Table of Contents
- 1. Product Overview
- 1.1 General Description
- 1.2 Features
- 1.3 Applications
- 2. Package Dimensions
- 3. Electrical and Optical Characteristics
- 3.1 Forward Voltage
- 3.2 Reverse Current
- 3.3 Luminous Flux
- 3.4 Viewing Angle
- 3.5 Thermal Resistance
- 3.6 Absolute Maximum Ratings
- 4. Bin Range and Color Coordinates
- 4.1 Forward Voltage Binning
- 4.2 Luminous Flux Binning
- 4.3 Chromaticity Binning
- 5. Typical Performance Curves
- 5.1 Forward Voltage vs Forward Current
- 5.2 Forward Current vs Relative Intensity
- 5.3 Solder Temperature vs Relative Intensity
- 5.4 Solder Temperature vs Forward Current (Derating)
- 5.5 Forward Voltage vs Solder Temperature
- 5.6 Radiation Diagram
- 5.7 Chromaticity vs Temperature
- 5.8 Spectrum Distribution
- 6. Packaging and Handling
- 6.1 Packaging Specification
- 6.2 Moisture Resistant Packing
- 6.3 Reliability Test
- 7. SMT Reflow Soldering
- 8. Precautions and Storage
- 8.1 Operating Environment
- 8.2 Handling
- 8.3 Cleaning
- 8.4 Storage Conditions
- LED Specification Terminology
- Photoelectric Performance
- Electrical Parameters
- Thermal Management & Reliability
- Packaging & Materials
- Quality Control & Binning
- Testing & Certification
1. Product Overview
1.1 General Description
This LED is a white light emitting diode fabricated using a blue chip combined with phosphor to produce white light. The package is a 3.5mm x 3.5mm x 1.9mm PLCC6 (Plastic Leaded Chip Carrier) package, which is designed for surface mount technology. The LED offers a wide viewing angle of 120 degrees and is suitable for various automotive lighting applications. The device complies with RoHS and REACH regulations and is qualified according to AEC-Q101 stress test qualification for automotive grade discrete semiconductors.
1.2 Features
- PLCC6 package (3.5mm x 3.5mm x 1.9mm)
- Extremely wide viewing angle (120°)
- Suitable for all SMT assembly and solder processes
- Available on tape and reel (4000pcs/reel)
- Moisture sensitivity level: Level 2
- Compliance with RoHS and REACH
- AEC-Q101 qualified
1.3 Applications
The LED is primarily designed for automotive lighting, both interior and exterior applications, such as interior ambient lighting, reading lights, signal lights, and other automotive lighting functions.
2. Package Dimensions
The package dimensions are shown in the datasheet drawing. The overall package size is 3.50mm x 3.50mm with a height of 1.90mm. All dimensions are in millimeters with tolerances of ±0.05mm unless otherwise noted. The LED has a polarity mark on the top surface. The package includes a 0.70mm lead width and 0.50mm lead pitch in one direction, with another lead pitch of 0.80mm. The exact dimensions are critical for PCB layout design and proper soldering.
3. Electrical and Optical Characteristics
3.1 Forward Voltage
At a test current of 150mA (Ts=25°C), the forward voltage (VF) has a minimum of 2.8V, typical of 3.1V, and maximum of 3.4V. The measurement tolerance is ±0.1V. This parameter is important for calculating power dissipation and designing driving circuits.
3.2 Reverse Current
At reverse voltage of 5V, the reverse current (IR) is typically very low, with a maximum of 10µA. This indicates good junction quality and low leakage.
3.3 Luminous Flux
At 150mA, the luminous flux (Φ) ranges from 55.3 lumens minimum, 62 lumens typical, to 75.3 lumens maximum. The measurement tolerance is ±10%. This high flux makes the LED suitable for bright automotive lighting.
3.4 Viewing Angle
The viewing angle (2θ1/2) is 120 degrees, which is extremely wide, providing uniform light distribution.
3.5 Thermal Resistance
The thermal resistance from junction to solder point (RTHJ-S) is 50°C/W maximum. This low thermal resistance helps in efficient heat dissipation.
3.6 Absolute Maximum Ratings
The absolute maximum ratings include: Power Dissipation (PD) 612mW, Forward Current (IF) 180mA, Peak Forward Current (IFP) 300mA (1/10 duty cycle, 10ms pulse width), Reverse Voltage (VR) 5V, Electrostatic Discharge (HBM) 8000V, Operating Temperature (TOPR) -40 to +110°C, Storage Temperature (TSTG) -40 to +110°C, Junction Temperature (TJ) 125°C. Care must be taken not to exceed these limits to avoid damage.
