Table of Contents
- 1. Product Overview
- 2. Technical Parameter Analysis
- 2.1 Electrical / Optical Characteristics (at Ts=25°C, IF=5mA)
- 2.2 Absolute Maximum Ratings
- 3. Binning System
- 3.1 Forward Voltage Bins (at IF=5mA)
- 3.2 Luminous Intensity Bins (at IF=5mA)
- 3.3 Chromaticity Bins (CIE 1931)
- 4. Performance Curve Analysis
- 4.1 Forward Voltage vs Forward Current
- 4.2 Forward Current vs Relative Intensity
- 4.3 Temperature Characteristics
- 4.4 Radiation Pattern
- 4.5 Spectrum Distribution
- 5. Mechanical & Packaging Information
- 5.1 Package Dimensions
- 5.2 Polarity & Soldering Pattern
- 5.3 Carrier Tape & Reel Dimensions
- 5.4 Label & Box
- 6. Soldering & Assembly Guidelines
- 6.1 Reflow Soldering Profile
- 6.2 Hand Soldering
- 6.3 Repairing
- 6.4 Handling Precautions
- 7. Packaging & Ordering Information
- 8. Application Suggestions
- 8.1 Automotive Interior Lighting
- 8.2 Circuit Design Considerations
- 8.3 Environmental Compatibility
- 9. Technical Comparison with Similar LEDs
- 10. Frequently Asked Questions
- 11. Practical Application Case Study
- 12. Operating Principle
- 13. Industry Trends
- LED Specification Terminology
- Photoelectric Performance
- Electrical Parameters
- Thermal Management & Reliability
- Packaging & Materials
- Quality Control & Binning
- Testing & Certification
1. Product Overview
The RF-A1P14-WB12-A2 is a high-performance white LED packaged in a compact PLCC2 (2.20mm x 1.40mm x 1.30mm) configuration. It utilizes a blue chip combined with a yellow phosphor to produce cool white light. Designed for automotive interior lighting applications, this LED meets the stringent requirements of AEC-Q101 stress tests for automotive-grade discrete semiconductors. Key features include an extremely wide viewing angle (120 degrees), compatibility with standard SMT assembly and reflow processes, tape-and-reel packaging (3000pcs/reel), and moisture sensitivity level 2. The device is fully compliant with RoHS and REACH directives, ensuring environmental safety. With a maximum forward current of 30 mA and peak forward current of 100 mA (1/10 duty cycle, 10ms pulse), the LED offers reliable performance under typical automotive operating conditions (-40°C to +100°C).
2. Technical Parameter Analysis
2.1 Electrical / Optical Characteristics (at Ts=25°C, IF=5mA)
- Forward Voltage (VF): Minimum 2.5V, Typical 2.8V, Maximum 3.1V. With measurement tolerance of ±0.1V.
- Reverse Current (IR): Maximum 10 µA at VR=5V.
- Luminous Intensity (IV): Minimum 350 mcd, Typical 500 mcd, Maximum 650 mcd. Measurement tolerance ±10%.
- Viewing Angle (2θ1/2): 120 degrees typical.
- Thermal Resistance (RTHJ-S): Typical 300°C/W.
2.2 Absolute Maximum Ratings
- Power Dissipation: 93 mW
- Forward Current (DC): 30 mA
- Peak Forward Current (pulse): 100 mA (1/10 duty, 10ms)
- Reverse Voltage: 5 V
- ESD (HBM): 8000 V (yield >90%)
- Operating Temperature: -40°C ~ +100°C
- Storage Temperature: -40°C ~ +100°C
- Junction Temperature: 120°C maximum
Care must be taken to ensure that power dissipation does not exceed the absolute maximum rating, and that junction temperature remains below 120°C. The current should be adjusted based on actual package temperature measurements.
3. Binning System
3.1 Forward Voltage Bins (at IF=5mA)
The forward voltage is sorted into six bins:
| Bin Code | VF Range (V) |
|---|---|
| E2 | 2.5–2.6 |
| F1 | 2.6–2.7 |
| F2 | 2.7–2.8 |
| G1 | 2.8–2.9 |
| G2 | 2.9–3.0 |
| H1 | 3.0–3.1 |
3.2 Luminous Intensity Bins (at IF=5mA)
- J1: 350–430 mcd
- J2: 430–530 mcd
- K1: 530–650 mcd
3.3 Chromaticity Bins (CIE 1931)
The LED is binned into three chromaticity groups (LLO, LLA, LLB) with specific CIE-x/y coordinates:
- LLO: (0.1980,0.1850), (0.2050,0.1950), (0.2170,0.1950), (0.2100,0.1850)
- LLA: (0.2050,0.1950), (0.2120,0.2050), (0.2240,0.2050), (0.2170,0.1950)
- LLB: (0.2120,0.2050), (0.2190,0.2150), (0.2310,0.2150), (0.2240,0.2050)
Measurement tolerance for chromaticity coordinates is ±0.005. The binning system ensures consistency in color appearance for lighting applications.
4. Performance Curve Analysis
4.1 Forward Voltage vs Forward Current
At 5 mA, VF is typically 2.8V; as current increases to 30 mA, VF rises to about 3.1V. The curve is approximately linear with a slope of about 0.012 V/mA.
4.2 Forward Current vs Relative Intensity
Relative intensity increases with current; at 5 mA the intensity is 100%, at 15 mA it reaches approximately 250%. The relationship is super-linear due to increased recombination efficiency at higher current densities.
4.3 Temperature Characteristics
- Relative Luminous Flux vs Solder Temperature: At 85°C, flux drops to about 85% of the value at 25°C. At 105°C, it falls to approximately 70%.
- Forward Current Derating: Maximum forward current must be reduced as temperature rises; at 100°C, the allowable current is about 10 mA.
- Forward Voltage vs Temperature: VF decreases linearly with temperature at a rate of about -2 mV/°C.
- Chromaticity Shift vs Temperature: CIE-y shifts slightly upward with temperature (about 0.002 from 25°C to 85°C), while CIE-x remains relatively stable.
4.4 Radiation Pattern
The LED has a Lambertian-like radiation pattern with a full width at half maximum (FWHM) of 120°. Relative intensity drops to 50% at ±60° from the optical axis.
4.5 Spectrum Distribution
The white light is produced by a blue LED chip (peak around 450 nm) and a yellow phosphor that emits broadband light from 500–700 nm, resulting in a correlated color temperature (CCT) typically around 5000–6500K (based on chromaticity bins).
5. Mechanical & Packaging Information
5.1 Package Dimensions
The LED package measures 2.20mm (length) × 1.40mm (width) × 1.30mm (height). Tolerances are ±0.20mm unless otherwise noted. The package is a standard PLCC2 with a silicone lens on top.
5.2 Polarity & Soldering Pattern
The bottom view shows two pads: cathode (marked with a notch) and anode. Recommended soldering pad dimensions are provided in the datasheet (figure Fig.1-4). The pads should be designed to match the underside contacts for reliable solder joint formation.
5.3 Carrier Tape & Reel Dimensions
- Carrier tape: 8.0mm width, with pockets for LEDs. Key dimensions: A0=1.50mm, B0=2.35mm, K0=1.48mm, pitch P0=4.0mm, P1=4.0mm, P2=2.0mm.
- Reel: 178mm diameter (7 inch), hub 60mm, flange 13mm. Each reel contains 3000pcs.
5.4 Label & Box
The label includes part number, spec number, lot number, bin code (IV, XY, VF), wavelength, quantity, and date. Moisture barrier bag with desiccant and ESD warning label. Cardboard box for bulk shipping.
6. Soldering & Assembly Guidelines
6.1 Reflow Soldering Profile
Recommended profile for lead-free reflow:
- Ramp-up rate: ≤3°C/s
- Preheat: 150°C–200°C for 60–120 seconds
- Reflow: >217°C for 60 seconds (max), with peak temperature 260°C for 10 seconds (max)
- Cooling rate: ≤6°C/s
- Total time from 25°C to peak: ≤8 minutes
Do not exceed two reflow cycles. If the interval between cycles exceeds 24 hours, the LEDs may be damaged due to moisture absorption.
6.2 Hand Soldering
If hand soldering is necessary, use a soldering iron set to ≤300°C for less than 3 seconds, and perform only once.
6.3 Repairing
Repair is not recommended. If unavoidable, use a double-head soldering iron and pre-validate that LED characteristics remain within specification.
6.4 Handling Precautions
- Avoid applying pressure on the silicone lens (top surface). Use a proper pick-and-place nozzle with controlled force.
- Do not mount LEDs on warped PCB sections.
