LED PLCC-2 White LED Specification - Size 2.8x3.5x0.7mm - Forward Voltage 8.6-9.4V - Power 1080mW - English Technical Datasheet

1. Product Overview

This White LED is a high-performance surface-mount device fabricated using a blue chip and phosphor conversion technology. The product is housed in a compact PLCC-2 package measuring 2.8mm x 3.5mm x 0.7mm, making it suitable for various lighting applications where space and efficiency are critical. Key features include an extremely wide viewing angle of 120 degrees, compatibility with all SMT assembly and solder processes, and RoHS compliance. The LED is rated moisture sensitivity level 3 and is delivered on tape and reel (12,000 pcs per reel). Typical applications include indoor lighting, bulb lighting, and general indoor applications.

2. Technical Parameter Analysis

2.1 Electrical/Optical Characteristics (at Ts=25°C, IF=100mA)

The following table summarizes the key electrical and optical parameters measured at a forward current of 100mA and solder temperature of 25°C.

• Forward Voltage (VF): The product is binned into two voltage ranks: Y0 (8.6-9.0V) and Z0 (9.0-9.4V). The typical forward voltage is 8.9V for Y0 and 9.2V for Z0 (extrapolated from typical values).
• Luminous Flux (Φ): Three flux bins are available: FC6 (140-150 lm), FC7 (150-160 lm), and FC8 (160-170 lm). For RF-W6HP32DS-FH-I3 and RF-W57HP32DS-FH-I3 the luminous flux values are specified within these ranges.
• Reverse Current (IR): Maximum 10 μA at VR=15V.
• Viewing Angle (2θ½): 120 degrees (typical).
• Color Rendering Index (CRI): 80 minimum, typical 81.5.
• Thermal Resistance (RTHJ-S): 15 °C/W (typical).

2.2 Absolute Maximum Ratings

• Power Dissipation (PD): 1080 mW
• Forward Current (IF): 120 mA (DC), 220 mA (peak, 1/10 duty cycle, 0.1ms pulse)
• Reverse Voltage (VR): 15 V
• Electrostatic Discharge (HBM): 2000 V
• Operating Temperature (TOPR): -40 to +105 °C
• Storage Temperature (TSTG): -40 to +105 °C
• Junction Temperature (TJ): 125 °C

Important notes: The above forward voltage measurement tolerance is ±0.1V. Color coordinate measurement tolerance is 0.005. Luminous intensity measurement tolerance is ±10%. Power dissipation must not exceed the absolute maximum rating. All measurements are made under standardized conditions.

3. Bin System Explanation

3.1 Forward Voltage Bins

The forward voltage is divided into two bins (at IF=100mA): Y0 (8.6-9.0V) and Z0 (9.0-9.4V). For RF-W57HP32DS-FH-I3 and RF-W6HP32DS-FH-I3, the voltage range is Y0 and Z0 respectively as indicated.

3.2 Luminous Flux Bins

Three flux bins are available: FC6 (140-150 lm), FC7 (150-160 lm), and FC8 (160-170 lm). The specific products are allocated as follows: RF-W57HP32DS-FH-I3 (FC6), RF-W6HP32DS-FH-I3 (FC7/FC8).

3.3 Chromaticity Bins (C.I.E. 1931)

The color coordinates are defined in 6-step MacAdam ellipse bins. Two color bins are specified: A57 and A65. Their chromaticity coordinates are provided in the table below (Table 1-4):

• Bin A57: (x1,y1)=(0.3203,0.3432); (x2,y2)=(0.3368,0.3581); (x3,y3)=(0.3365,0.3403); (x4,y4)=(0.3212,0.3257)
• Bin A65: (x1,y1)=(0.3245,0.3567); (x2,y2)=(0.3074,0.3400); (x3,y3)=(0.3085,0.3233); (x4,y4)=(0.3256,0.3399)

4. Performance Curve Analysis

4.1 Forward Voltage vs. Forward Current

Figure 1-7 shows that forward voltage increases with forward current in a typical diode behavior. At 100mA, the voltage is around 9V. For higher currents (up to 120mA), voltage increases slightly.

