334-15/T2C3-2TVC White LED Lamp Datasheet - T-1 3/4 Package - 3.2V Typ - 30mA - English Technical Document

1. Product Overview

This document details the specifications for a high-luminosity white LED lamp. The device is housed in a popular T-1 3/4 round package, making it suitable for a wide range of indicator and illumination applications. The core technology utilizes an InGaN semiconductor chip, with the emitted blue light converted to white through a phosphor coating within the reflector. Key advantages include high luminous power output and compliance with major environmental and safety standards such as RoHS, REACH, and halogen-free requirements.

2. Technical Parameter Deep Dive

2.1 Absolute Maximum Ratings

The device is designed to operate reliably within specified limits. The continuous forward current (I_F) must not exceed 30 mA, with a peak forward current (I_FP) of 100 mA permissible under pulsed conditions (1/10 duty cycle at 1 kHz). The maximum reverse voltage (V_R) is 5 V. The power dissipation (P_d) rating is 110 mW. The operational temperature range is from -40°C to +85°C, with a slightly wider storage temperature (T_stg) range of -40°C to +100°C. The LED can withstand electrostatic discharge (ESD) up to 4 kV (Human Body Model). The maximum soldering temperature is 260°C for 5 seconds.

2.2 Electro-Optical Characteristics

Under standard test conditions (Ta=25°C, I_F=20mA), the forward voltage (V_F) typically falls between 2.8V and 3.6V. The luminous intensity (I_V) has a typical value of 7150 to 14250 millicandelas (mcd), depending on the specific bin. The viewing angle (2θ_1/2) is approximately 30 degrees, providing a focused beam. The typical chromaticity coordinates, according to the CIE 1931 color space, are x=0.26 and y=0.27, indicating a cool white color point. The reverse current (I_R) at V_R=5V is a maximum of 50 µA.

3. Binning System Explanation

3.1 Luminous Intensity Binning

To ensure consistency, LEDs are sorted into bins based on luminous intensity measured at 20mA. The bin codes and their corresponding ranges are: T (7150-9000 mcd), U (9000-11250 mcd), and V (11250-14250 mcd). A tolerance of ±10% applies to these values.

3.2 Forward Voltage Binning

LEDs are also binned by forward voltage (V_F) at 20mA. The bins are: 0 (2.8-3.0V), 1 (3.0-3.2V), 2 (3.2-3.4V), and 3 (3.4-3.6V). The measurement uncertainty for V_F is ±0.1V.

3.3 Color Binning

The color performance is controlled within specific chromaticity regions defined on the CIE diagram. The datasheet specifies two primary color rank groups, A1 and A0, each with defined coordinate boundaries (e.g., A1: x 0.255-0.28, y 0.245-0.267). The combined color group for this product is listed as 2 (A1+A0). The measurement uncertainty for color coordinates is ±0.01.

4. Performance Curve Analysis

The datasheet includes several characteristic curves that are crucial for design engineers. The Relative Intensity vs. Wavelength curve shows the spectral power distribution of the white light, typically peaking in the blue region (from the chip) with a broad secondary peak in the yellow/green region (from the phosphor). The Directivity pattern visually confirms the 30-degree viewing angle, showing how light intensity decreases off-axis. The Forward Current vs. Forward Voltage (I-V) curve is essential for driver design, illustrating the non-linear relationship and helping to calculate power requirements and thermal load. The Relative Intensity vs. Forward Current curve shows how light output increases with current, important for dimming or over-driving considerations. The Chromaticity Coordinate vs. Forward Current graph indicates color shift with drive current, a critical factor for applications requiring stable color. Finally, the Forward Current vs. Ambient Temperature curve is vital for thermal management, showing how the maximum safe operating current decreases as ambient temperature rises.

5. Mechanical and Package Information

The LED uses a standard T-1 3/4 (5mm) round package with two axial leads. The package drawing provides critical dimensions including the diameter of the epoxy lens, the lead spacing (which is measured where the leads emerge from the package body), and the overall length. Key notes specify that all dimensions are in millimeters with a standard tolerance of ±0.25mm unless otherwise stated. The maximum protrusion of resin under the flange is 1.5mm. Proper alignment of PCB holes with the LED leads is emphasized to avoid mechanical stress during mounting.

6. Soldering and Assembly Guidelines

Proper handling is required to maintain LED performance and reliability. For lead forming, bends should be made at least 3mm from the base of the epoxy bulb to avoid stress on the package. Forming must be done before soldering, and leads should be cut at room temperature. For storage, LEDs should be kept at ≤30°C and ≤70% RH after shipment, with a shelf life of 3 months. For longer storage (up to 1 year), a sealed container with nitrogen and desiccant is recommended. Rapid temperature changes in humid environments should be avoided to prevent condensation. For soldering, the solder joint must be at least 3mm from the epoxy bulb. Recommended conditions are: for hand soldering, an iron tip temperature ≤300°C (30W max) for ≤3 seconds; for wave/dip soldering, a preheat ≤100°C for ≤60 seconds and a solder bath at ≤260°C for ≤5 seconds.

7. Packaging and Ordering Information

7.1 Packing Specification

The LEDs are packaged to prevent electrostatic discharge and moisture ingress. They are placed in anti-static bags. The packing quantity is flexible, ranging from a minimum of 200 to a maximum of 500 pieces per bag. Five bags are packed into one inner carton, and ten inner cartons constitute one master (outside) carton.

7.2 Label Explanation

Labels on the packaging contain several codes: CPN (Customer's Part Number), P/N (Production Part Number), QTY (Quantity), CAT (combination code for Luminous Intensity and Forward Voltage bins), HUE (Color Rank), REF (Reference), and LOT No. (Lot Number for traceability).

7.3 Model Number Designation

The part number 334-15/T2C3-2TVC follows a specific structure where the trailing characters (represented by squares in the datasheet) select the specific Color Group, Luminous Intensity Bin, and Voltage Group. This allows precise ordering of LEDs with desired performance characteristics.

8. Application Suggestions

8.1 Typical Application Scenarios

The high luminous intensity and focused beam make this LED ideal for applications requiring bright, visible indicators. Primary uses include message panels and signage, optical indicators on equipment and consumer electronics, backlighting for small displays or panels, and marker lights.

8.2 Design Considerations

Designers must consider several factors. Current Limiting: A series resistor or constant-current driver is mandatory to prevent exceeding the maximum forward current, especially given the steep I-V curve. Thermal Management: While the package is small, the power dissipation (up to 110mW) can cause a temperature rise. The derating curve (Forward Current vs. Ambient Temperature) must be followed, especially in enclosed spaces or high ambient temperatures. Adequate PCB copper or heatsinking may be necessary for continuous operation at high currents. Optical Design: The 30-degree viewing angle provides a relatively focused beam. For wider illumination, secondary optics (diffusers, lenses) may be required. Color Consistency: For applications where color matching between multiple LEDs is critical, ordering from the same production lot and color bin is advised to minimize variations.

9. Technical Comparison and Differentiation

Compared to generic 5mm LEDs, this product offers significantly higher luminous intensity (up to 14,250 mcd), placing it in a high-brightness category. The defined binning structure for intensity, voltage, and color provides engineers with predictable performance, which is essential for volume production and quality control. Compliance with RoHS, REACH, and halogen-free standards makes it suitable for global markets with strict environmental regulations. The inclusion of detailed characteristic curves and extensive application notes in the datasheet provides greater design support than typical basic LED specifications.

10. Frequently Asked Questions (Based on Technical Parameters)

Q: What is the typical drive current for this LED?

A: The electro-optical characteristics are specified at 20mA, which is the standard test current. It can be operated up to the maximum continuous current of 30mA for higher brightness, but thermal effects and lifetime must be considered.

Q: How do I interpret the luminous intensity bin code (T, U, V)?

A: These codes represent sorted groups of LEDs based on their measured light output. 'T' is the lowest intensity bin (7150-9000 mcd), 'U' is medium (9000-11250 mcd), and 'V' is the highest (11250-14250 mcd) when tested at 20mA.

Q: Can I drive this LED directly from a 5V supply?

A: No. The typical forward voltage is around 3.2V. Connecting it directly to 5V would cause excessive current to flow, destroying the LED. You must use a current-limiting resistor or a regulated constant-current driver.

Q: What does the viewing angle of 30 degrees mean?

A> It means the angle at which the luminous intensity is half of the intensity measured directly on-axis (0 degrees). It defines the beam width; a 30-degree angle produces a fairly focused spot of light.

Q: Are these LEDs suitable for outdoor use?

A: The operating temperature range (-40°C to +85°C) supports many outdoor environments. However, the package is not specifically rated for waterproofing or UV resistance. For prolonged outdoor exposure, additional environmental protection (conformal coating, sealed enclosures) would be necessary.

11. Practical Use Case Example

Scenario: Designing a high-visibility status indicator for industrial equipment. An engineer needs a very bright, reliable indicator to show "power on" or "system fault" on a machine that may be viewed from several meters away in a well-lit factory. They select this LED in the highest luminous intensity bin (V). They design a circuit using a 12V rail, a current-limiting resistor calculated for ~20mA drive current (factoring in the LED's V_F from the selected voltage bin), and a transistor switch controlled by the equipment's microcontroller. They mount the LED on the front panel using a holder that provides strain relief for the leads, ensuring the solder joint is >3mm from the body as per the guidelines. The focused 30-degree beam ensures the indicator is clearly visible to operators within its field of view.

12. Operating Principle Introduction

This is a phosphor-converted white LED. The core light-emitting element is a semiconductor chip made from Indium Gallium Nitride (InGaN). When a forward voltage is applied across the chip's P-N junction, electrons and holes recombine, releasing energy in the form of photons. The bandgap of the InGaN material is engineered to produce blue light (typically around 450-470 nm). This blue light is not emitted directly. Instead, it strikes a layer of phosphor material (e.g., Yttrium Aluminum Garnet doped with Cerium - YAG:Ce) that is deposited inside the reflector cup surrounding the chip. The phosphor absorbs a portion of the blue photons and re-emits light across a broader spectrum, predominantly in the yellow region. The mixture of the remaining blue light and the converted yellow light is perceived by the human eye as white light. The specific ratios of phosphor and the exact composition determine the correlated color temperature (CCT) and color rendering index (CRI) of the white light produced.

13. Technology Trends and Context

The T-1 3/4 (5mm) through-hole LED package represents a mature and widely adopted form factor. While surface-mount device (SMD) packages like 2835 or 3030 dominate new designs for their size and manufacturability, the 5mm LED remains relevant for applications requiring simple through-hole assembly, high single-point brightness, or compatibility with existing tooling and designs. The trend in LED technology continues towards higher efficacy (more lumens per watt), improved color rendering, and tighter color and flux binning to ensure consistency. For white LEDs, there is ongoing development in phosphor technology to achieve higher efficiency, better color stability over temperature and time, and a wider range of color temperatures and CRIs. While this datasheet describes a cool white LED, the underlying InGaN+phosphor platform can be tuned to produce neutral and warm white light as well. The integration of protection features like built-in Zener diodes for ESD or reverse voltage protection, as hinted at in the electrical ratings, is also a common trend to enhance robustness in end applications.