- Avoid mechanical stress or vibration during cooling after soldering.
- Do not rapidly cool the device after soldering.
7. Packaging & Ordering Information
The LEDs are supplied in sealed moisture barrier bags with desiccant. Storage conditions before opening: 30°C / 75% RH for up to 1 year from date of manufacture. After opening: 30°C / 60% RH, recommended for use within 24 hours. If the desiccant has changed color or storage time exceeded, bake at 60±5°C for ≥24 hours before use.
Ordering is by reel (3000pcs). Customers should specify bin codes (VF, IV, chromaticity) as per application requirements.
8. Application Suggestions
8.1 Automotive Interior Lighting
The wide viewing angle (120°) and compact size make this LED ideal for dome lights, map lights, ambient lighting strips, and instrument panel backlighting. The AEC-Q101 qualification ensures reliability under thermal shock, high temperature/humidity, and extended life tests.
8.2 Circuit Design Considerations
- Always use current-limiting resistors to prevent thermal runaway due to VF variation.
- Ensure adequate heat sinking on the PCB (thermal vias, copper pours) to keep junction temperature below 120°C.
- For parallel strings, match VF bins to equalize current distribution.
- Protect against reverse voltage (ESD diode or series blocking diode) to avoid migration damage.
8.3 Environmental Compatibility
Avoid exposure to sulfur-containing compounds (>100ppm), halogens (Br, Cl <900ppm each, total <1500ppm), and volatile organic compounds (VOCs) that can discolor the silicone encapsulant. Clean with isopropyl alcohol if needed; ultrasonic cleaning is not recommended.
9. Technical Comparison with Similar LEDs
Compared to standard PLCC2 white LEDs (e.g., 2835 size, 2.8×3.5mm), the RF-A1P14-WB12-A2 offers a smaller footprint (2.2×1.4mm) while maintaining high luminous intensity (up to 650 mcd at 5 mA). The 120° viewing angle is wider than many competing packages (typically 110–115°), making it better suited for uniform interior lighting. Additionally, the ESD withstand voltage of 8kV exceeds typical 2kV for standard parts, providing robust protection in manufacturing environments.
10. Frequently Asked Questions
Q: Can this LED be driven at currents above 30 mA?
A: No. The absolute maximum rating is 30 mA DC. Exceeding this may cause immediate damage or accelerated degradation.
Q: What is the typical color temperature?
A: Based on the chromaticity bins (LLO, LLA, LLB), the CCT is approximately 5000K–6500K, corresponding to cool white.
Q: How should I handle the LED to prevent ESD damage?
A: Use grounded workstations, conductive wrist straps, and antistatic packaging. The LED is designed to withstand 8kV HBM, but proper ESD precautions are still necessary.
Q: What is the recommended storage after opening the bag?
A: Use within 24 hours at 30°C/60% RH. If not used, bake at 60°C for ≥24 hours before next use.
11. Practical Application Case Study
In a typical automotive dome light module, six RF-A1P14-WB12-A2 LEDs are arranged in a linear array on an aluminum-core PCB. Each LED is driven at 10 mA (total 60 mA). With a forward voltage of ~2.8V each, the total power is about 1.7W. The module delivers 3000–4000 mcd uniform illumination with a 120° beam angle, comfortably meeting interior lighting requirements. Thermal simulations show junction temperatures below 85°C even in high ambient conditions (85°C), thanks to the aluminum substrate and thermal vias.
12. Operating Principle
The white LED employs a blue-emitting InGaN chip coated with a cerium-doped yttrium aluminum garnet (YAG:Ce) phosphor. The blue light (peak ~450 nm) excites the phosphor, which emits yellow light. The combination of blue and yellow produces white light. The exact chromaticity is controlled by the phosphor composition and thickness. The PLCC2 package provides a reflective cavity to enhance light extraction and a silicone lens for wide angle emission.
13. Industry Trends
Automotive interior lighting is transitioning from traditional incandescent bulbs to LEDs for longer life, lower power consumption, and design flexibility. Miniaturization (like PLCC2) allows slim light guides and edge-lighting. Higher efficacy and better color consistency are driving adoption of binning standards. The trend toward autonomous driving also increases the importance of ambient lighting for user experience. Future developments include tunable white LEDs and integration with smart control systems, but the PLCC2 platform remains a workhorse for cost-effective solutions.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |