Table of Contents
- 1. Product Overview
- 2. Technical Parameters Interpretation
- 2.1 Electro-Optical Characteristics
- 2.2 Absolute Maximum Ratings
- 3. Binning System
- 3.1 Forward Voltage Bins
- 3.2 Luminous Flux Bins
- 3.3 Chromaticity Bins
- 4. Performance Curves Analysis
- 4.1 Forward Voltage vs. Forward Current
- 4.2 Relative Intensity vs. Forward Current
- 4.3 Temperature Characteristics
- 4.4 Radiation Pattern
- 4.5 Spectrum Distribution
- 5. Mechanical and Packaging Information
- 5.1 Package Dimensions
- 5.2 Polarity Identification
- 5.3 Carrier Tape and Reel Dimensions
- 6. Soldering and Assembly Guidelines
- 6.1 Reflow Soldering Profile
- 6.2 Hand Soldering and Repair
- 6.3 Precautions
- 7. Packaging and Ordering Information
- 8. Application Recommendations
- 9. Technical Comparison
- 10. Frequently Asked Questions
- 11. Use Case Examples
- 11.1 Residential Downlight
- 11.2 Linear Strip Light
- 12. Principle of Operation
- 13. Development Trends
- LED Specification Terminology
- Photoelectric Performance
- Electrical Parameters
- Thermal Management & Reliability
- Packaging & Materials
- Quality Control & Binning
- Testing & Certification
1. Product Overview
This White LED is fabricated using a blue chip combined with a phosphor coating to produce white light. The package dimensions are 2.8mm x 3.5mm x 0.7mm, making it suitable for compact lighting designs. It utilizes a PLCC-2 package configuration, which is compatible with standard surface-mount technology (SMT) assembly processes. Key features include an extremely wide viewing angle, moisture sensitivity level 3 (per IPC/JEDEC standards), RoHS compliance, and availability in tape-and-reel packaging for automated manufacturing.
- General Description
- The device emits white light through blue chip excitation of phosphor. It is designed for indoor illumination applications where high brightness and color consistency are required.
- Features
- PLCC-2 package
- Wide viewing angle (up to 120 degrees)
- Suitable for all SMT assembly and solder processes
- Available on tape and reel (12000 pcs per reel)
- Moisture sensitivity level: Level 3
- RoHS compliant
- Applications
- Indoor lighting (general illumination)
- Bulb lighting
- General indoor applications such as downlights, spotlights, and linear fixtures
2. Technical Parameters Interpretation
2.1 Electro-Optical Characteristics
The electrical and optical parameters are specified at a solder temperature of 25°C with a forward current (IF) of 100mA. Forward voltage (VF) ranges from 8.6V to 9.8V depending on the bin code (Y0: 8.6-9.0V, Z0: 9.0-9.4V, A3: 9.4-9.8V). The typical forward voltage for most bins is around 9.0V. The luminous flux (Φ) varies from 95 lm to 140 lm based on the bin code; for example, rank UHA offers 95-100 lm, while rank FC5 provides 130-140 lm. The reverse current (IR) at VR=15V is less than 10 µA. The viewing angle (2θ1/2) is typically 120 degrees (minimum 80 degrees), ensuring wide light distribution. The color rendering index (CRI) is 80 minimum, typically 82, which is suitable for general indoor lighting where color quality is important. The thermal resistance (RTHJ-S) is maximum 15°C/W, indicating good heat transfer from junction to solder point.
2.2 Absolute Maximum Ratings
At a solder temperature of 25°C, the absolute maximum ratings are: Power dissipation (PD) up to 1078 mW; forward current (IF) up to 110 mA; peak forward current (IFP) up to 220 mA (1/10 duty cycle, 0.1ms pulse width); reverse voltage (VR) up to 15V; electrostatic discharge (HBM) up to 2000V; operating temperature range -40°C to +105°C; storage temperature range -40°C to +105°C; junction temperature (TJ) maximum 125°C. The power dissipation must not exceed the absolute maximum rating. The forward current should be determined based on actual thermal measurements to ensure that the junction temperature does not exceed 125°C. ESD protection is recommended during handling as over 90% of LEDs pass 2000V HBM testing.
3. Binning System
3.1 Forward Voltage Bins
Forward voltage is binned into three groups at IF=100mA: Y0 (8.6-9.0V), Z0 (9.0-9.4V), and A3 (9.4-9.8V). This allows customers to select LEDs with consistent voltage for series or parallel circuit designs.
3.2 Luminous Flux Bins
Luminous flux is grouped into several ranks: UHA (95-100 lm), FC2 (100-110 lm), FC3 (110-120 lm), FC4 (120-130 lm), and FC5 (130-140 lm). The specific flux bin associated with a given model depends on the color temperature. For example, 3000K models typically come in FC2 (100-110 lm), while 4000K models offer FC3 (110-120 lm) and FC4 (120-130 lm).