4. Bin Range and Color Coordinates
4.1 Forward Voltage Binning
The forward voltage is binned at 150mA into groups: G1 (2.8-2.9V), G2 (2.9-3.0V), H1 (3.0-3.1V), H2 (3.1-3.2V), I1 (3.2-3.3V), I2 (3.3-3.4V). This binning allows customers to select LEDs with tighter voltage ranges for uniform current distribution in arrays.
4.2 Luminous Flux Binning
Luminous flux is binned at 150mA: PA (55.3-61.2 lm), PB (61.2-67.8 lm), QA (67.8-75.3 lm). Higher flux bins provide brighter output.
4.3 Chromaticity Binning
The C.I.E chromaticity diagram is shown with bins ZG0, ZG1, ZG2. The color coordinates fall in the white region with specific x,y ranges. For example, ZG0 covers coordinates (0.3059,0.3112) to (0.3177,0.3112) etc. This ensures color consistency.
5. Typical Performance Curves
5.1 Forward Voltage vs Forward Current
The curve shows a typical forward voltage of about 2.8-3.2V across 30-180mA current range.
5.2 Forward Current vs Relative Intensity
Relative light output increases with current, reaching about 140% at 200mA compared to lower currents.
5.3 Solder Temperature vs Relative Intensity
As temperature increases, relative intensity decreases approximately 20% from 20°C to 120°C.
5.4 Solder Temperature vs Forward Current (Derating)
The maximum allowed forward current decreases with temperature, from 180mA at 25°C to about 100mA at 125°C to avoid thermal damage.
5.5 Forward Voltage vs Solder Temperature
Forward voltage decreases linearly with temperature (approximately -2mV/°C).
5.6 Radiation Diagram
Relative luminous intensity as a function of angle shows a wide angular distribution, typical for a Lambertian emitter.
5.7 Chromaticity vs Temperature
The color coordinates shift slightly with temperature, with x and y values decreasing as temperature increases.
5.8 Spectrum Distribution
The LED emits a broad spectrum from about 400nm to 750nm, with peak intensity around 450nm (blue) and a broader yellow peak from the phosphor, resulting in cool white light.
6. Packaging and Handling
6.1 Packaging Specification
LEDs are packaged in carrier tape with 4000pcs per reel. The carrier tape dimensions are specified: A0=3.70±0.10mm, B0=3.70±0.10mm, K0=2.15±0.10mm, T=0.25±0.05mm, W=12.0±0.20mm, etc. Reel dimensions: 330mm diameter, 100mm core diameter, 13mm hub hole.
6.2 Moisture Resistant Packing
The LED is moisture-sensitive (MSL Level 2). It is packed in moisture barrier bag with desiccant and humidity indicator. Storage conditions: before opening aluminum bag, store at <30°C/75%RH for up to 1 year. After opening, use within 24 hours at <30°C/60%RH. If exceeded, baking at 60±5°C for 24 hours is required.
6.3 Reliability Test
Tests include: Reflow (260°C max, 2x), Preconditioning (MSL2), Thermal Shock (-40°C to 125°C, 1000 cycles), Life Test (105°C, 150mA, 1000hrs), High Humidity Life Test (85°C/85%RH, 150mA, 1000hrs). Criteria: VF change ≤1.1x USL, IR ≤2.0x USL, flux ≥0.7x LSL.
7. SMT Reflow Soldering
The recommended reflow soldering profile is provided. Key parameters: ramp-up rate ≤3°C/s, preheat from 150°C to 200°C for 60-120s, time above 217°C (TL) within 60-120s, peak temperature 260°C (TP) with dwell time ≤10s, cooling rate ≤6°C/s. Maximum 2 reflow cycles. Hand soldering: iron temperature <300°C for <3s, one time only. Repairs should be minimized.
8. Precautions and Storage
8.1 Operating Environment
Avoid sulfur-containing compounds >100PPM in mating materials. Bromine and chlorine each <900PPM, total <1500PPM. Volatile organic compounds (VOCs) can discolor the silicone encapsulant; avoid outgassing adhesives.
8.2 Handling
Handle components along side surfaces using tweezers; do not touch the silicone lens directly. Electrostatic discharge protection is necessary (ESD 8000V HBM). Design circuits with current-limiting resistors to prevent overcurrent. Thermal design is critical to maintain performance and prevent color shift or flux degradation.
8.3 Cleaning
Use isopropyl alcohol for cleaning if needed. Ultrasonic cleaning is not recommended as it may damage the LED.
8.4 Storage Conditions
Store in original sealed bag at <30°C/75%RH for up to 1 year. After unsealing, use within 24 hours or bake at 60±5°C for 24h.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |