T3C Series 3030 White LED Datasheet - Dimensions 3.0x3.0x0.69mm - Voltage 3.2V - Power 1.12W - English Technical Document

1. Product Overview

The T3C Series is a family of high-performance, top-view white light-emitting diodes (LEDs) in a compact 3030 surface-mount device (SMD) package. Designed for general and architectural lighting applications, this series offers a combination of high luminous flux output, excellent thermal management, and a wide viewing angle. The package is engineered for reliability and ease of assembly in automated production lines using standard reflow soldering processes.

1.1 Core Advantages

• Thermally Enhanced Package: The design minimizes thermal resistance from the LED junction to the solder point (Rth j-sp), promoting efficient heat dissipation and supporting higher drive currents for sustained performance.
• High Luminous Efficacy: Delivers high luminous flux output, making it suitable for applications requiring bright, efficient illumination.
• Robust Construction: Capable of handling forward currents up to 400mA (DC) and 600mA (pulse), offering design flexibility.
• Wide Viewing Angle: Features a typical 120-degree viewing angle (2θ1/2), providing uniform light distribution.
• Environmental Compliance: The product is designed to be Pb-free and remains within RoHS compliant specifications.

1.2 Target Applications

This LED is ideal for a variety of lighting solutions, including:

• Interior lighting fixtures
• Retrofit lamps (replacement for traditional light sources)
• General purpose lighting
• Architectural and decorative lighting

2. Technical Parameter Analysis

2.1 Electro-Optical Characteristics

All measurements are specified at a junction temperature (Tj) of 25°C and a forward current (IF) of 350mA, which is the standard test condition.

• Correlated Color Temperature (CCT): Available in 2700K, 3000K, 4000K, 5000K, 5700K, and 6500K.
• Color Rendering Index (CRI - Ra): Minimum Ra80 (typical Ra82) across all CCT options, ensuring good color fidelity.
• Luminous Flux: Typical values range from 136 lm (2700K) to 145 lm (4000K-6500K). Minimum values are also specified per CCT.
• Forward Voltage (VF): Typical value is 3.2V, with a maximum of 3.4V at 350mA. Tolerance is ±0.1V.
• Viewing Angle (2θ1/2): 120 degrees typical.

2.2 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. Operation should be maintained within these limits.

• Forward Current (IF): 400 mA (DC)
• Pulse Forward Current (IFP): 600 mA (Pulse width ≤100μs, Duty cycle ≤1/10)
• Power Dissipation (PD): 1360 mW
• Reverse Voltage (VR): 5 V
• Operating Temperature (Topr): -40°C to +105°C
• Junction Temperature (Tj): 120°C (max)

2.3 Thermal Characteristics

• Thermal Resistance (Rth j-sp): 18 °C/W typical. This parameter is critical for thermal management design, indicating how effectively heat travels from the semiconductor junction to the solder point on the PCB.
• Electrostatic Discharge (ESD): Withstands 1000V (Human Body Model), providing a basic level of protection against handling-induced static electricity.

3. Binning System Explanation

The product is classified into bins to ensure consistency in key parameters.

3.1 Luminous Flux Binning

LEDs are sorted into flux bins (coded 2E, 2F, 2G, 2H) based on measured output at 350mA. Each CCT has specific minimum and maximum flux ranges for each bin code. For example, a 4000K LED in bin 2G has a luminous flux between 139 lm and 148 lm. The measurement tolerance for luminous flux is ±7%.

3.2 Forward Voltage Binning

LEDs are also binned by forward voltage at 350mA into three categories: H3 (2.8-3.0V), J3 (3.0-3.2V), and K3 (3.2-3.4V). This helps in designing consistent driver circuits, especially for parallel arrays.

3.3 Chromaticity Binning

The color coordinates (x, y on the CIE diagram) are controlled within a 5-step MacAdam ellipse for each CCT code (e.g., 27R5 for 2700K). This ensures a very tight color consistency, minimizing visible color differences between individual LEDs. The binning follows Energy Star guidelines for 2600K-7000K. The center coordinates are provided for both 25°C and 85°C junction temperatures, acknowledging the color shift that occurs with heating.

4. Performance Curve Analysis

The datasheet includes several key graphs that illustrate device behavior under varying conditions.

4.1 Forward Current vs. Relative Luminous Flux

This curve shows that luminous output increases with current but will eventually saturate. It is crucial for determining the optimal drive current for balancing brightness and efficiency/lifetime.

4.2 Forward Current vs. Forward Voltage (IV Curve)

This graph depicts the exponential relationship between voltage and current, fundamental to LED operation. It is used for driver design and power calculation.

4.3 Ambient Temperature vs. Relative Luminous Flux

This curve demonstrates the negative impact of rising ambient (and thus junction) temperature on light output. Effective thermal design is necessary to maintain performance.

4.4 Ambient Temperature vs. Relative Forward Voltage

Shows how the forward voltage decreases as temperature increases, which is a characteristic of semiconductor diodes. This can be used for temperature sensing in some advanced control systems.

4.5 Viewing Angle Distribution

Illustrates the Lambertian-like emission pattern, confirming the wide 120-degree viewing angle.

4.6 Color Spectrum

Depicts the spectral power distribution of the white light, which is a combination of a blue LED chip and a phosphor coating. The shape indicates the CRI and color quality.

5. Mechanical & Package Information

5.1 Package Dimensions

The LED has a compact footprint of 3.0mm x 3.0mm with a typical height of 0.69mm. The drawing provides detailed dimensions for the lens, body, and solder pads. Key tolerances are ±0.2mm unless otherwise specified.

5.2 Pad Layout and Polarity

The bottom-view diagram clearly shows the anode and cathode solder pads. The cathode is typically identified by a marking or a chamfered corner on the package. Correct polarity is essential for operation.

6. Soldering & Assembly Guidelines

6.1 Reflow Soldering Profile

A detailed reflow profile is provided to ensure reliable soldering without damaging the LED.

• Peak Package Body Temperature (Tp): Maximum 260°C.
• Time above Liquidus (TL=217°C): 60 to 150 seconds.
• Time within 5°C of Peak Temperature: Maximum 30 seconds.
• Ramp-up Rate: Maximum 3°C/second.
• Ramp-down Rate: Maximum 6°C/second.
• Preheat: 150°C to 200°C for 60-120 seconds.

Adhering to this profile is critical for maintaining solder joint integrity and preventing thermal stress on the LED package and internal die attach.

6.2 Storage and Handling

The storage temperature range is -40°C to +85°C. Devices should be kept in moisture-sensitive packaging until use and handled with ESD precautions.

7. Packaging & Ordering Information

7.1 Tape and Reel Specifications

The LEDs are supplied on embossed carrier tape for automated pick-and-place assembly. The maximum quantity per reel is 5000 pieces. Package dimensions for the tape are provided to facilitate feeder setup.

7.2 Part Numbering System

The part number T3C**811A-***** is decoded as follows: 'T3C' indicates the 3030 package type. The subsequent characters specify CCT (e.g., 27 for 2700K), Color Rendering (8 for Ra80), number of serial and parallel chips (1 and 1 respectively), a component code, and a color code (e.g., R for 85°C ANSI binning). This system allows precise selection of the desired performance characteristics.

8. Application Design Considerations

8.1 Thermal Management

Given the power dissipation (up to 1.12W at 350mA, 3.2V) and thermal resistance, a properly designed metal-core PCB (MCPCB) or other heatsinking method is mandatory. The goal is to keep the junction temperature as low as possible to maximize luminous output, longevity, and color stability. The Rth j-sp of 18°C/W is the starting point for calculating the required system thermal resistance.

8.2 Electrical Drive

A constant-current driver is strongly recommended over a constant-voltage source to ensure stable light output and prevent thermal runaway. The driver should be designed to operate within the Absolute Maximum Ratings, considering both the forward voltage bin and the negative temperature coefficient of VF.

8.3 Optical Design

The wide 120-degree viewing angle makes this LED suitable for applications requiring broad illumination without secondary optics. For focused beams, appropriate lenses or reflectors must be selected, considering the LED's emission pattern and physical size.

9. Frequently Asked Questions (Based on Technical Data)

9.1 What is the difference between the 'Typ' and 'Min' luminous flux values?

The 'Typ' (Typical) value represents the average or expected performance under standard test conditions. The 'Min' (Minimum) value is the guaranteed lower limit for the product. Designers should use the 'Min' value for conservative system lumen calculations to ensure the final product meets its brightness targets.

9.2 Can I drive this LED at 400mA continuously?

While the Absolute Maximum Rating for continuous forward current is 400mA, operating at this limit will generate more heat (Power = IF * VF) and likely reduce lifetime and efficiency. The standard test condition and most performance data are given at 350mA, which is considered a more optimal operating point for balancing output and reliability. Driving at 400mA requires exceptional thermal management.

9.3 How does the 5-step MacAdam ellipse binning benefit my application?

This tight binning ensures that LEDs from the same CCT code (e.g., 40R5) will appear virtually identical in color to the human eye when placed side-by-side. This is critical in multi-LED fixtures (like panel lights or downlights) to avoid unpleasant color variation, often perceived as a quality defect.

10. Design Case Study

Scenario: Designing a 1200 lm LED downlight retrofit module.

Design Process:

1. LED Selection: Using the 4000K, Ra80, flux bin 2G LED (139-148 lm typ). Using the minimum value of 139 lm for a conservative design.
2. Quantity Calculation: Target lumens / Min flux per LED = 1200 / 139 ≈ 8.6 LEDs. Round up to 9 LEDs.
3. Electrical Design: Plan for a series-parallel array (e.g., 3 strings of 3 LEDs in series) to be driven by a constant-current driver. The driver current is set to 350mA per string. The forward voltage per string (3 LEDs * ~3.2V) ≈ 9.6V. The driver must provide 350mA at a voltage compliance covering the VF bin range (e.g., up to 3*3.4V=10.2V).
4. Thermal Design: Total power ≈ 9 LEDs * 3.2V * 0.35A = 10.1W. Using the Rth j-sp of 18°C/W and targeting a maximum Tj of 105°C in a 55°C ambient environment (ΔT=50°C), the required system thermal resistance from junction to ambient is ΔT / Power = 50°C / 10.1W ≈ 4.95°C/W. Since the LED's internal Rth j-sp is already 18°C/W, an external heatsink with a very low thermal resistance is necessary, highlighting the need for an effective MCPCB and chassis design.
5. Optical/Mechanical: The wide viewing angle of the LEDs allows for good light spread within the downlight reflector or diffuser.

11. Technical Principles

This LED is based on semiconductor technology where electrical current flowing through a chip (typically InGaN) causes electron-hole recombination, emitting photons in the blue spectrum. A layer of phosphor material, deposited over the chip, absorbs a portion of this blue light and re-emits it as yellow light. The combination of the remaining blue light and the converted yellow light results in the perception of white light. The exact mix of blue and yellow (and sometimes red phosphor for higher CRI) determines the Correlated Color Temperature (CCT). The efficiency of this conversion process, along with the electrical efficiency of the chip, determines the overall luminous efficacy (lumens per watt). The package is designed to protect the chip, provide electrical connections, and manage the heat generated, as excess heat degrades both the chip and the phosphor, reducing light output and shifting color.

12. Industry Trends

The LED industry continues to focus on increasing luminous efficacy (lm/W) and improving color quality (higher CRI with better spectral rendering, especially R9 for reds). There is a strong trend towards standardization of packages (like the 3030) to simplify supply chains and fixture design. Another significant trend is the integration of more intelligence, moving towards connected, tunable white (CCT and intensity control) systems. Furthermore, reliability and lifetime under high-temperature operation are constantly being improved through advancements in chip technology, phosphor stability, and packaging materials. The drive for sustainability also pushes for higher efficiency and longer product lifecycles.