3.3 Chromaticity Bins
Color coordinates are binned according to the ANSI C78.377 standard using a 7-step MacAdam ellipse. The table provides X,Y coordinates for each bin code (27M, 30M, 35M, 40M, 50M, 57M, 65N, 65M) corresponding to nominal CCTs from 2700K to 6500K. For instance, bin 30M (3000K) has coordinates X1=0.4668, Y1=0.4281; X2=0.4420, Y2=0.4197; etc. This ensures tight color consistency across production lots.
4. Performance Curves Analysis
4.1 Forward Voltage vs. Forward Current
The typical curve shows forward voltage decreasing slightly with increasing current. At 100mA the voltage is approximately 9.0V; at 200mA it rises to about 9.6V. This non-linear behavior must be considered in driver design to maintain current regulation.
4.2 Relative Intensity vs. Forward Current
Relative light output increases with forward current. At 100mA the relative intensity is normalized to 100%; at 200mA it reaches approximately 180%. The relationship is nearly linear up to 150mA.
4.3 Temperature Characteristics
Both forward voltage and relative intensity are affected by solder temperature. As temperature rises from 25°C to 105°C, forward voltage decreases by about 0.8V (negative temperature coefficient). Relative light output also diminishes with increasing temperature: at 105°C it drops to approximately 80% of the value at 25°C. Proper thermal management is critical to maintain brightness.
4.4 Radiation Pattern
The angular radiation pattern shows a symmetrical distribution with half-intensity at ±60 degrees (120° viewing angle). The light output is maximum on the optical axis.
4.5 Spectrum Distribution
The white LED spectrum consists of a blue peak around 450 nm and a broad yellow-green emission from the phosphor, covering the visible range from 400 to 700 nm. The spectral shape varies with CCT: warmer CCTs have stronger red components, while cooler CCTs show higher blue content.
5. Mechanical and Packaging Information
5.1 Package Dimensions
The LED package is 2.80 mm long, 3.50 mm wide, and 0.70 mm thick (top view: 2.80 x 3.50 mm; side view height 0.70 mm). The bottom view shows two solder pads: anode (A) pad size 1.96 x 2.10 mm and cathode (C) pad size 1.10 x 2.10 mm. The recommended soldering pattern includes two rectangular pads of 2.10 x 0.50 mm separated by 0.48 mm gap. All dimensions have a tolerance of ±0.05 mm unless noted.
5.2 Polarity Identification
The anode is marked with a "+" symbol on the top of the package; the cathode is marked with a "-". The bottom view indicates the larger pad (2.10 x 1.96 mm) is the anode, and the smaller pad (1.10 x 2.10 mm) is the cathode.
5.3 Carrier Tape and Reel Dimensions
The carrier tape has a width of 12.0 mm, pitch of 4.00 mm, and cavity size suitable for the PLCC-2 package. The reel dimensions are: A = 12.2 ±0.3 mm, B = 290 ±2 mm, C = 79.6 ±0.2 mm, D = 14.2 ±0.2 mm. Each reel contains 12,000 pieces. Labels include part number, specification number, lot number, bin code, luminous flux, chromaticity bin, forward voltage, wavelength code, quantity, and date of manufacture.
6. Soldering and Assembly Guidelines
6.1 Reflow Soldering Profile
The recommended reflow profile uses a lead-free solder process. The average ramp-up rate from Tsmin (150°C) to Tp (260°C) should not exceed 3°C/s. Preheating occurs between 150°C and 200°C for 60-120 seconds. The temperature stays above 217°C for a maximum of 60 seconds (time above liquidus). The peak temperature is 260°C with a maximum dwell time of 10 seconds. The cooling rate should not exceed 6°C/s. Total time from 25°C to peak is less than 8 minutes. Reflow soldering should be performed no more than two times; if the interval between soldering exceeds 24 hours, LEDs may be damaged due to moisture absorption.
6.2 Hand Soldering and Repair
Hand soldering is allowed only once, with iron temperature below 300°C and duration less than 3 seconds. Repair after soldering is not recommended; if unavoidable, a double-head soldering iron should be used and the impact on LED characteristics must be verified beforehand.
6.3 Precautions
The encapsulation material is silicone, which is soft. Avoid mechanical pressure on the top surface during pick-and-place. Use appropriate nozzle pressure. Do not mount LEDs on warped PCBs; after soldering, do not warp the board. Avoid mechanical force or excess vibration during cooling. Rapid cooling after soldering is not allowed.
7. Packaging and Ordering Information
The LED is supplied in moisture barrier bags with desiccant, packed in reels (12,000 pcs per reel) and then in cardboard boxes. Storage conditions: before opening the aluminum bag, store at ≤30°C and ≤75% RH for up to one year from the date of delivery. After opening, the LEDs must be used within 24 hours under ≤30°C and ≤60% RH. If the desiccant has faded or storage time exceeds recommendations, baking at 60±5°C for at least 24 hours is required. The product numbering follows the pattern: RF-W[color temperature code]HP32DS-AF-I3, where "W" indicates white, "HP32DS" indicates high power PLCC-2 with specific design, "AF" indicates automatic flux binning, and "I3" may indicate a version or current rating. The model number together with the bin code specifies the exact chromaticity and flux grade.
8. Application Recommendations
Typical applications include indoor lighting such as bulb lamps, downlights, and general illumination fixtures. When designing the circuit, ensure the forward current through each LED does not exceed the maximum rating. Series resistors are recommended to stabilize current against voltage variations. The thermal design must be robust because elevated temperatures reduce luminous efficacy and shift color. Ensure adequate heat sinking to keep the junction temperature below 125°C. In environments with sulfur compounds, the sulfur concentration must be below 100 PPM to prevent LED damage. Bromine and chlorine in materials should be limited to less than 900 PPM each, with total less than 1500 PPM. Avoid using adhesives that outgas organic vapors near the LED. If cleaning is required after soldering, isopropyl alcohol is recommended; ultrasonic cleaning should be avoided as it may damage the package.
9. Technical Comparison
Compared to traditional PLCC-2 white LEDs, this device offers a wider viewing angle (120° vs typical 110°) and a higher maximum forward current (110 mA vs 100 mA), enabling higher lumen output. The forward voltage binning is tighter (0.4V increments) compared to some competitors offering 0.6V increments, which improves ease of parallel operation. The thermal resistance of 15°C/W is competitive for a PLCC-2 package; some similar products may have 20-25°C/W. The CRI of 80 minimum (82 typical) is suitable for general indoor use, while some specialty products achieve CRI 90+ but with lower efficacy.
10. Frequently Asked Questions
- Q: Can I drive this LED at a constant voltage?
- A: Constant voltage driving is not recommended because small voltage changes cause large current variations. Use a constant current driver or a current-limiting resistor.
- Q: What is the expected lifetime?
- A: Although not explicitly provided in the datasheet, typical PLCC-2 LEDs have a lumen maintenance of >70% after 50,000 hours under recommended conditions (IF=100mA, Tj≤125°C).
- Q: How do I interpret the bin code "27M"?
- A: "27M" indicates a CCT bin around 2700K with specific chromaticity coordinates within the 7-step MacAdam ellipse.
- Q: Can I use this LED outdoors?
- A: The datasheet specifies operating temperature from -40°C to +105°C, but the package is not rated for outdoor moisture or direct sunlight unless further protected. For outdoor use, consider conformal coating or IP-rated enclosures.
- Q: What is the maximum reverse voltage?
- A: The absolute maximum reverse voltage is 15V. Exceeding this may cause damage. The reverse current at 15V is less than 10 µA, indicating good reverse leakage performance.
11. Use Case Examples
11.1 Residential Downlight
A typical 7W retrofit downlight uses 7 LEDs: 7 × 1078 mW = 7.55 W total power (slightly higher due to driver losses). With 120 lm per LED (FC3 bin) at 100 mA, total lumen output is 840 lm, equivalent to a 60W incandescent bulb. The wide viewing angle (120°) allows a wide beam spread for uniform room illumination.
11.2 Linear Strip Light
For a 1 meter strip containing 60 LEDs (5 reels of 12 pcs each), driven at 100 mA total current (60 × 110 mA = 6.6 A is impractical; usually parallel strings with separate resistors). A more feasible design is 3 parallel strings of 20 LEDs each, each string with a current-limiting resistor and a total current of 330 mA (3 × 110 mA). The light output would exceed 6600 lm (3 strings × 20 LEDs × 110 lm = 6600 lm). Proper heat sinking is critical.
12. Principle of Operation
The white LED operates on the principle of phosphor-conversion: a gallium-nitride (GaN) based blue LED chip emits blue light at approximately 450 nm. This blue light is partially absorbed by a yellow-emitting phosphor (typically YAG:Ce) that re-emits in a broad yellow-green band. The combination of the residual blue light and the yellow phosphor emission produces white light. By adjusting the phosphor composition and concentration, different correlated color temperatures (CCT) from warm white (2700K) to cool white (6500K) are achieved. The CRI is determined by the spectral width of the phosphor; higher CRI devices often use multiple phosphors (e.g., red phosphor added) to fill the spectral gaps.
13. Development Trends
The market trend for PLCC-2 white LEDs includes further miniaturization (e.g., 1.6×1.6mm packages) while maintaining similar optical performance. Efficacy improvements are driven by better chip efficiency and phosphor quantum yield (target >210 lm/W at 100 mA for mid-power LEDs). Higher CRI versions (CRI 90-95) are becoming common for premium indoor lighting. Additionally, the integration of smart control (e.g., tunable white) is increasing, requiring compatible LED binning and narrow color consistency. The automotive sector is also adopting similar packages for interior lighting. Reliability demands continue to push for lower thermal resistance and better sulfur/moisture resistance through advanced packaging techniques.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |