LED White PLCC2 Specification - Size 2.8x3.5x0.7mm - Voltage 3.1V - Power 612mW - AEC-Q101 Automotive Grade

1. Product Overview

This white LED is fabricated using a blue chip combined with phosphor to achieve white light emission. The device is housed in a compact PLCC2 package measuring 2.80mm × 3.50mm × 0.70mm, making it suitable for space-constrained automotive interior and exterior lighting applications. With an extremely wide viewing angle of 120 degrees and compliance with AEC-Q101 stress test qualification guidelines, this LED is designed for high-reliability environments. The moisture sensitivity level is rated at Level 2, and the product meets RoHS and REACH requirements.

2. Technical Parameters & Interpretation

2.1 Electrical Characteristics

At a test condition of IF = 150mA and Ts = 25°C, the forward voltage (VF) ranges from 2.8V (minimum) to 3.4V (maximum), with a typical value of 3.1V. The reverse current (IR) at VR = 5V is limited to a maximum of 10µA. The power dissipation (PD) rating is 612mW. The absolute maximum forward current is 180mA, while peak forward current (1/10 duty, 10ms pulse) can reach 350mA. The reverse voltage should not exceed 5V. The operating temperature range is -40°C to +110°C, and storage temperature is the same. The junction temperature (TJ) maximum is 125°C. These parameters ensure robust performance under automotive thermal conditions.

2.2 Optical Characteristics

The luminous flux (Φ) at IF = 150mA ranges from 55.3 lm (minimum) to 75.3 lm (maximum), with a typical value of 65 lm. The wide viewing angle of 120 degrees (2θ1/2) allows uniform light distribution. The color is defined by the chromaticity bin 60N, with coordinates shown in the CIE diagram. The typical spectral distribution peaks around 450nm (blue) and a broad phosphor emission around 550-600nm, providing a cool white appearance.

2.3 Thermal Characteristics

The thermal resistance from junction to solder point (RTHJ-S) is typically 21°C/W. This low thermal resistance enables efficient heat dissipation, which is critical for maintaining luminous flux stability and ensuring long lifetime in automotive applications. Designers must ensure that the solder point temperature does not exceed the absolute maximum ratings, and that junction temperature stays below 125°C.

3. Binning System

3.1 Forward Voltage and Luminous Flux Bins

At IF = 150mA, the forward voltage is divided into six bins: G1 (2.8-2.9V), G2 (2.9-3.0V), H1 (3.0-3.1V), H2 (3.1-3.2V), I1 (3.2-3.3V), I2 (3.3-3.4V). The luminous flux is divided into three bins: PA (55.3-61.2 lm), PB (61.2-67.8 lm), QA (67.8-75.3 lm). This binning allows customers to select devices with tight tolerance for consistent light output and electrical behavior in arrays.

3.2 Chromaticity Binning

The CIE chromaticity diagram shows the bin 60N with four corner coordinates: (0.3157,0.3211), (0.3142,0.3430), (0.3311,0.3584), (0.3301,0.3337). This bin corresponds to a specific white color region suitable for automotive signal and indicator lighting. The color coordinates measurement tolerance is ±0.005.

4. Performance Curves Analysis

4.1 Forward Voltage vs. Forward Current (I-V Curve)

Figure 1-7 shows a typical exponential I-V relationship. At 2.2V the current is near zero; at 3.0V the current reaches approximately 100mA; at 3.2V it reaches 150mA; and at 3.4V it exceeds 200mA. This curve helps designers predict current variation with voltage and choose appropriate series resistors.

4.2 Forward Current vs. Relative Intensity

As forward current increases from 0 to 200mA, relative intensity increases almost linearly, reaching about 125% at 200mA compared to 100% at 150mA. This linearity simplifies dimming control via current modulation.

4.3 Temperature Effects

Figures 1-9 and 1-10 illustrate solder temperature effects. Relative luminous flux decreases gradually from 100% at 25°C to about 70% at 120°C, indicating thermal droop. The forward current derating curve shows that at Ts=110°C, the maximum continuous current is reduced to about 150mA. Figure 1-11 shows forward voltage decreases with increasing temperature (negative temperature coefficient). Figure 1-12 shows color shift with temperature: the CIE coordinates shift slightly toward higher X and Y as temperature rises (red shift). These curves are essential for thermal management and consistent color appearance.

