Table of Contents
- 1. Product Overview
- 1.1 General Description
- 1.2 Features
- 1.3 Applications
- 2. Technical Parameters – In-depth Objective Analysis
- 2.1 Forward Voltage (VF)
- 2.2 Luminous Intensity (IV)
- 2.3 Viewing Angle
- 2.4 Reverse Current and Thermal Resistance
- 2.5 Absolute Maximum Ratings
- 3. Binning System
- 3.1 Forward Voltage Bins
- 3.2 Luminous Intensity Bins
- 3.3 Chromaticity Bins
- 4. Performance Curves Analysis
- 4.1 Forward Voltage vs. Forward Current
- 4.2 Forward Current vs. Relative Intensity
- 4.3 Temperature Effects
- 4.4 Wavelength and Spectral Distribution
- 4.5 Radiation Pattern
- 5. Mechanical and Packaging Information
- 5.1 Package Dimensions
- 5.2 Solder Pad Design
- 5.3 Polarity
- 6. Assembly and Soldering Guidelines
- 6.1 Reflow Soldering Profile
- 6.2 Handling Precautions
- 6.3 Storage Conditions
- 7. Packaging and Ordering Information
- 7.1 Packaging Details
- 7.2 Label Information
- 7.3 Ordering Code
- 8. Reliability Test Summary
- 9. Design Considerations
- 9.1 Current and Thermal Derating
- 9.2 Circuit Protection
- 9.3 Material Compatibility
- 10. Operating Principle
- 11. Environmental and Regulatory Considerations
- 12. Frequently Asked Questions (FAQ)
- 12.1 What is the typical lifetime of this LED?
- 12.2 Can I use this LED for high-power illumination?
- 12.3 How do I choose the correct bin for my design?
- 12.4 What happens if I exceed the absolute maximum ratings?
- 13. Case Studies (Illustrative Examples)
- 13.1 Indicator Light in a Consumer Appliance
- 13.2 Automotive Switch Backlighting
- 14. Future Development Trends
- LED Specification Terminology
- Photoelectric Performance
- Electrical Parameters
- Thermal Management & Reliability
- Packaging & Materials
- Quality Control & Binning
- Testing & Certification
1. Product Overview
The white LED series RF-BWB190DS-DD is a high-performance surface-mount device (SMD) designed using a blue InGaN chip coated with phosphor to produce white light. Its compact package dimensions of 1.6mm x 0.8mm x 0.7mm make it ideal for space-constrained applications, enabling high-density PCB layouts. The LED is designed for all standard SMT assembly and solder processes, offering a wide viewing angle of 140° and moisture sensitivity level 3 (MSL 3). It is fully RoHS compliant, ensuring environmental compatibility.
1.1 General Description
This white LED is fabricated by exciting a blue chip with a phosphor layer, which converts part of the blue light to yellow and green wavelengths, producing a broad white spectrum. The product is available in multiple brightness and color bins to meet various application requirements. The package design includes a clear silicone encapsulation that enhances light extraction and reliability.
1.2 Features
- Extremely wide viewing angle: 140 degrees, suitable for indicator and backlight applications.
- Compatible with all standard SMT assembly and solder processes (reflow compatible up to 260°C).
- Moisture sensitivity level: Level 3 (per J-STD-020), with storage conditions as specified.
- RoHS compliant; free of lead, mercury, cadmium, and other hazardous substances.
- Low thermal resistance: 450°C/W typ, requiring careful thermal management in a design.
- Electrostatic discharge (ESD) withstand: 1000V (HBM), providing reasonable ESD robustness.
1.3 Applications
- Optical indicators: status lights, pushbutton illumination.
- Switch and symbol backlighting: automotive, consumer electronics, industrial panels.
- General illumination: decorative lighting, emergency sign lighting.
- Display backlighting: small LCD or segment displays.
2. Technical Parameters – In-depth Objective Analysis
The electrical and optical characteristics are a measured at an ambient temperature of 25°C unless otherwise noted. The LED is specified at a test current of 20 mA (DC).
2.1 Forward Voltage (VF)
The forward voltage is binned into multiple ranges (F2 through J1) covering from 2.7V min to 3.5V max, with typical values between 2.8V and 3.4V. This wide bin range accommodates variations in manufacturing and allows customers to select voltage groups for series/parallel designs. The tolerance on measurement is ±0.1V. At the absolute maximum rating, forward current can reach up to 30 mA continuous, but the specified test condition is 20 mA for typical performance.
2.2 Luminous Intensity (IV)
Luminous intensity bins range from 1BE (550 mcd min) to 1FB (950 mcd min, up to 1000 mcd max), measured at 20 mA. Higher intensity bins are achieved by tighter phosphor control and chip selection. The measurement tolerance is ±10%. For applications requiring consistent brightness, it is recommended to specify a single intensity bin.
2.3 Viewing Angle
The viewing angle (2θ1/2) is 140 degrees typical, indicating a very wide emission pattern. This makes the LED suitable for applications where the indicator must be visible from a wide range of angles, such as in dashboard lighting or street furniture.
2.4 Reverse Current and Thermal Resistance
Reverse current is limited to a maximum of 10 µA at VR = 5V (pulse measurement). Thermal resistance from junction to solder point (RTHJ-S) is 450°C/W maximum. This relatively high value means that the LED is not suitable for high-power operation without adequate heatsinking; the maximum power dissipation is 105 mW. Designers must ensure that the junction temperature does not exceed 95°C.
2.5 Absolute Maximum Ratings
- Power Dissipation: 105 mW
- Forward Current: 30 mA (DC), 60 mA peak (10% duty, 0.1ms pulse)
- ESD (HBM): 1000 V
- Operating Temperature: -40°C to +85°C
- Storage Temperature: -40°C to +85°C
- Junction Temperature: 95°C maximum
Exceeding any of these ratings can cause permanent damage. Proper current limiting resistors and thermal management are essential.
3. Binning System
The LED is sorted into bins for forward voltage, luminous intensity, and color coordinates to provide tighter performance adherence.
3.1 Forward Voltage Bins
Forward voltage is grouped into codes F2, G1, G2, H1, H2, I1, I2, J1 spanning from 2.7-2.8V to 3.4-3.5V. Each bin is 0.1V wide. This enables users to select a narrow voltage range for consistent current distribution in parallel strings.
3.2 Luminous Intensity Bins
Intensity bins are labeled 1BE (550-600 mcd) through 1FB (950-1000 mcd), with increments of 50 mcd per bin. Higher bins are available upon request but may require special ordering.
3.3 Chromaticity Bins
The LED is offered in several white color bins (W31, W32, W51, W52, W71, W72) defined by specific CIE 1931 coordinates. These bins cover a range of correlated color temperatures (CCT) from approximately 6000K to 3000K, suitable for various white balance preferences. The tolerance on color coordinates is ±0.005.
4. Performance Curves Analysis
Typical optical characteristics are provided in the datasheet curves. Key insights:
4.1 Forward Voltage vs. Forward Current
The VF-IF curve shows a typical forward voltage of about 3.2V at 20 mA. At lower currents (e.g., 5 mA), VF drops to approximately 2.8V. At 30 mA, VF rises to about 3.4V. This emphasizes the importance of using a constant current driver or a current-limiting resistor to prevent thermal runaway.
4.2 Forward Current vs. Relative Intensity
Relative luminous intensity increases almost linearly with forward current up to about 30 mA. At 20 mA, the intensity is approximately 100% (relative). At 10 mA, it reduces to about 50%. This linearity makes the LED suitable for dimming by current reduction.
4.3 Temperature Effects
As the pin temperature rises, relative intensity decreases. At 85°C (pin temperature), intensity drops to about 80% of the 25°C value. Forward voltage also decreases with temperature, which can cause current increase if voltage is not regulated. Thermal design must keep the junction below 95°C.
4.4 Wavelength and Spectral Distribution
The spectral curve peaks around 450 nm (blue) with a broad secondary peak from 500-700 nm (yellow/red) due to phosphor. The dominant wavelength shifts slightly with current: higher current increases the blue component, moving the color towards cooler white.
4.5 Radiation Pattern
The radiation pattern is Lambertian-like with a wide half-angle of 70° (140° total). The relative intensity at 90° is still about 10% of the on-axis value, indicating very wide coverage.
5. Mechanical and Packaging Information
5.1 Package Dimensions
- Length: 1.60 mm
- Width: 0.80 mm
- Height: 0.70 mm (body), 0.80 mm with solder pads
- Tolerances: ±0.2 mm unless otherwise noted
5.2 Solder Pad Design
The recommended soldering pattern includes two rectangular pads (0.8mm x 0.8mm) with a center-to-center distance of 2.4 mm. The cathode is identified by a notch on the bottom view.
5.3 Polarity
The LED polarity is marked by a green dot or notch on the cathode side. Incorrect polarity can cause damage; always verify orientation before soldering.
6. Assembly and Soldering Guidelines
6.1 Reflow Soldering Profile
Solder reflow must follow the specified profile:
- Average ramp-up rate: max 3°C/s (from Tsmin to Tp)
- Preheat: 150°C to 200°C for 60-120 seconds
- Time above 217°C: max 60 seconds
- Peak temperature: 260°C, max 10 seconds
- Cooling rate: max 6°C/s
- Total time from 25°C to peak: max 8 minutes
Reflow must not exceed two times. If more than 24 hours elapse between soldering cycles, the LEDs must be re-baked to remove moisture. Manual soldering: temperature below 300°C, duration under 3 seconds, one time only.
6.2 Handling Precautions
- Do not apply mechanical stress to the LED during or after soldering.
- Avoid rapid cooling after reflow.
- Do not mount LEDs on warped PCBs; do not warp the PCB after soldering.
- Use ESD protection throughout handling.
- Ensure operating environment sulfur content < 100 ppm; bromine and chlorine each < 900 ppm, total < 1500 ppm (advised, not guaranteed).
