle (140° half-angle), which is wider than many standard 120° LEDs. This makes it ideal for applications requiring uniform light distribution without hotspots. The compact 1.6×0.8 mm footprint is among the smallest in the industry, enabling high-density PCB designs. The forward voltage binning allows tight control of power consumption, and the luminous intensity binning ensures consistent brightness in mass production.

10. Frequently Asked Questions

1. What is the maximum soldering temperature? 260°C for 10 seconds maximum. Reflow can be done twice.
2. Can I use this LED with a 3.3V supply? Yes, but a series resistor is required to limit current to ≤20 mA. The forward voltage at typical conditions is around 2.7-3.2V depending on bin.
3. What is the typical lifespan? Under rated conditions (5mA, 25°C), the LED can last over 50,000 hours; high temperature or high current will reduce lifetime.
4. Is the LED compatible with lead-free solder? Yes, the peak temperature of 260°C is suitable for lead-free reflow profiles.
5. How should I store unused LEDs? Keep in sealed moisture barrier bag at ≤30°C/≤75% RH. Use within 1 year. After opening, mount within 168 hours or bake before use.

11. Practical Application Case Study

Consider a small indicator panel with 10 LEDs. Each LED is driven at 5 mA from a 5V supply. Using a typical VF of 3.0V (H1 bin), the required series resistor is (5-3)/0.005 = 400 Ω. With a viewing angle of 140°, the display is visible from a wide angle. The compact 1.6×0.8 mm package allows placement on a 0.5 mm pitch array. The wide beam pattern ensures uniform brightness across the panel without additional diffusers.

12. Operating Principle

This white LED is based on a blue InGaN (Indium Gallium Nitride) chip that emits light at approximately 450-460 nm. The blue light excites a yellow-emitting phosphor (typically YAG:Ce) which down-converts part of the blue light to a broad yellow spectrum. The combination of blue and yellow light produces white light with a correlated color temperature typically in the range of 5000-7000 K. The phosphor is mixed with a silicone encapsulant that also serves as a lens to shape the beam.

13. Technology Trends

The LED industry continues to push toward higher efficacy, smaller packages, and better color consistency. This product follows the trend of miniaturization (1.6×0.8 mm) suitable for consumer electronics. Future developments may include chip-scale packages (CSP) and phosphor-on-chip integration to further reduce size and improve thermal performance. Additionally, advanced phosphors will enable higher CRI and tunable color temperatures.