T3C Series 3030 White LED Datasheet - Dimensions 3.0x3.0mm - Voltage 5.9V - Power 0.7W - English Technical Document

1. Product Overview

The T3C Series 3030 white LED is a high-performance, surface-mount device designed for demanding general lighting applications. It features a compact 3.0mm x 3.0mm footprint and is engineered to deliver high luminous output with excellent reliability.

1.1 Core Advantages

• Thermally Enhanced Package: The design effectively manages heat dissipation, allowing for stable performance at higher drive currents.
• High Luminous Flux Output: Provides bright, efficient illumination suitable for a wide range of lighting products.
• High Current Capability: Rated for a forward current (IM) of 200mA, with a pulse capability of 300mA under specified conditions.
• Wide Viewing Angle: A typical viewing angle (2θ1/2) of 120 degrees ensures broad and uniform light distribution.
• Robust Construction: Suitable for lead-free reflow soldering processes and compliant with RoHS standards.

1.2 Target Market & Applications

This LED is ideal for both retrofit and new design projects in various lighting sectors:

• General Lighting: Bulbs, downlights, and panel lights.
• Architectural & Decorative Lighting: Accent lighting, cove lighting, and signage.
• Backlighting: Indoor and outdoor sign boards.

2. In-Depth Technical Parameter Analysis

2.1 Absolute Maximum Ratings (Tj=25°C)

These ratings define the limits beyond which permanent damage to the device may occur. Operation should be maintained within these boundaries.

• Forward Current (IM): 200 mA (DC)
• Pulse Forward Current (IMP): 300 mA (Pulse width ≤100μs, Duty cycle ≤1/10)
• Power Dissipation (PD): 1200 mW
• Reverse Voltage (VR): 5 V
• Operating Temperature (Topr): -40°C to +105°C
• Storage Temperature (Tstg): -40°C to +85°C
• Junction Temperature (Tj): 120°C
• Soldering Temperature (Tsld): Reflow profile with peak of 230°C or 260°C for 10 seconds.

2.2 Electro-Optical Characteristics (Tj=25°C, IF=120mA)

These are the typical performance parameters under standard test conditions.

• Forward Voltage (VF): 5.9 V (Typical), with a range from 5.6V (Min) to 6.0V (Max). Tolerance is ±0.2V.
• Reverse Current (IR): Maximum 10 μA at VR=5V.
• Viewing Angle (2θ1/2): 120° (Typical). This is the off-axis angle where luminous intensity is half of the peak value.
• Thermal Resistance (Rth j-sp): 13 °C/W (Typical). This is the thermal resistance from the LED junction to the solder point on an MCPCB.
• Electrostatic Discharge (ESD): Withstands 1000V (Human Body Model).

2.3 Luminous & Chromatic Characteristics (Tj=25°C, IF=120mA)

The document specifies parameters for a 5000K, Ra80 variant.

• Correlated Color Temperature (CCT): 5000K (Cool White).
• Color Rendering Index (CRI Ra): Minimum 80. Measurement tolerance is ±2.
• Red Color Rendering (R9): Minimum 0 (specific to this bin).
• Luminous Flux: Typical 122 lm, with a minimum of 120 lm for the base specification. Measurement tolerance is ±7%.
• Chromaticity: The color point is defined within a 5-step MacAdam ellipse centered at CIE coordinates x=0.3533, y=0.3651. Coordinate tolerance is ±0.005.

3. Binning System Explanation

To ensure color and brightness consistency in production, LEDs are sorted into bins.

3.1 Luminous Flux Binning (IF=120mA, Tj=25°C)

For the 5000K/80 CRI variant, flux is categorized into several ranks (codes 5H to 5L), with typical values ranging from 115 lm to 135 lm. For example, code 5J covers 120-125 lm, and code 5L covers 130-135 lm.

3.2 Forward Voltage Binning (IF=120mA, Tj=25°C)

Voltage bins help in designing consistent driver circuits. The bins are:

• Code Z3: 5.6V - 5.8V
• Code A4: 5.8V - 6.0V
• Code B4: 6.0V - 6.2V

3.3 Chromaticity Binning

The color is tightly controlled within a 5-step MacAdam ellipse centered on the specified CIE coordinates, ensuring minimal visible color variation between units.

3.4 Kitting Rules for Shipment

To simplify inventory and assembly, LEDs are shipped in pre-defined kits containing reels from specific flux, voltage, and CIE bins. Multiple kit combinations (e.g., Kit 1: Flux 5H & 5K) are offered to provide average performance targets.

4. Performance Curve Analysis

The datasheet includes several key graphs (referenced as Fig 1-8) that illustrate performance under varying conditions.

• Color Spectrum (Fig 1): Shows the spectral power distribution for the Ra≥80 variant, highlighting the phosphor-converted white light profile.
• Viewing Angle Distribution (Fig 2): Illustrates the Lambertian-like intensity pattern, confirming the wide 120° viewing angle.
• Forward Current vs. Relative Intensity (Fig 3): Demonstrates the relationship between drive current and light output, crucial for dimming and efficacy calculations.
• Forward Current vs. Forward Voltage (Fig 4): The IV curve, essential for thermal and electrical design of the driver.
• Ambient Temperature vs. Relative Luminous Flux (Fig 5): Shows the derating of light output as ambient (and thus junction) temperature increases.
• Ambient Temperature vs. Relative Forward Voltage (Fig 6): Indicates how forward voltage decreases with rising temperature, a factor for constant-current drivers.
• Ts vs. CIE x, y Shift (Fig 7): Depicts how the color coordinates may shift with solder point temperature.
• Maximum Forward Current vs. Ambient Temperature (Fig 8): A critical derating curve that defines the maximum allowable drive current to prevent overheating as ambient temperature rises.

5. Mechanical & Package Information

5.1 Package Dimensions

The LED has a standard 3030 footprint. Key dimensions include a body size of 3.00mm x 3.00mm, with a typical height. The bottom view shows two solder pads. The polarity is clearly marked: one pad is designated as the Cathode. The dimensional tolerance is typically ±0.2mm unless otherwise specified.

5.2 Solder Pad Design & Polarity

The soldering pattern is designed for reliable surface mounting. The anode and cathode pads are symmetrically placed. Correct polarity orientation during assembly is vital, as indicated by the cathode marking on the package bottom.

6. Soldering & Assembly Guidelines

6.1 Reflow Soldering Profile

The component is compatible with standard lead-free reflow processes. The recommended profile parameters include:

• Preheat: Ramp from 150°C to 200°C over 60-120 seconds.
• Ramp-up Rate: Maximum 3°C/second to peak temperature.
• Time Above Liquidus (TL=217°C): 60-150 seconds.
• Peak Package Body Temperature (Tp): Maximum 260°C.
• Time within 5°C of Peak (tp): Maximum 30 seconds.
• Ramp-down Rate: Maximum 6°C/second.
• Total Cycle Time: Maximum 8 minutes from 25°C to peak temperature.

Adhering to this profile prevents thermal shock and ensures reliable solder joints without damaging the LED package.

7. Ordering Information & Model Numbering

7.1 Part Numbering System

The part number T3C50821S-***** follows a structured code:

• X1 (Type): "3C" denotes the 3030 package.
• X2 (CCT): "50" indicates 5000K color temperature.
• X3 (CRI): "8" indicates Ra80 color rendering.
• X4 (Serial Chips): "2" (interpretation depends on internal design).
• X5 (Parallel Chips): "1" (interpretation depends on internal design).
• X6 (Component Code): "S".
• X7 (Color Code): Likely specifies the ANSI or other standard bin.
• X8-X10: Internal and spare codes.

8. Application Notes & Design Considerations

8.1 Thermal Management

Given a thermal resistance of 13°C/W, effective heat sinking is crucial, especially when operating near maximum ratings. The derating curve (Fig 8) must be used to determine the safe operating current at the application's maximum ambient temperature. Exceeding the maximum junction temperature (120°C) will significantly reduce lifetime and luminous output.

8.2 Electrical Drive

This LED should be driven with a constant current source, not a constant voltage. The typical forward voltage is 5.9V at 120mA. Design the driver to accommodate the voltage bin range (5.6V-6.2V). The driver's current limit should not exceed the absolute maximum DC rating of 200mA.

8.3 Optical Design

The wide 120-degree viewing angle makes this LED suitable for applications requiring broad illumination without secondary optics. For focused beams, appropriate lenses or reflectors will be necessary.

9. Comparison & Key Differentiators

While many 3030 LEDs exist, key differentiators implied by this datasheet include:

• Higher Voltage/Series Configuration: A typical Vf of 5.9V suggests it may contain multiple LED chips in series within the package, offering higher efficacy per package for a given current compared to single-chip low-voltage designs.
• Comprehensive Binning & Kitting: The detailed flux, voltage, and chromaticity binning with pre-defined kits aids in achieving consistent color and brightness in mass production.
• Robust Thermal Specs: Clear absolute maximum ratings and a defined thermal resistance value facilitate more reliable thermal design.

10. Frequently Asked Questions (Based on Technical Parameters)

Q: What is the actual power consumption of this LED?
A: At the typical operating point (120mA, 5.9V), the electrical power is approximately 0.71 Watts (0.12A * 5.9V).

Q: Can I drive this LED at 200mA continuously?
A: While the absolute maximum rating is 200mA, continuous operation at this level will generate significant heat (P=~1.18W at 5.9V). You must consult the derating curve (Fig 8) and ensure the junction temperature does not exceed 120°C through excellent thermal management. For optimal lifetime and efficacy, operating at or below the test current of 120mA is recommended.

Q: How do I interpret the luminous flux bins for my design?
A: Choose a bin (e.g., 5L for 130-135 lm min) based on your minimum brightness requirement. Using a kit (e.g., a mix of 5J and 5K reels) will give you an average performance, which can be a cost-effective solution where absolute uniformity is less critical.

Q: Is a heatsink necessary?
A> For any sustained operation, especially above 120mA or in enclosed fixtures, a properly designed heatsink connected to the solder point (as defined by Rth j-sp) is essential to maintain performance and longevity.

11. Practical Use Case Example

Scenario: Designing a 10W LED Bulb Retrofit.
A designer plans to create a bulb using 14 of these LEDs to replace a 75W incandescent. Targeting ~1000 lm, each LED needs to provide ~71 lm. Operating at 120mA (typical flux 122 lm) easily meets this with margin. The total system voltage would be ~83V (14 * 5.9V), requiring a constant-current driver with an output voltage range covering 78.4V to 84V (using Z3 bin). A well-designed metal-core PCB (MCPCB) acts as the heatsink, keeping the solder point temperature low enough to allow full light output based on Fig 5 & 8. The wide viewing angle ensures good omnidirectional light distribution in the bulb.

12. Technical Principle Introduction

This LED is a phosphor-converted white LED. It likely uses a blue-emitting semiconductor chip (e.g., based on InGaN). Part of the blue light is absorbed by a layer of phosphor material coating the chip. The phosphor re-emits light across a broad spectrum in the yellow and red regions. The combination of the remaining blue light and the phosphor-converted yellow/red light results in the perception of white light. The specific blend of phosphors determines the Correlated Color Temperature (CCT, e.g., 5000K) and Color Rendering Index (CRI, e.g., Ra80). The multiple chips suggested by the part number may be interconnected in series-parallel configuration to achieve the target voltage and current characteristics.

13. Industry Trends & Context

The 3030 package format represents a balance between high light output and manageable thermal density. The trend in general lighting LEDs is towards higher efficacy (lumens per watt), improved color rendering (especially R9 for reds), and higher reliability at elevated junction temperatures. This device, with its specified parameters, fits into the market segment requiring robust, medium-power LEDs for quality commercial and industrial lighting solutions. The move towards standardized packages like 3030 simplifies optical and mechanical design for luminaire manufacturers. Furthermore, the detailed binning and kitting information reflects the industry's focus on color consistency and supply chain efficiency for high-volume production.