- Avoid volatile organic compounds (VOCs) that can damage the silicone encapsulant.
6.3 Storage Conditions
- Before opening moisture barrier bag: ≤30°C, ≤75% RH, shelf life 1 year from date.
- After opening: ≤30°C, ≤60% RH, usable for 168 hours.
- If conditions exceeded, bake at 60±5°C for ≥24 hours before use.
7. Packaging and Ordering Information
7.1 Packaging Details
Standard packaging: 4,000 pieces per reel. Carrier tape dimensions: 8 mm width, 2.0 mm sprocket hole pitch, 4.0 mm component pitch. Reel dimensions: 178 mm diameter (7"), 60 mm hub diameter, 13 mm hub hole.
7.2 Label Information
Each reel is labeled with Part Number, Spec Number, Lot Number, Bin Code (including lumen flux, chromaticity, forward voltage, wavelength), quantity, and date code.
7.3 Ordering Code
The model RF-BWB190DS-DD specifies the series. For exact bin selection, consult with sales; custom bins may be available.
8. Reliability Test Summary
The LED has passed the following reliability tests (22 samples each, acceptance criteria 0/1):
- Reflow: 260°C, 10 sec, 2 times
- Temperature Cycle: -40°C to 100°C, 100 cycles
- Thermal Shock: -40°C to 100°C, 300 cycles
- High Temp Storage: 100°C, 1000 hrs
- Low Temp Storage: -40°C, 1000 hrs
- Life Test: 25°C, 20 mA, 1000 hrs
Failure criteria: VF change > 10%, IR > 2x spec, luminous flux < 70% of initial.
9. Design Considerations
9.1 Current and Thermal Derating
To ensure long life, operate the LED at no more than 20 mA continuous. Use a current-limiting resistor or constant current driver. For high ambient temperatures, reduce the forward current to keep junction temperature below 95°C. The thermal pad (solder point) should have good heat sinking to the PCB copper plane.
9.2 Circuit Protection
Always include a series resistor to limit current. When used in arrays, binning for forward voltage is critical to avoid current hogging. ESD protection diodes on the driving circuit are recommended for harsh environments.
9.3 Material Compatibility
Avoid silicone encapsulant contact with aggressive chemicals (e.g., strong acids/bases, solvents). Use adhesives that do not outgas organic vapors. Seal the LED assembly from sulfur and halogen contaminants.
10. Operating Principle
The white LED operates by electroluminescence: a forward bias causes electrons and holes to recombine in the InGaN blue chip, emitting blue photons (around 450 nm). These photons strike a phosphor layer (typically YAG:Ce) that absorbs part of the blue light and re-emits in a broad yellow-green spectrum. The combination of transmitted blue and yellow emission produces white light. The phosphor composition determines the correlated color temperature and color rendering index.
11. Environmental and Regulatory Considerations
The product complies with RoHS and does not contain intentionally added lead, mercury, cadmium, hexavalent chromium, PBB, or PBDE. However, the phosphor may contain small amounts of cerium, which is exempt. Users must comply with local regulations for disposal. The LED is not classified as hazardous under current REACH and WEEE directives.
12. Frequently Asked Questions (FAQ)
12.1 What is the typical lifetime of this LED?
Under rated conditions (20 mA, Tj < 85°C), the LED can last over 50,000 hours with < 30% lumen depreciation, based on industry data for similar products.
12.2 Can I use this LED for high-power illumination?
No, the maximum power is 105 mW. It is designed for indicator and signal applications, not general lighting.
12.3 How do I choose the correct bin for my design?
Select voltage bins to match your driving voltage and tolerances; choose intensity bins for brightness consistency; select chromaticity bins for color uniformity. For series strings, use the same voltage bin.
12.4 What happens if I exceed the absolute maximum ratings?
Exceeding ratings can cause immediate failure, premature degradation, or color shift. Always include safety margins.
13. Case Studies (Illustrative Examples)
13.1 Indicator Light in a Consumer Appliance
A washing machine manufacturer used the 1.6x0.8mm white LED for the power-on indicator. The wide viewing angle allowed visibility from any direction. They selected the H1 voltage bin (3.0-3.1V) and used a 150Ω series resistor with a 5V supply, delivering 13 mA, prolonging the LED life to match the appliance warranty.
13.2 Automotive Switch Backlighting
An automotive tier-1 supplier used this LED for backlighting window switches. The 140° viewing angle ensured even illumination. They required color bin W31 (cool white) to match the dashboard color temperature. They implemented a PWM dimming at 200 Hz to adjust brightness at night. The LED passed 85°C temperature cycling tests in compliance with AEC-Q101 (equivalent).
14. Future Development Trends
The trend for such small white LEDs is towards higher efficacy and better color stability. Future versions may achieve 150 lm/W efficacy by using more efficient phosphors (e.g., nitride red-green phosphors for high CRI) and improved chip designs. Miniaturization continues, with 1005 (1.0x0.5mm) and 0603 packages becoming common. The industry is also moving towards standardized chromaticity bins (MacAdam ellipses) to reduce color variation.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |