LED White 2.8x3.5x0.8mm 3.2V 0.612W PLCC2 Specification - Automotive Grade Data Sheet

1. Product Overview

This white LED is fabricated using a blue chip combined with phosphor, resulting in a compact PLCC2 package with dimensions of 2.80 mm x 3.50 mm x 0.80 mm. It is designed for automotive interior and exterior lighting applications, offering an extremely wide viewing angle and suitability for all standard SMT assembly and solder processes. The device comes on tape and reel packaging, has a moisture sensitivity level of 2, and complies with RoHS and REACH requirements. Additionally, the product qualification test plan follows the guidelines of AEC-Q102 Stress Test Qualification for Automotive Grade Discrete Semiconductors, ensuring high reliability in harsh environments.

2. In-Depth Technical Parameter Analysis

2.1 Electrical and Optical Characteristics (Ts=25°C)

Key parameters measured at a test current of 150 mA include:

• Forward Voltage (VF): Min 2.8 V, Typ 3.2 V, Max 3.4 V
• Reverse Current (IR): Typ <10 µA at VR=5V
• Luminous Flux (Φ): Min 61.2 lm, Typ 72 lm, Max 83.7 lm
• Viewing Angle (2θ1/2): Typ 120°
• Thermal Resistance (Rth JS real): Typ 27°C/W, Max 35°C/W
• Thermal Resistance (Rth JS el): Typ 16°C/W, Max 21°C/W

Note: Measurement tolerances apply: VF ±0.1V, color coordinates ±0.005, luminous flux ±10%.

2.2 Absolute Maximum Ratings

• Power Dissipation (PD): 612 mW
• Forward Current (IF): 180 mA (DC), 350 mA (peak, 1/10 duty, 10ms pulse)
• Reverse Voltage (VR): 5 V
• ESD (HBM): 2000 V
• Operating Temperature (TOPR): -40°C to +110°C
• Storage Temperature (TSTG): -40°C to +110°C
• Junction Temperature (TJ): 125°C

3. Binning System Description

3.1 Forward Voltage Bins (IF=150mA)

• G0: 2.8–3.0 V
• H0: 3.0–3.2 V
• I0: 3.2–3.4 V

3.2 Luminous Flux Bins (IF=150mA)

• PB: 61.2–67.8 lm
• QA: 67.8–75.3 lm
• QB: 75.3–83.7 lm

3.3 Chromaticity Bins

Color coordinates are divided into 7 bins (VM1 to VM7) defined on the CIE 1931 diagram. For exact x/y coordinates, please refer to the table in the datasheet. These bins cover the near-white region around the black body locus, ensuring consistent color appearance.

4. Performance Curves Analysis

4.1 Forward Voltage vs Forward Current

The IV curve shows a typical exponential increase in current with voltage. At 2.8 V the current is near zero, while at 3.4 V it reaches about 180 mA (the DC maximum). A small voltage shift causes a large current change, so current regulation is recommended.

4.2 Relative Luminous Flux vs Forward Current

Relative flux increases almost linearly with current up to 180 mA, reaching about 1.8 times the flux at 60 mA. The curve indicates good efficacy at moderate drive currents.

4.3 Relative Luminous Flux vs Junction Temperature

Flux decreases with increasing junction temperature. At 125°C the flux drops to about 75% of the value at 25°C. Thermal management is critical to maintain brightness.

4.4 Forward Current vs Solder Temperature

The maximum allowed forward current must be derated as solder temperature rises. The curve shows that at 110°C the allowed current is reduced to about 60 mA.

4.5 Voltage Shift vs Junction Temperature

Forward voltage decreases linearly with temperature at a rate of roughly -2 mV/°C, which is typical for LEDs.

4.6 Radiation Pattern

The radiation pattern is nearly Lambertian with a half-angle of 60 degrees (120° viewing angle). Intensity at ±90° is less than 10% of the peak.

4.7 Chromaticity Coordinate Shift

Both Cx and Cy shift slightly with temperature and current. Over a 150°C range the shift is within ±0.01 for Cx and ±0.005 for Cy. This small shift ensures stable color over operating conditions.

4.8 Spectrum Distribution

The white LED spectrum covers from 400 nm to 750 nm, with a peak around 450 nm (blue chip) and a broad phosphor emission in the green-yellow region. This results in a high color rendering index suitable for automotive lighting.

5. Mechanical and Packaging Information

5.1 Package Dimensions

The LED body is 2.80 mm x 3.50 mm x 0.80 mm. The recommended PCB pad layout is provided in the datasheet: overall pad dimensions 2.45 mm x 2.30 mm with a central thermal pad and two side pads for anode/cathode. Polarity is indicated by a notch on the side view.

5.2 Carrier Tape and Reel

Components are supplied in 8 mm wide carrier tape with a 4 mm pitch. The reel has a diameter of 178 mm, hub width 60 mm, and spindle hole 13 mm. Each reel contains 4000 pieces.

5.3 Label Specification

The label includes part number, lot number, bin codes (luminous flux, chromaticity, forward voltage), wavelength code, quantity, and date.

6. Soldering and Assembly Guidelines

6.1 Recommended Reflow Profile

• Ramp-up rate (Tsmax to Tp): max 3°C/s
• Preheat: 150°C to 200°C for 60–120 s
• Time above 217°C (TL): max 60 s
• Peak temperature (Tp): 260°C, max 10 s
• Time within 5°C of Tp: max 10 s
• Cooling rate: max 6°C/s
• Total time from 25°C to Tp: max 8 min

Reflow soldering should not exceed two cycles. If more than 24 hours elapse between cycles, the LEDs may absorb moisture and be damaged.

6.2 Handling Precautions

Do not apply mechanical stress during heating or cooling. Do not warp the PCB after soldering. Use a double-head soldering iron for repair if necessary. The silicone encapsulant is soft; avoid excessive pressure on the lens. Pick-up nozzles should apply gentle force.

7. Packaging and Ordering Information

The product is delivered in sealed moisture barrier bags with desiccant and humidity indicator. The bag must be stored at ≤30°C and ≤75% RH before opening. After opening, use within 24 hours under ≤30°C, ≤60% RH. If storage conditions exceed these limits or the desiccant has changed color, bake the LEDs at 60±5°C for at least 24 hours before use.

8. Application Recommendations

8.1 Typical Applications

Designed for automotive interior (dashboard, ambient) and exterior (daytime running lights, turn signals, tail lights). The wide viewing angle and compact size allow design flexibility.

8.2 Design Considerations

• Current regulation: Always use a current-limiting resistor or driver to prevent over-current due to VF variation.
• Thermal management: Ensure adequate PCB thermal pads and vias to keep junction temperature below 125°C.
• ESD protection: Implement transient suppression devices if necessary, especially in harsh automotive electrical environments.
• Sulfur and halogens: The operating environment should contain <100 ppm sulfur compounds, <900 ppm bromine, <900 ppm chlorine, and total Br+Cl <1500 ppm.
• VOCs: Avoid adhesives or potting compounds that outgas organic vapors which can discolor the LED.

9. Technical Comparison

Compared to standard PLCC2 RGB or white LEDs without automotive qualification, this product offers:

• AEC-Q102 stress test qualification (including extended life, thermal shock, and humidity tests).
• Low thermal resistance (27°C/W real) enables better heat dissipation.
• High luminous flux per package (up to 83.7 lm at 150 mA).
• 100% lead-free and RoHS/REACH compliant, meeting global automotive material restrictions.

10. Frequently Asked Questions

10.1 How do I select the correct voltage and flux bin?

Choose voltage bin based on your driver design to ensure consistent current. Flux bin affects brightness; select PB, QA, or QB depending on the required output. For precision applications, request specific bin codes.

10.2 What is the storage life after baking?

After opening the moisture barrier bag, the LEDs must be used within 24 hours if stored at ≤30°C/≤60% RH. If not, bake again before reflow.

10.3 Can this LED be used with pulse width modulation (PWM)?

Yes, PWM dimming is possible. The peak current rating of 350 mA (10% duty) allows high peak currents for short periods. Ensure the average power does not exceed 612 mW.

11. Practical Application Examples

In an automotive daytime running light (DRL) module, four of these LEDs are placed in a linear array with a total current of 600 mA (150 mA per LED). Using the QA flux bin (67.8–75.3 lm), the total output exceeds 270 lm, meeting ECE R87 requirements. A thermal analysis shows the junction temperature stays at 85°C under worst-case ambient of 85°C, well below the 125°C maximum. The design uses a 1 oz copper PCB with thermal vias to dissipate heat.

12. Principle Description

The white LED operates on the principle of phosphor conversion: a blue InGaN chip emits blue light around 450 nm. This blue light partially excites a yellow-emitting phosphor (typically YAG:Ce) that is coated on the chip. The combination of residual blue light and yellow light produces white light. The exact color temperature and rendering are determined by the phosphor composition and thickness. The product uses a standard phosphor leading to a correlated color temperature of around 6000K, suitable for automotive white lighting.

13. Development Trends

The automotive lighting industry is moving towards higher luminous efficacy, smaller packages, and greater reliability. This PLCC2 format is already evolving into even smaller packages (e.g., 2016, 1616) while maintaining high flux. Future trends include better thermal interfaces, improved color stability over temperature, and integration of control electronics. The present product, with its AEC-Q102 qualification and wide operating temperature range, positions itself as a reliable solution for today’s automotive designs, while future versions may achieve higher efficacy and further miniaturization.