4.4 Radiation Pattern and Spectrum

Figure 1-13 shows a Lambertian-like radiation pattern with relative intensity dropping to 50% at approximately ±60° off-axis. The spectrum (Figure 1-14) shows a blue peak around 450nm and a broad phosphor emission from 500nm to 700nm, with relative intensity normalized to 1.0 at the peak. This spectrum is typical for phosphor-converted white LEDs.

5. Mechanical & Packaging Information

5.1 Package Dimensions and Soldering Patterns

The package has a top view of 2.80mm × 3.50mm, with a height of 0.70mm. The bottom view shows two pads: the anode pad (larger, 1.05mm × 0.55mm) and cathode pad (2.00mm × 0.55mm). Polarity is indicated by a chamfered corner on the package. Recommended soldering patterns are provided in Figure 1-5, with dimensions 2.45mm (width) and 1.50mm (length) for the anode pad, and 2.30mm (width) and 1.05mm (length) for the cathode pad. Tolerances are ±0.2mm unless otherwise noted.

5.2 Carrier Tape and Reel Dimensions

LEDs are supplied on tape and reel with 4000 pieces per reel. The carrier tape width is 8.0±0.1mm, with a feed direction and polarity mark. The reel has an outer diameter of 178±1mm, hub diameter 60±1mm, and thickness 13.0±0.5mm. A label on the reel includes part number, lot number, bin code (flux, chromaticity, voltage), quantity, and date code.

5.3 Moisture Resistant Packing

The product is packed in a moisture barrier bag with a desiccant and humidity indicator card. The moisture sensitivity level is 2, so after opening the bag, the LEDs should be used within 24 hours if stored at ≤30°C and ≤60% RH. If the storage conditions are exceeded, baking at 60±5°C for >24 hours is required before use.

6. Soldering & Assembly Guidelines

6.1 Reflow Soldering Profile

The recommended reflow soldering profile is based on JEDEC standards. The average ramp-up rate from 150°C to 200°C should not exceed 3°C/s. Preheating (150°C to 200°C) lasts 60-120 seconds. The temperature above 217°C (TL) should be maintained for a maximum of 60 seconds. The peak temperature (TP) is 260°C with a maximum time of 10 seconds. The cooling rate should not exceed 6°C/s. Only two reflow cycles are allowed, and if more than 24 hours elapse between cycles, the LEDs may be damaged due to moisture absorption.

6.2 Hand Soldering and Repair

If manual soldering is required, the iron temperature must be below 300°C and contact time less than 3 seconds. Only one hand soldering operation is permitted. Repair after reflow is discouraged; if unavoidable, a double-head soldering iron should be used, and the impact on device characteristics must be verified beforehand.

6.3 Handling Precautions

The encapsulant is silicone, which is soft and easily damaged by mechanical stress. Do not apply strong pressure on the lens surface during pick-and-place; use proper nozzle force. The PCB should not be warped during mounting. After soldering, avoid mechanical stress and rapid cooling. The operating environment must have sulfur content below 100 ppm, and halogen contents (bromine <900 ppm, chlorine <900 ppm, total <1500 ppm). VOCs from fixture materials can discolor the silicone; therefore, compatibility testing is recommended. Cleaning with isopropyl alcohol is suggested; ultrasonic cleaning is not recommended. ESD protection (HBM ≥ 8000V) must be observed during handling.

7. Packaging & Ordering Information

Standard packaging is 4000 pieces per reel on 8mm carrier tape. Each reel is sealed in a moisture barrier bag with desiccant and label. The outer cardboard box contains multiple reels. The label includes Part Number (RF-A1T28-W6SE-A6), Spec Number, Lot Number, Bin Code (VF, Φ, XY), Quantity, and Date. Customers must specify the desired flux and voltage bins when ordering to ensure consistency.

