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LTW-010DCG-TR LED Datasheet - 3.0x1.6x1.6mm - 3.4V - 120mW - White Light - English Technical Document

Technical datasheet for the LTW-010DCG-TR white LED, featuring 3000mcd luminous intensity, 115-degree viewing angle, and compatibility with IR reflow. Includes specifications, binning, and application guidelines.
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PDF Document Cover - LTW-010DCG-TR LED Datasheet - 3.0x1.6x1.6mm - 3.4V - 120mW - White Light - English Technical Document

1. Product Overview

The LTW-010DCG-TR is a surface-mount white light-emitting diode (LED) designed as an energy-efficient and compact light source. It combines the long operational lifetime and reliability inherent to LED technology with a high level of brightness suitable for displacing conventional lighting in various applications. The device is packaged for automated assembly processes, offering designers flexibility in integrating solid-state lighting into their products.

1.1 Core Advantages and Target Market

The primary advantages of this component include its high luminous intensity, wide viewing angle, and compatibility with standard infrared (IR) and vapor phase reflow soldering processes. Its EIA-standard package ensures easy integration into existing manufacturing lines. The product is classified as green and is Pb-free, complying with RoHS directives. Target applications are diverse, ranging from automotive and portable lighting (e.g., reading lights, flashlights) to architectural, decorative, and signaling uses (e.g., edge-lit signs, traffic beacons, downlighters).

2. Technical Parameters: In-Depth Objective Interpretation

2.1 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. They are not intended for normal operation.

2.2 Electro-Optical Characteristics

These parameters are measured at a standard test condition of 25°C ambient temperature and a forward current (IF) of 20 mA, which serves as a common reference point.

3. Binning System Explanation

To ensure consistency in mass production, LEDs are sorted into bins based on key parameters. This allows designers to select components that meet specific application requirements for color and brightness uniformity.

3.1 Forward Voltage (VF) Binning

The VF bin code (V1 to V7) categorizes LEDs based on their forward voltage at 20mA. Each bin has a 0.1V range (e.g., V1: 2.7-2.8V, V7: 3.3-3.4V), with a tolerance of ±0.1V on each bin. This helps in designing stable constant-current drivers.

3.2 Luminous Intensity (IV) Binning

The IV bin code (S3 to S10) categorizes LEDs based on their luminous intensity at 20mA. Bins range from S3 (2200-2300 mcd) to S10 (2900-3000 mcd). A tolerance of ±10% is applied to the luminous intensity and luminous flux within each bin. The mcd value is for reference.

3.3 Color (Chromaticity) Binning

The color rank table (e.g., A1, C1, D4) defines specific quadrilaterals on the CIE 1931 chromaticity diagram. Each rank has defined corner coordinates for x and y, ensuring the LED's white point falls within a controlled region. A tolerance of ±0.01 is applied to each hue (x, y) bin. This is critical for applications requiring consistent white color appearance across multiple LEDs.

4. Performance Curve Analysis

The datasheet references typical characteristic curves which are essential for understanding device behavior under non-standard conditions. While the specific graphs are not reproduced in the text, their implications are standard.

5. Mechanical and Package Information

5.1 Outline Dimensions

The package dimensions are 3.0mm in length, 1.6mm in width, and 1.6mm in height, with a tolerance of ±0.1mm unless otherwise specified. The cathode is typically identified by a marking or a notch on the package. Detailed dimensional drawings should be consulted for precise placement and footprint design.

5.2 Recommended PCB Attachment Pad

A land pattern design is provided for infrared or vapor phase reflow soldering. This pad layout is optimized for reliable solder joint formation, good thermal dissipation, and mechanical stability. Adhering to this recommendation is important for manufacturing yield and long-term reliability.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Parameters

The component is compatible with infrared reflow soldering. A recommended lead-free reflow profile is referenced (per J-STD-020D), with a peak temperature of 260°C sustained for 10 seconds. Following the recommended temperature ramp rates, preheat, and cooling stages is critical to prevent thermal shock and damage to the LED package or phosphor.

6.2 Cleaning

If cleaning is necessary after soldering, only specified chemicals should be used. The LED can be immersed in ethyl alcohol or isopropyl alcohol at normal temperature for less than one minute. Unspecified chemical liquids may damage the epoxy lens or package.

6.3 Storage and Handling

The product is rated Moisture Sensitivity Level (MSL) 3 per JEDEC J-STD-020. Precautions are required to prevent moisture-induced damage during reflow ("popcorning").

7. Packaging and Ordering Information

7.1 Tape and Reel Specifications

The components are supplied in 12mm wide embossed carrier tape on 7-inch (178mm) diameter reels. Each reel can contain a maximum of 2000 pieces. The packaging conforms to EIA-481-1-B specifications. The tape has cover tape to seal empty pockets, and there is a limit of two consecutive missing components per reel.

7.2 Part Number and Marking

The part number is LTW-010DCG-TR. The luminous flux classification code is marked on each packing bag for traceability and bin identification.

8. Application Suggestions

8.1 Typical Application Circuits

This LED requires a constant current source for optimal operation and longevity. A simple series resistor can be used with a stable voltage supply, calculated as R = (Vsupply - VF) / IF. For better efficiency and stability over temperature, a dedicated LED driver IC is recommended, especially when driving multiple LEDs in series or parallel. The maximum DC current should not exceed 30mA.

8.2 Thermal Management Design Considerations

Although power dissipation is relatively low (120mW max), proper thermal design is essential to maintain light output and lifespan. The recommended PCB pad aids in heat transfer. For high-current or high-ambient-temperature applications, ensure adequate copper area on the PCB for heat sinking. Operating the LED at lower currents than the maximum can significantly improve efficacy and longevity.

8.3 Optical Design Considerations

The 115-degree viewing angle produces a wide, diffuse beam. For applications requiring a more focused beam, secondary optics such as lenses or reflectors must be used. The chromaticity binning should be considered when multiple LEDs are used side-by-side to avoid visible color differences.

9. Technical Comparison and Differentiation

The LTW-010DCG-TR differentiates itself through its combination of high typical luminous intensity (3000mcd) and a very wide viewing angle (115°). Many competing LEDs offer either high intensity with a narrow beam or a wide beam with lower intensity. This makes it suitable for applications requiring both good overall lumen output and broad illumination coverage without secondary optics. Its compatibility with standard SMD assembly and reflow processes is a key advantage for high-volume manufacturing.

10. Frequently Asked Questions (Based on Technical Parameters)

10.1 What is the difference between luminous intensity (mcd) and luminous flux (lm)?

Luminous intensity measures brightness in a specific direction (candelas), while luminous flux measures the total visible light output in all directions (lumens). This datasheet primarily specifies intensity. The wide viewing angle suggests the total flux is effectively utilized over a broad area.

10.2 Can I drive this LED at 30mA continuously?

Yes, 30mA is the maximum recommended DC forward current. However, for improved reliability and longer life, driving it at a lower current, such as 20mA (the test condition), is advisable. Always consider the ambient temperature and thermal design.

10.3 How do I interpret the color binning table?

The table defines regions on the CIE color chart. To ensure color matching, specify the desired color rank (e.g., C1) when ordering. LEDs from the same rank will have chromaticity coordinates falling within the defined quadrilateral, ensuring visual consistency.

10.4 What happens if I exceed the 5V reverse voltage?

Applying a reverse voltage greater than 5V can cause immediate and catastrophic failure of the LED junction. It is crucial to ensure the circuit design prevents reverse bias conditions, possibly by using a protection diode in parallel if the LED is connected to an AC source or a circuit where reverse voltage is possible.

11. Practical Design and Usage Case

Case: Designing a Portable Task Light
For a battery-powered task light requiring even, wide-area illumination, the LTW-010DCG-TR is an excellent choice. A designer would select LEDs from a tight luminous intensity bin (e.g., S8-S10) and a single color rank (e.g., C2) to ensure uniform brightness and color. They would design a constant-current driver using a boost converter to efficiently drive 3-4 LEDs in series from a 3.7V Li-ion battery, setting the current to 20-25mA for a balance of output and battery life. The wide 115-degree angle eliminates the need for a diffuser, simplifying the mechanical design. The MSL-3 rating mandates planning the assembly process to solder the LEDs within a week of opening the moisture-barrier bag.

12. Operating Principle Introduction

A white LED like the LTW-010DCG-TR typically operates on the principle of phosphor conversion. The core of the device is a semiconductor chip (usually based on indium gallium nitride - InGaN) that emits light in the blue or ultraviolet spectrum when forward biased. This primary light is then directed onto a phosphor layer deposited inside the package. The phosphor absorbs a portion of the primary light and re-emits it as light of longer wavelengths (yellow, red). The mixture of the unconverted blue light and the phosphor-emitted light is perceived by the human eye as white. The exact proportions determine the correlated color temperature (CCT) and chromaticity coordinates.

13. Technology Trends

The solid-state lighting industry continues to evolve with trends focused on increasing efficacy (lumens per watt), improving color rendering index (CRI) for more natural light, and achieving higher reliability and longer lifetimes. There is also a drive toward miniaturization and higher power density. Furthermore, smart lighting integration, featuring tunable white light (adjustable CCT) and connectivity, is becoming more prevalent. Components like the LTW-010DCG-TR represent the mature, cost-effective segment of the market, providing reliable performance for standard lighting applications while these advanced trends develop in higher-end products.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.