T5C Series 5050 White LED Datasheet - Size 5.0x5.0x1.9mm - Voltage 6.2V - Power 3.97W - English Technical Document

1. Product Overview

The T5C series represents a high-performance, top-view white LED in the industry-standard 5050 (5.0mm x 5.0mm) surface-mount device (SMD) package. This product is engineered for applications demanding high luminous output, reliability, and thermal efficiency. Its compact form factor and wide viewing angle make it a versatile solution for a broad spectrum of lighting needs.

1.1 Core Advantages

• Thermally Enhanced Package Design: The package is optimized for efficient heat dissipation, which is critical for maintaining performance and longevity at high drive currents.
• High Luminous Flux Output: Capable of delivering high brightness levels, making it suitable for general and architectural lighting.
• High Current Capability: Rated for a forward current (IF) of up to 960mA, supporting high-power applications.
• Wide Viewing Angle: A typical viewing angle (2θ1/2) of 120 degrees ensures uniform light distribution.
• Pb-free and RoHS Compliant: Manufactured with environmentally friendly materials and processes suitable for lead-free reflow soldering.

1.2 Target Markets and Applications

This LED is designed for a wide range of illumination applications, including but not limited to:

• Architectural and decorative lighting fixtures.
• Retrofit lamps and modules designed to replace traditional light sources.
• General purpose indoor and outdoor lighting.
• Backlighting for indoor and outdoor signage and displays.

2. In-Depth Technical Parameter Analysis

This section provides a detailed, objective interpretation of the key electrical, optical, and thermal parameters specified in the datasheet.

2.1 Electro-Optical Characteristics

The primary performance metrics are measured at a junction temperature (Tj) of 25°C and a forward current (IF) of 640mA, which is considered a typical operating point.

• Forward Voltage (VF): Typically 6.2V, with a range from 5.8V to 6.6V. This parameter is crucial for driver design, as it determines the power supply requirements and influences overall system efficiency. The specified tolerance is ±0.2V.
• Luminous Flux: The light output varies significantly with Correlated Color Temperature (CCT) and Color Rendering Index (CRI). For example, a 4000K LED with Ra70 produces a typical flux of 655 lumens, while a 2700K LED with Ra90 produces 490 lumens. Designers must select the appropriate bin to meet application-specific brightness and color quality goals. Flux measurement tolerance is ±7%.
• Viewing Angle (2θ1/2): A wide 120-degree angle is specified, which is ideal for applications requiring broad, even illumination rather than a focused beam.
• Reverse Current (IR): Maximum of 10μA at a reverse voltage (VR) of 5V, indicating good diode characteristics for protection against minor reverse voltage conditions.

2.2 Absolute Maximum Ratings and Thermal Management

Exceeding these limits may cause permanent damage to the device.

• Forward Current: Absolute maximum continuous current is 960mA. A pulsed forward current (IFP) of 1440mA is allowed under strict conditions (pulse width ≤100μs, duty cycle ≤1/10).
• Power Dissipation (PD): Maximum of 6336 mW. This is a critical parameter for thermal design. The actual power dissipated is VF * IF. At the typical 640mA/6.2V operating point, dissipation is approximately 3968 mW, leaving headroom for higher current operation or elevated ambient temperatures, provided thermal resistance is managed.
• Thermal Resistance (Rth j-sp): The thermal resistance from the LED junction to the solder point on an MCPCB is specified as 2.5 °C/W. This low value is indicative of the thermally enhanced package. To calculate the junction temperature rise above the solder point: ΔTj = PD * Rth j-sp. Effective heat sinking is essential to keep the junction temperature below the maximum rating of 120°C.
• Operating and Storage Temperature: The device can operate from -40°C to +105°C ambient and be stored from -40°C to +85°C.
• Soldering Temperature: Compatible with standard reflow profiles, with a peak temperature of 230°C or 260°C for a maximum of 10 seconds.

2.3 Electrostatic Discharge (ESD)

The device has an ESD withstand voltage of 1000V according to the Human Body Model (HBM). Standard ESD handling precautions should be observed during assembly and handling to prevent latent damage.

3. Binning System Explanation

The product is offered in controlled bins to ensure consistency in color, brightness, and electrical characteristics.

3.1 Luminous Flux Binning

Flux is binned using alphanumeric codes (e.g., GL, GM, GN). The bin ranges are defined separately for different combinations of CCT and CRI. For instance: - A 3000K, Ra80 LED in bin "GM" has a luminous flux between 550 and 600 lumens. - A 6500K, Ra70 LED in bin "GQ" has a flux between 700 and 750 lumens. This system allows designers to select LEDs with tightly controlled brightness levels for uniform lighting in an array.

3.2 Forward Voltage Binning

Forward voltage is binned in 0.2V steps using codes B4, C4, D4, and E4, corresponding to ranges from 5.8-6.0V up to 6.4-6.6V. Matching LEDs by voltage bin can help balance current in parallel strings and improve the efficiency of constant-voltage drivers.

3.3 Chromaticity Binning (Color)

The chromaticity coordinates (x, y on the CIE diagram) are controlled within a 5-step MacAdam ellipse for each CCT. This ensures minimal perceptible color variation between LEDs of the same nominal white point (e.g., 4000K). The datasheet provides the ellipse center coordinates and dimensions for CCTs from 2700K to 6500K. Energy Star binning standards are applied to all white LEDs from 2600K to 7000K.

4. Performance Curve Analysis

The provided graphs offer insights into the LED's behavior under varying conditions.

4.1 Spectral Power Distribution

Spectra are shown for Ra70, Ra80, and Ra90 versions. Higher CRI LEDs typically show a more filled-in spectrum across the visible range, especially in the red and cyan regions, leading to more accurate color rendering but often at the expense of slightly lower overall efficacy (lumens per watt).

4.2 Current vs. Intensity/Voltage

The curve of Relative Intensity vs. Forward Current shows a near-linear relationship in the typical operating range, but saturation may occur at very high currents. The Forward Voltage vs. Forward Current curve demonstrates the diode's characteristic exponential behavior, with voltage increasing logarithmically with current.

4.3 Temperature Dependence

Key graphs illustrate the impact of ambient temperature (Ta): - Relative Luminous Flux vs. Ta: Light output generally decreases as temperature increases due to reduced internal quantum efficiency and other factors. This derating curve is essential for designing systems that operate in warm environments. - Relative Forward Voltage vs. Ta: Forward voltage typically decreases with increasing temperature (negative temperature coefficient), which must be considered in constant-current driver design to avoid thermal runaway in parallel configurations. - Maximum Forward Current vs. Ta: This graph defines the safe operating area, showing how the maximum allowable continuous current must be derated as ambient temperature rises to keep the junction temperature within limits. - CIE Shift vs. Ta: Shows how the white point (chromaticity coordinates) may shift slightly with temperature, which is important for color-critical applications.

5. Mechanical and Package Information

5.1 Package Dimensions

The LED has a nominal footprint of 5.0mm x 5.0mm. The overall package height is approximately 1.9mm. Detailed dimensions for the body, lens, and solder pads are provided in the drawing. Critical tolerances are typically ±0.1mm unless otherwise noted. The pad layout is designed for stable soldering and effective thermal transfer to the PCB.

5.2 Polarity Identification and Solder Pad Pattern

The bottom-view diagram clearly marks the anode and cathode. The solder pad pattern includes thermal pads and electrical pads. Proper alignment during PCB design and assembly is crucial for electrical function, thermal performance, and mechanical stability. The recommended solder paste stencil design should follow the pad geometry to ensure correct solder joint formation.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Parameters

The component is rated for lead-free reflow soldering processes. Two common peak temperature profiles are supported: - Profile 1: Peak temperature of 230°C. - Profile 2: Peak temperature of 260°C. In both cases, the time above liquidus (typically ~217°C for SAC alloys) and the time at peak temperature must be controlled. The maximum time at the specified peak temperature is 10 seconds to prevent damage to the silicone lens and internal materials. A standard ramp-up and cool-down rate should be followed to minimize thermal shock.

6.2 Handling and Storage Precautions

• Store in a dry, anti-static environment within the specified temperature range (-40°C to +85°C).
• Use within 12 months of the manufacturing date under recommended storage conditions to avoid moisture sensitivity issues. If exposed to ambient humidity, baking may be required before reflow.
• Handle with ESD-safe equipment and procedures.
• Avoid mechanical stress on the lens.

7. Part Numbering and Ordering Information

The part number follows a structured system: T5C**824C-*****. Each character or group represents a specific attribute: - X1 (Type): "5C" denotes the 5050 package. - X2 (CCT): Two-digit code for color temperature (e.g., 27 for 2700K, 65 for 6500K) or color (RE, GR, BL, etc.). - X3 (CRI): Single digit for Color Rendering Index (7 for Ra70, 8 for Ra80, 9 for Ra90). - X4 (Serial Chips): Number of chips in series within the package. - X5 (Parallel Chips): Number of chips in parallel within the package. - X6 (Component Code): Internal designation. - X7 (Color Code): Specifies performance grade or application (e.g., M for ANSI, B for Backlighting). - X8-X10: Internal and spare codes. To order, the specific bin codes for Flux, Voltage, and Chromaticity must also be specified to get the exact required performance.

8. Application Design Considerations

8.1 Driver Selection and Circuit Design

• Constant Current Driver: Essential for stable light output and longevity. The driver's current rating should match the intended operating point (e.g., 640mA).
• Thermal Management: The primary factor affecting lifetime. Use a Metal Core PCB (MCPCB) or other effective heat sinking method. Calculate the required heatsink thermal resistance based on maximum ambient temperature, LED power dissipation, and the junction-to-solder-point resistance (2.5°C/W).
• Optics: The wide 120-degree beam may require secondary optics (lenses, reflectors) for applications needing focused light or specific beam patterns.

8.2 Reliability and Lifetime

While a specific L70/L90 lifetime (hours to 70%/90% lumen maintenance) is not stated, lifetime is primarily a function of junction temperature. Operating the LED well below its maximum Tj of 120°C, ideally at or below 85°C, will significantly extend its operational life. Proper thermal design is the most critical factor for reliability.

9. Frequently Asked Questions (Based on Technical Parameters)

9.1 What is the typical power consumption?

At the standard test condition of 640mA and a typical VF of 6.2V, the electrical power input is approximately 3.97 Watts (P = I * V).

9.2 How do I select the right CCT and CRI?

Choose CCT based on the desired "warmth" of the light: 2700K-3000K for warm white, 4000K for neutral white, 5000K-6500K for cool white. Higher CRI (Ra80, Ra90) is necessary for applications where accurate color perception is important (e.g., retail, museums, task lighting), but it may come with a slight reduction in luminous efficacy compared to Ra70 versions.

9.3 Can I drive this LED at its absolute maximum current of 960mA?

While possible, driving at the absolute maximum rating requires exceptional thermal management to keep the junction temperature within safe limits. It will also accelerate lumen depreciation and reduce lifetime. Operating at or below the typical current of 640mA is recommended for a balance of performance, efficiency, and longevity.

9.4 Why is the forward voltage so high (~6.2V) compared to smaller LEDs?

The 5050 package often contains multiple LED chips connected in series internally. A typical configuration is two chips, each with a ~3.1V forward voltage, connected in series, resulting in the observed ~6.2V total. This design allows for higher power handling in a compact package.

10. Working Principle and Technology Trends

10.1 Basic Operating Principle

A white LED typically uses a blue-emitting indium gallium nitride (InGaN) semiconductor chip. Part of the blue light is converted to longer wavelengths (yellow, red) by a phosphor layer coating the chip. The mixture of blue light and phosphor-converted light results in the perception of white light. The specific blend of phosphors determines the CCT and CRI of the emitted light.

10.2 Industry Trends

The lighting industry continues to push for higher efficacy (lumens per watt), improved color quality (higher CRI with better spectral continuity, especially R9 for reds), and greater reliability. Thermally enhanced packages, like the one used in this series, are standard for mid-power and high-power LEDs to manage the heat generated at higher drive currents. There is also a trend towards more precise and tighter binning to ensure color and brightness consistency in large installations, as reflected in the detailed binning structure provided for this product.