8. Application Recommendations

8.1 Typical Applications

This LED is specifically designed for automotive interior and exterior lighting, including dashboard indicators, map lights, ambient lighting, turn signals, and interior accent lights. The wide viewing angle and high reliability make it suitable for both functional and decorative lighting where consistent color and brightness are critical.

8.2 Design Considerations

When designing the driver circuit, ensure that the forward current does not exceed the absolute maximum rating of 180mA. Use a current-limiting resistor or a constant current driver to prevent thermal runaway. Adequate heat sinking is essential; the solder point temperature should be kept below 110°C to maintain junction temperature under 125°C. The wide operating temperature range (-40°C to +110°C) must be considered for thermal expansion and contraction. For series/parallel arrays, match the forward voltage bins to equalize current distribution. Color shift with temperature should be accounted for if precise color appearance is required over the full temperature range.

9. Technical Comparison & Competitive Advantages

Compared to conventional PLCC2 LEDs, this device features AEC-Q101 automotive qualification, which guarantees higher reliability under thermal shock, high humidity, and extended life tests. The 120° viewing angle is wider than many standard products (typically 110°), providing more uniform illumination. The thermal resistance of 21°C/W is relatively low for this package size, facilitating better heat dissipation. The availability of tight binning (voltage steps of 0.1V, flux steps of ~6 lm) allows higher yield in multi-LED applications. The ESD protection of 8000V (HBM) exceeds typical 2000V ratings, reducing ESD-related failures during assembly.

10. Frequently Asked Questions

Q: What is the maximum current I can drive this LED at?
A: The absolute maximum forward current is 180mA, but the recommended operating current is 150mA. For pulsed operation, up to 350mA at 1/10 duty cycle is allowed.

Q: How should I handle the LED to avoid damage?
A: Avoid touching the silicone lens. Use tweezers on the sides. Ensure ESD precautions (grounded wrist strap, conductive work surface). Store in dry environment and bake if moisture exposure is suspected.

Q: Can I use this LED in outdoor automotive applications?
A: Yes, the device is designed for exterior lighting as per AEC-Q101. However, ensure that the fixture provides adequate thermal management and protection from environmental contaminants.

Q: What does the bin code "60N" mean?
A: It is a chromaticity bin within the CIE 1931 color space defined by four corner coordinates. The specific coordinates are listed in the datasheet. This bin corresponds to a white color region typically used for signaling.

11. Practical Application Case Studies

Case 1: Automotive Interior Ambient Lighting
An OEM required 10mm-wide light strips for door panel ambient lighting. Using 8 LEDs per strip at 150mA, the total flux was ~520lm. With careful thermal design (aluminum PCB), the junction temperature stayed below 90°C. The wide viewing angle ensured uniform illumination without hotspots.

Case 2: Turn Signal Indicator
A turn signal module used 6 LEDs in series with a constant current driver at 150mA. Voltage binning (H1) ensured minimal VF mismatch. The 120° viewing angle provided sufficient visibility in compliance with automotive regulations. The AEC-Q101 qualification gave confidence in long-term reliability under thermal cycling.

12. Operating Principle

This white LED is based on a blue InGaN (indium gallium nitride) chip that emits light at approximately 450nm. The chip is coated with a YAG (yttrium aluminum garnet) phosphor that absorbs a portion of the blue light and re-emits it as yellow light. The combination of the remaining blue light and the yellow fluorescence produces white light. The color temperature and rendering index are determined by the phosphor composition and thickness. The PLCC2 package provides mechanical protection, electrical connections, and a reflective cavity to enhance light extraction.

13. Technology Trends & Future Outlook

White LEDs continue to evolve toward higher efficacy, better color quality, and smaller packages. The trend in automotive lighting is toward miniaturization, integration with smart controls (e.g., PWM dimming, color tuning), and compliance with stringent reliability standards (AEC-Q102 for automotive LEDs). Future developments may include chip-scale packaging (CSP) for smaller footprint, higher flux density, and improved thermal performance. Additionally, phosphor advancements are enabling more precise color binning and lower thermal droop. The use of ceramic substrates or silicone-based encapsulants with enhanced UV resistance is also being explored for extended lifetime in harsh environments.