T3C Series 3030 White LED Datasheet - Dimensions 3.0x3.0x0.69mm - Voltage 5.9V - Power 0.71W - English Technical Document

1. Product Overview

The T3C Series 3030 white LED is a high-performance surface-mount device designed for general lighting applications. It features a compact package with a thermally enhanced design, enabling reliable operation at elevated drive currents. The LED emits a wide viewing angle white light, making it suitable for applications requiring uniform illumination.

1.1 Core Advantages

• High Luminous Flux Output: Delivers high brightness levels, optimizing efficiency for lighting designs.
• Thermally Enhanced Package: The design improves heat dissipation from the LED junction, supporting higher drive currents and contributing to longer operational lifespan.
• High Current Capability: Rated for continuous forward current up to 200mA, with a pulsed rating of 300mA.
• Wide Viewing Angle: A typical viewing angle (2θ1/2) of 120 degrees ensures broad light distribution.
• RoHS Compliant & Pb-Free: Manufactured to be compliant with RoHS directives and suitable for lead-free reflow soldering processes.

1.2 Target Markets and Applications

This LED is versatile and targets several lighting segments:

• Retrofit Lamps: Direct replacement for traditional light sources in existing fixtures.
• General Lighting: Primary light source in residential, commercial, and industrial luminaires.
• Signage Backlighting: Illumination for indoor and outdoor sign boards.
• Architectural and Decorative Lighting: Accent lighting, cove lighting, and other aesthetic lighting applications.

2. In-Depth Technical Parameter Analysis

2.1 Electro-Optical Characteristics

Key performance metrics are measured at a junction temperature (Tj) of 25°C and a forward current (IF) of 120mA, which is the recommended test condition.

• Luminous Flux: Output varies with Correlated Color Temperature (CCT) and Color Rendering Index (CRI). For example, a 4000K LED with CRI 80 (Ra80) has a typical luminous flux of 117 lumens (min. 110 lm). Higher CRI versions (Ra90) have slightly lower output (e.g., 96 lm typical for 4000K).
• Forward Voltage (VF): Typical value is 5.9V, with a range from 5.6V to 6.4V at 120mA. This parameter is binned for tighter design control.
• Viewing Angle (2θ1/2): The half-intensity angle is typically 120 degrees.
• Color Rendering Index (CRI/Ra): Available in three grades: Ra70, Ra80, and Ra90, with a measurement tolerance of ±2.

2.2 Electrical and Absolute Maximum Ratings

Understanding the limits is crucial for reliable design.

• Absolute Maximum Ratings:
  • Continuous Forward Current (IF): 200 mA
  • Peak Forward Current (IFP): 300 mA (Pulse width ≤100μs, Duty cycle ≤1/10)
  • Power Dissipation (PD): 1280 mW
  • Reverse Voltage (VR): 5 V
  • Junction Temperature (Tj): 120 °C
  • Operating Temperature (Topr): -40°C to +105°C
• Electrical Characteristics:
  • Reverse Current (IR): Maximum 10 μA at VR=5V.
  • Electrostatic Discharge (ESD) Withstand: 1000V (Human Body Model).

2.3 Thermal Characteristics

Thermal management is critical for performance and longevity.

• Thermal Resistance (Rth j-sp): The thermal resistance from the LED junction to the solder point on an MCPCB is typically 13 °C/W. This value is key for calculating the expected junction temperature rise under given operating conditions.
• The performance graphs (Fig. 7, 8, 10) show the relationship between ambient temperature, forward voltage, luminous flux, and maximum allowable current, emphasizing the need for effective heat sinking.

3. Binning System Explanation

The LEDs are sorted into bins to ensure color and brightness consistency within a production batch.

3.1 Luminous Flux Binning

Flux bins are defined by a letter code (e.g., 5F, 5G) with minimum and maximum lumen values. The binning structure is specific to each combination of CCT and CRI. For instance, a 4000K Ra80 LED has bins ranging from 5G (110-115 lm) to 5K (125-130 lm).

3.2 Forward Voltage Binning

Voltage is binned into four codes: Z3 (5.6-5.8V), A4 (5.8-6.0V), B4 (6.0-6.2V), and C4 (6.2-6.4V). This allows designers to select LEDs with tighter voltage tolerances for more predictable driver performance.

3.3 Chromaticity Binning (Color)

The chromaticity coordinates (x, y) are controlled within a 5-step MacAdam ellipse for each CCT bin (e.g., 27R5 for 2700K, 40R5 for 4000K). This ensures a very small perceptible color difference between LEDs of the same bin. The binning follows Energy Star guidelines for 2600K-7000K.

4. Performance Curve Analysis

The datasheet includes several graphs illustrating key behaviors.

• Fig. 5 - Forward Current vs. Relative Intensity: Shows how light output increases with current, typically in a near-linear relationship within the operating range.
• Fig. 6 - Forward Current vs. Forward Voltage: Illustrates the IV characteristic curve, which is essential for driver design.
• Fig. 7 - Ambient Temperature vs. Relative Luminous Flux: Demonstrates the thermal quenching effect; light output decreases as ambient (and thus junction) temperature rises.
• Fig. 8 - Ambient Temperature vs. Relative Forward Voltage: Shows that forward voltage decreases with increasing temperature, a characteristic of semiconductor diodes.
• Fig. 9 - Ts vs. CIE x, y Shift: Plots how the chromaticity coordinates shift with solder point temperature (Ts).
• Fig. 10 - Maximum Forward Current vs. Ambient Temperature: A derating curve that defines the maximum safe operating current as the ambient temperature increases.
• Fig. 1-3 - Color Spectrum: Show the spectral power distribution for different CRI levels (Ra70, Ra80, Ra90), highlighting the fuller spectrum of higher CRI LEDs.
• Fig. 4 - Viewing Angle Distribution: A polar plot of the relative luminous intensity versus angle, confirming the wide 120-degree beam pattern.

5. Mechanical and Package Information

5.1 Package Dimensions

The LED has a square footprint of 3.0mm x 3.0mm. The overall package height is 0.69mm. The solder pads are located on the bottom of the package.

5.2 Solder Pad Design and Polarity Identification

The bottom view diagram clearly shows the anode and cathode pads. The cathode is typically identified by a marking or a chamfered corner on the package. The recommended solder pad pattern dimensions are provided to ensure proper soldering and thermal connection to the PCB.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Parameters

The LED is suitable for lead-free reflow soldering processes. The maximum soldering temperature (Tsld) is specified as 230°C or 260°C for a duration of 10 seconds. It is critical to follow the recommended reflow profile to avoid thermal damage to the LED package or internal die.

6.2 Handling and Storage Precautions

• ESD Protection: Although rated for 1000V HBM, standard ESD precautions should be observed during handling.
• Storage Conditions: Store in an environment with temperature between -40°C and +85°C and low humidity. Moisture sensitivity level (MSL) information should be confirmed from the manufacturer.
• Cleaning: If cleaning is required post-soldering, use methods and solvents compatible with the LED's encapsulant material.

7. Ordering Information and Part Numbering

The part number follows the structure: T [X1][X2][X3][X4][X5][X6] – [X7][X8][X9][X10].

• X1 (Type Code): "3C" for the 3030 package.
• X2 (CCT Code): e.g., "27" for 2700K, "40" for 4000K.
• X3 (CRI Code): "7" for Ra70, "8" for Ra80, "9" for Ra90.
• X4 (Serial Chips): Number of chips in series (1-Z).
• X5 (Parallel Chips): Number of chips in parallel (1-Z).
• X6 (Component Code): Internal designation (A-Z).
• X7 (Color Code): Specifies binning standard (e.g., M for ANSI, R for 85°C ANSI).

8. Application Design Considerations

8.1 Driver Selection

Given the typical forward voltage of 5.9V at 120mA, a constant current LED driver is mandatory. The driver's output current should be set based on the desired brightness and thermal design. The driver must comply with the absolute maximum ratings, especially the 200mA continuous current limit.

8.2 Thermal Management Design

With a thermal resistance of 13°C/W (junction-to-solder point), effective heat sinking is non-negotiable for high-current operation. The PCB should use a metal-core (MCPCB) or other thermally enhanced substrate. The maximum junction temperature of 120°C should not be exceeded. Use the derating curve (Fig. 10) and thermal resistance to calculate the required heatsink performance.

8.3 Optical Design

The 120-degree viewing angle is suitable for applications requiring wide, diffuse light. For more focused beams, secondary optics (lenses) will be required. The spatial color uniformity should be evaluated, especially when mixing LEDs from different flux or chromaticity bins.

9. Technical Comparison and Differentiation

Compared to smaller packages like 2835 or 3014, the 3030 package offers a larger thermal path and pad area, allowing for higher power dissipation and drive currents, which translates to higher lumen output per device. Its 5.9V typical forward voltage is higher than standard 3V-class LEDs, which may influence the choice of driver topology (e.g., buck vs. boost). The availability of high CRI (Ra90) versions makes it competitive for quality lighting applications where color rendering is critical.

10. Frequently Asked Questions (FAQ)

10.1 What is the recommended operating current?

While the absolute maximum is 200mA, the standard test and binning condition is 120mA. This is a typical operating point that balances output, efficiency, and reliability. The actual operating current should be determined based on thermal design and required lumen output.

10.2 How does CRI affect light output?

Higher CRI (Ra90) LEDs typically have 10-20% lower luminous flux compared to Ra70 versions of the same CCT, as achieving better color rendering often involves a broader or differently balanced spectrum that may sacrifice some luminous efficacy.

10.3 What is the meaning of the 5-step MacAdam ellipse?

It defines the area on the CIE chromaticity diagram within which the color difference between two LEDs is imperceptible to the average human eye under standard viewing conditions. A 5-step ellipse is a tight tolerance, ensuring excellent color consistency.

10.4 Can I drive this LED with a constant voltage source?

No. LEDs are current-driven devices. A constant voltage source would lead to uncontrolled current flow, likely exceeding the maximum rating and causing immediate failure. Always use a constant current driver.

11. Practical Design and Usage Examples

11.1 Retrofit LED Tube Light

In a T8 LED tube retrofit, multiple 3030 LEDs can be arranged linearly on a narrow MCPCB. Their high lumen output allows fewer LEDs to achieve the target brightness, simplifying the circuit. The wide viewing angle helps achieve uniform light distribution from the tube. The driver is designed to provide a constant current (e.g., 120mA) to a series string of LEDs, with the total voltage determined by the number of LEDs in series.

11.2 High-CRI Downlight

For a residential downlight requiring excellent color rendering (Ra90), the 3030 LED in 2700K or 3000K CCT is a suitable choice. The LEDs are mounted on a circular MCPCB with an integrated heatsink. A constant current driver with dimming capability (e.g., 0-10V or TRIAC) can be used. The thermal design ensures the junction temperature remains below 85°C for optimal lifetime and color stability.

12. Operational Principle Introduction

A white LED is fundamentally a semiconductor diode. When a forward voltage exceeding its bandgap is applied, electrons and holes recombine in the active region, releasing energy in the form of photons (light). This primary light is typically blue or ultraviolet. To create white light, a phosphor layer is deposited on or around the semiconductor chip. This phosphor absorbs a portion of the primary blue/UV light and re-emits it as light of longer wavelengths (yellow, red). The mixture of the unconverted blue light and the down-converted yellow/red light appears white to the human eye. The exact blend of phosphors determines the CCT (warm white, cool white) and CRI of the LED.

13. Technology Trends and Developments

The general trend in mid-power LEDs like the 3030 is towards higher efficacy (more lumens per watt) and improved reliability at higher operating temperatures. There is continuous development in phosphor technology to achieve higher CRI values with less sacrifice in efficacy, and to improve color consistency and stability over time and temperature. Packaging technology is also evolving to further reduce thermal resistance, allowing for higher power density. Furthermore, there is a focus on enhancing light extraction efficiency from the package to maximize output. The industry is also working on standardizing metrics like lifetime (L70, L90) and chromaticity maintenance under various stress conditions to provide more reliable data for lighting system design.