White LED 5050 SMD Datasheet - Dimensions 5.0x5.0x1.9mm - Voltage 46-52V - Power 6.24W - English Technical Document

1. Product Overview

This document provides comprehensive technical specifications for a high-performance, top-view white LED in a 5050 surface-mount device (SMD) package. The component is designed for demanding general lighting applications requiring high luminous output and reliability. Its thermally enhanced package design allows for efficient heat dissipation, supporting high current operation and contributing to long-term performance stability.

The LED is suitable for Pb-free reflow soldering processes and is compliant with relevant environmental regulations. Its compact 5.0mm x 5.0mm footprint and wide 120-degree viewing angle make it versatile for various lighting designs where space and light distribution are key considerations.

1.1 Core Advantages and Target Market

The primary advantages of this LED series include a high luminous flux output, robust thermal management enabling high current capability, and a compact form factor. These features position it as an ideal solution for architectural and decorative lighting, retrofit applications replacing traditional light sources, general illumination, and backlighting for indoor and outdoor signage. The product's design prioritizes both performance in lumens per watt and longevity under typical operating conditions.

2. In-Depth Technical Parameter Analysis

2.1 Electro-Optical Characteristics

The electro-optical performance is measured at a standard test current of 100mA and a junction temperature (Tj) of 25°C. The LED is available in six correlated color temperatures (CCT): 2700K, 3000K, 4000K, 5000K, 5700K, and 6500K. All variants maintain a minimum color rendering index (CRI or Ra) of 80, with a typical value of 82 and a measurement tolerance of ±2.

The luminous flux varies by CCT. For warmer whites (2700K, 3000K), the typical luminous flux is 605lm and 635lm respectively, with a minimum guaranteed value of 550lm. For neutral and cool whites (4000K to 6500K), the typical luminous flux is 665lm with a minimum of 600lm. A tolerance of ±7% applies to luminous flux measurements. The dominant wavelength is determined by the CCT selection and is controlled within a 5-step MacAdam ellipse for precise color consistency.

2.2 Electrical and Thermal Parameters

The absolute maximum ratings define the operational limits. The maximum continuous forward current (IF) is 120mA, with a pulsed forward current (IFP) of 180mA allowed under specific conditions (pulse width ≤100μs, duty cycle ≤1/10). The maximum power dissipation (PD) is 6240mW. The device can withstand a reverse voltage (VR) of up to 5V. The operating temperature range (Topr) is from -40°C to +105°C, and the storage temperature range (Tstg) is from -40°C to +85°C. The maximum junction temperature (Tj) is 120°C.

Under typical operating conditions (IF=100mA, Tj=25°C), the forward voltage (VF) ranges from 46V to 52V, with a typical value of 49V and a tolerance of ±3%. The reverse current (IR) is a maximum of 10μA at VR=5V. The thermal resistance from the junction to the solder point on an MCPCB (Rth j-sp) is typically 3°C/W. The device has an electrostatic discharge (ESD) withstand capability of 1000V (Human Body Model).

3. Binning System Explanation

3.1 Luminous Flux Binning

To ensure consistency, LEDs are sorted into luminous flux bins. The bin structure is CCT-dependent. For 2700K and 3000K, bins GM (550-600lm), GN (600-650lm), and GP (650-700lm) are defined. For CCTs from 4000K to 6500K, bins GN (600-650lm), GP (650-700lm), and GQ (700-750lm) are available. This binning allows designers to select components that meet specific lumen output requirements for their application.

3.2 Forward Voltage Binning

Forward voltage is also binned to aid in circuit design, particularly for driving multiple LEDs in series. Three voltage bins are defined at IF=100mA: 6R (46-48V), 6S (48-50V), and 6T (50-52V). Selecting LEDs from a tight voltage bin can help achieve more uniform current distribution and simplified driver design.

3.3 Chromaticity Binning

The color consistency is tightly controlled. The chromaticity coordinates for each CCT are defined at both 25°C and 85°C junction temperatures. The allowable variation for each bin is within a 5-step MacAdam ellipse, a standard measure for perceptible color difference. Specific center coordinates (x, y) and ellipse parameters (a, b, Φ) are provided for each CCT code (e.g., 27R5 for 2700K). This system ensures that the LEDs from the same bin will appear visually identical in color. The Energy Star binning standard is applied across the 2600K to 7000K range.

4. Performance Curve Analysis

While specific graphical curves for IV characteristics or lumen maintenance are not provided in the extracted content, key performance aspects can be inferred from the tabular data. The relationship between forward current and voltage is indicated by the VF specification at 100mA. The thermal performance is characterized by the thermal resistance (Rth j-sp) of 3°C/W, which is crucial for estimating the junction temperature rise under operating power. The wide viewing angle of 120 degrees (2θ1/2) indicates a Lambertian or similar emission pattern, providing broad, even illumination.

5. Mechanical and Package Information

5.1 Dimensions and Polarity

The LED package has dimensions of 5.00mm x 5.00mm in footprint, with a height of approximately 1.90mm. A detailed dimensioned drawing is provided, showing the top view, bottom view, and side view. The soldering pad pattern is clearly illustrated on the bottom view. The anode and cathode are distinctly marked. The cathode is typically identified by a green marking or a notch in the package. The dimensional tolerance, unless otherwise specified, is ±0.1mm.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

The component is suitable for lead-free reflow soldering. A detailed soldering profile is specified to prevent thermal damage. Key parameters include: a preheat from 150°C to 200°C over 60-120 seconds; a maximum ramp-up rate of 3°C/second to the peak temperature; a time above liquidus (217°C) between 60 and 150 seconds; a peak package body temperature (Tp) not exceeding 260°C; and a time within 5°C of this peak (tp) of 30 seconds maximum. The total time from 25°C to peak temperature should not exceed 8 minutes. Adherence to this profile is critical for maintaining solder joint integrity and LED reliability.

7. Packaging and Ordering Information

7.1 Tape and Reel Specifications

The LEDs are supplied on embossed carrier tape for automated assembly. The maximum quantity per reel is 2000 pieces. The cumulative tolerance over 10 pitches of the tape is ±0.2mm. The packaging is labeled with the part number, manufacturing date code, and quantity.

7.2 Part Numbering System

A detailed part numbering system (e.g., T5C**8G1C-*****) is used to encode key attributes. The code breaks down as follows: X1 indicates the package type (5C for 5050). X2 specifies the CCT (e.g., 27 for 2700K). X3 indicates the color rendering index (8 for Ra80). X4 and X5 denote the number of serial and parallel chips within the package. X6 is a component code. X7 is a color code defining specific performance grades (e.g., ANSI standards, high-temperature versions). X8, X9, and X10 are for internal or spare codes. This system allows precise identification and ordering of the desired LED configuration.

8. Application Recommendations

8.1 Design Considerations

When designing with this LED, thermal management is paramount due to its high power capability. The low thermal resistance (3°C/W) is only effective when the LED is properly mounted on a suitable metal-core printed circuit board (MCPCB) or other heatsinking substrate. Designers must calculate the expected junction temperature based on the forward current, forward voltage, and system thermal resistance to ensure it remains below the maximum rating of 120°C for long-term reliability.

Electrical design must account for the high forward voltage (typically 49V at 100mA). Constant current drivers are recommended to ensure stable light output and color over temperature and lifetime. The reverse voltage protection limit of 5V should be respected in circuit design. For applications requiring specific color consistency, selecting LEDs from the same luminous flux and chromaticity bin is advised.

9. Technical Comparison and Differentiation

Compared to standard mid-power LEDs, this 5050 component offers significantly higher luminous flux per package, reducing the number of components needed for a given light output. Its thermally enhanced design allows it to sustain higher drive currents than conventional packages of similar size, potentially offering a better efficacy (lm/W) at higher operating points. The availability of tight chromaticity binning (5-step MacAdam) and high CRI (Ra80 min) makes it suitable for applications where color quality and consistency are critical, such as retail lighting or museum illumination.

10. Frequently Asked Questions (Based on Technical Parameters)

Q: What is the typical drive current for this LED?
A: The electro-optical characteristics are specified at 100mA. It can be driven up to its absolute maximum of 120mA continuously, but the luminous output and efficacy should be verified at the intended operating point, as they will vary with current.

Q: How do I interpret the voltage binning (6R, 6S, 6T)?
A: This indicates the forward voltage range at 100mA. For example, bin 6S LEDs have a VF between 48V and 50V. Using LEDs from the same bin can simplify driver design by reducing voltage spread in series strings.

Q: Is a heatsink necessary?
A> Yes, absolutely. With a maximum power dissipation of over 6 watts, effective thermal management via an MCPCB and/or system-level heatsink is essential to maintain performance and lifetime. The 3°C/W thermal resistance is from junction to solder point; the total system thermal resistance to ambient must be calculated.

11. Practical Application Examples

Example 1: Linear LED Module for Office Lighting. Multiple 5050 LEDs can be arranged in series on a long, narrow MCPCB strip. Their high lumen output means fewer LEDs are needed per meter to achieve the desired illuminance, potentially lowering cost and complexity. The wide viewing angle ensures even light distribution across a ceiling or work surface. Selecting 4000K or 5000K LEDs with Ra80 provides a neutral, productive light environment.

Example 2: Backlight Unit for a Large Format Signage. The high brightness and robust package make these LEDs suitable for outdoor or high-ambient-light indoor signage. They can be densely packed behind a diffuser panel. The tight color binning ensures uniform white background color across the entire sign face, which is critical for brand image and readability.

12. Operating Principle Introduction

This is a phosphor-converted white LED. The core of the device is a semiconductor chip that emits blue light when electrical current passes through it in the forward direction (electroluminescence). This blue light is partially absorbed by a phosphor coating deposited over the chip. The phosphor re-emits this energy as light across a broad spectrum in the yellow/orange/red region. The combination of the remaining blue light from the chip and the broad-spectrum light from the phosphor mixes to produce white light. The exact ratio of blue to phosphor-converted light determines the correlated color temperature (CCT) of the output. The color rendering index (CRI) is influenced by the specific phosphor blend, with more complex blends typically yielding higher CRI values by filling in spectral gaps.

13. Technology Trends

The solid-state lighting industry continues to evolve towards higher efficacy (lumens per watt), improved color quality (higher CRI and better color consistency), and greater reliability. Packages like this 5050 LED represent a trend of scaling up mid-power platforms to handle higher drive currents and power levels, blurring the lines between mid-power and high-power LED categories. This is achieved through advanced package materials (e.g., ceramic substrates, high-thermal-conductivity molding compounds) and improved phosphor technology for better thermal stability and color maintenance. Furthermore, there is a growing emphasis on standardization of footprints, photometric testing, and binning to simplify design and sourcing for lighting manufacturers. The drive for sustainability also pushes for higher efficiency and longer lifetimes, reducing the total cost of ownership and environmental impact.