4.2 Forward Current vs. Relative Intensity

Figure 1-8 indicates that relative luminous intensity increases proportionally with forward current, nearly linear. At 100mA, relative intensity is approximately 1.0 (normalized).

4.3 Solder Temperature vs. Relative Intensity and Forward Current

Figures 1-9 and 1-10 show that as solder temperature increases, relative intensity decreases due to reduced quantum efficiency. The maximum junction temperature is 125°C, so derating is required above 25°C. The curves provide guidelines for allowable current at elevated temperatures.

4.4 Spectrum Distribution

Figure 1-13 shows a typical white LED spectrum with a blue peak around 450nm and a broad yellow phosphor emission extending from 500nm to 700nm. The correlated color temperature (CCT) corresponds to the chromaticity bins (e.g., A57 ~ 5700K, A65 ~ 6500K).

5. Mechanical and Package Information

5.1 Package Dimensions

The package has dimensions of 2.80mm (length) × 3.50mm (width) × 0.70mm (height). The top view shows a rectangular outline with two contact pads. The side view indicates a low profile. The bottom view shows two pads: anode (A) and cathode (C) with polarity marking. Recommended soldering pattern is provided with pad dimensions: 2.10mm (length), 1.96mm (width), spacing 0.50mm. All dimensions in millimeters, tolerance ±0.05mm unless noted.

5.2 Polarity Identification

Polarity is marked on the bottom: A for anode, C for cathode. The cathode side also has a small dot marking on the top surface for easy identification.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

The recommended reflow soldering profile is based on JEDEC standards. Key parameters:

• Average ramp-up rate: max 3 °C/s (from Tsmin to Tp)
• Preheat: 150°C (min) to 200°C (max), duration 60-120 seconds
• Time above 217°C (TL): max 60 seconds
• Peak temperature (TP): 260°C, max 10 seconds
• Cooling rate: max 6 °C/s
• Time from 25°C to peak: max 8 minutes

Important: No more than two reflow cycles are allowed. If more than 24 hours pass between the first and second reflow, LEDs may absorb moisture and be damaged. Do not apply stress on the LEDs during heating.

6.2 Hand Soldering

If hand soldering is necessary, keep iron temperature below 300°C and duration less than 3 seconds. Only one hand solder operation is permitted.

6.3 Repair

Repair after soldering is not recommended. If unavoidable, use a double-head soldering iron and confirm that the characteristics are not damaged.

6.4 Storage Conditions

Before opening the aluminum bag: store at ≤30°C and ≤75% RH for up to one year. After opening: use within 24 hours at ≤30°C and ≤60% RH. If moisture absorbent material has faded or storage time exceeded, bake at 60±5°C for >24 hours before use.

7. Packaging and Ordering Information

7.1 Carrier Tape and Reel

Parts are packaged in carrier tape with dimensions: pitch 4.00mm, width 8.00mm, pocket size 3.02mm × 5.24mm depth 1.55mm. Reel dimensions: A (12.2±0.3mm), B (79.6±0.2mm), C (14.2±0.2mm), D (290±2mm). Each reel contains 12,000 pcs.

7.2 Label Information

Labels include: Part Number, Spec Number, Lot Number, Bin Code, Luminous Flux (Ф), Chromaticity Bin (XY), Forward Voltage (VF), Wavelength (WLD), Quantity (QTY), and Date.

7.3 Moisture Resistant Packing

Reels are placed in a moisture barrier bag with desiccant and humidity indicator card, then packed in cardboard boxes.

8. Application Recommendations

8.1 Typical Applications

• Indoor lighting (downlights, panel lights)
• Bulb lighting (LED retrofit bulbs)
• General indoor applications (troffers, strip lights)

8.2 Design Considerations

• Thermal management: The junction temperature must not exceed 125°C. Adequate heat sinking should be provided. The thermal resistance (junction-to-solder point) is 15°C/W.
• Current derating: Use constant current driving to avoid overcurrent. The maximum forward current is 120mA DC, but at high ambient temperatures, derate accordingly.
• ESD protection: This LED is ESD-sensitive (HBM 2000V). Use proper grounding and ESD-safe handling during assembly.
• Sulfur and halogen content: Ensure that materials in the fixture (adhesives, sealants, reflectors) have low sulfur (<100 ppm) and low bromine/chlorine (each <900 ppm, total <1500 ppm) to prevent corrosion and discoloration.
• VOCs: Avoid materials that outgas organic vapors, as they can penetrate the silicone encapsulant and reduce light output.
• Cleaning: If cleaning is required after soldering, use isopropyl alcohol. Ultrasonic cleaning is not recommended. Do not use solvents that may attack the silicone.

9. Technology Comparison

Compared to conventional mid-power LEDs (e.g., 2835 or 3030 packages), this PLCC-2 LED offers a wider viewing angle (120° vs typical 110-120°) and higher luminous flux per package (up to 170 lm at 100mA). The thermal resistance (15°C/W) is competitive. The use of silicone encapsulation provides better high-temperature stability than epoxy, though it requires careful handling to avoid surface contamination. The binning system allows tight control of color and flux consistency, important for high-quality lighting fixtures.

10. Frequently Asked Questions

10.1 Can I drive this LED at higher current than 120mA?

No, the absolute maximum rating is 120mA DC. Operating above this may cause rapid degradation or failure. Always use current limiting resistors or constant current drivers.

10.2 What is the typical lifespan?

While not directly specified in the datasheet, typical mid-power LEDs with proper thermal management can achieve L70 lifetimes >50,000 hours at rated current. The reliability tests (1000 hours at high temperature/humidity) indicate good robustness.

10.3 How should I solder the LED to avoid damage?

Follow the recommended reflow profile (peak 260°C for 10s, max two passes). The LED is moisture sensitive level 3; if exposed to ambient air for more than 24 hours, bake before soldering. Do not apply mechanical force while hot.

10.4 Can I use this LED for outdoor applications?

The operating temperature range is -40°C to +105°C, so it can be used in outdoor fixtures provided the fixture is properly sealed against moisture and contaminants. However, the silicone encapsulant may be susceptible to UV degradation over time; consider using UV-resistant coatings if prolonged outdoor exposure is expected.

11. Practical Design Cases

11.1 LED Bulb Retrofit

In a typical 9W LED bulb, 12-14 of these LEDs can be used in series-parallel configuration to achieve 800-1000 lumens total output. The wide viewing angle helps achieve a large beam spread. Thermal management via aluminum PCB and housing ensures junction temperature stays below 85°C.

11.2 Linear Lighting Module

For a 1-foot linear strip, 24 LEDs at 100mA each can provide ~3500 lumens. The small package allows dense packing. Use of constant current ICs and careful PCB layout ensures uniform current distribution.

12. Principle of Operation

This LED is a phosphor-converted white LED. A blue InGaN LED chip emits blue light at approximately 450nm. This blue light partially excites a yellow-emitting phosphor (typically YAG:Ce or similar) coated on the chip. The combination of the blue chip emission and the broad yellow phosphor emission produces white light. The color temperature is determined by the phosphor composition and thickness. The encapsulation with silicone provides optical coupling and protection. The electrical characteristic follows typical p-n junction behavior: forward voltage decreases with increasing temperature, while luminous flux decreases due to thermal quenching.

13. Development Trends

Current trends for mid-power white LEDs include higher efficacy (200+ lm/W), improved color rendering (CRI 90+), and tighter color consistency (3-step or 1-step MacAdam ellipses). This product with CRI 80 and 6-step bins is aimed at general lighting where cost-performance is balanced. Future versions may incorporate higher CRI phosphors and better thermal management to achieve higher reliability. The trend also includes miniaturization and integration with smart controls, though this package remains a standard footprint.