White LED 3.00x1.40x0.52mm 2.8-3.4V 680mW Automotive Grade | RF-A1F30-W1FN-B1

1. Product Overview

1.1 General Description

The RF-A1F30-W1FN-B1 is a white light emitting diode (LED) fabricated by combining a blue chip with phosphor conversion. It is packaged in an EMC (Epoxy Molding Compound) package with dimensions of 3.00mm x 1.40mm x 0.52mm. This compact footprint makes it suitable for space-constrained automotive interior and exterior lighting applications. The LED delivers a typical luminous flux of 26.8 to 39.8 lumens at a forward current of 80mA, with a forward voltage ranging from 2.8V to 3.4V. Its wide 120° viewing angle ensures uniform light distribution. The device is AEC-Q101 qualified, meeting rigorous automotive reliability standards.

1.2 Features

• EMC package for high temperature stability and robustness.
• Extremely wide viewing angle of 120°.
• Suitable for all SMT assembly and reflow soldering processes.
• Available in tape and reel packaging (5,000pcs/reel).
• Moisture sensitivity level: Level 2 (MSL 2).
• Complies with RoHS and REACH requirements.
• Qualified according to AEC-Q101 stress test for automotive grade discrete semiconductors.

1.3 Applications

This LED is designed for automotive lighting applications including interior ambient lighting, dashboard indicators, and exterior signal lamps. Its high reliability and wide operating temperature range (-40°C to +110°C) make it ideal for demanding automotive environments.

2. Technical Parameters

2.1 Electrical and Optical Characteristics (Ts=25°C)

The following table summarizes the key electrical and optical parameters measured at a forward current of 80mA (unless otherwise noted).

Note: Measurement tolerances are ±0.1V for forward voltage, ±10% for luminous flux, and ±0.005 for color coordinates.

2.2 Absolute Maximum Ratings (Ts=25°C)

The absolute maximum ratings must not be exceeded to prevent permanent damage to the LED.

3. Binning System

3.1 Forward Voltage and Luminous Flux Bins

To ensure consistent performance, the LED is sorted into bins based on forward voltage (VF) and luminous flux (Φ) at IF=80mA. VF bins are designated V2 (2.8-2.9V) through V7 (3.3-3.4V). Luminous flux bins range from 8P (26.8-28.7lm) to 9Q (37.3-39.8lm). This binning system allows customers to select devices with tightly controlled electrical and optical characteristics.

3.2 Chromaticity Bins

The color coordinates are divided into 18 chromaticity bins (A1 through A9 and B1 through B9) within the CIE 1931 color space. Each bin is defined by four corner CIE x,y coordinates. For example, bin A1 covers x from 0.3013 to 0.3063 and y from 0.2943 to 0.3135. This fine binning ensures uniform white color appearance for lighting systems.

4. Performance Curves Analysis

4.1 Forward Voltage vs Forward Current

The I-V curve (Fig. 1-7) shows the typical exponential relationship between forward voltage and forward current. At 25°C, a forward voltage of approximately 2.9V yields 80mA. As voltage increases to 3.4V, current exceeds 200mA. This curve is essential for designing constant-current drivers to avoid overcurrent.

4.2 Forward Current vs Relative Luminous Flux

Relative luminous flux increases nearly linearly with forward current up to 160mA (Fig. 1-8). At 80mA, the relative intensity is approximately 50% of the maximum at 200mA. This behavior helps predict brightness at various drive currents.

4.3 Temperature Effects

Figs. 1-9 to 1-11 illustrate the impact of solder temperature on performance. As temperature rises, relative luminous flux declines (Fig. 1-9). The maximum allowable forward current must be derated at higher temperatures (Fig. 1-10). Forward voltage also decreases with increasing temperature at a rate of approximately -2mV/°C (Fig. 1-11). Proper thermal management is critical to maintain light output and reliability.

4.4 Radiation Pattern

The radiation diagram (Fig. 1-12) shows a Lambertian-like distribution with a half-intensity angle of 60° (120° full width half maximum). The relative intensity drops symmetrically from 100% at 0° to about 50% at ±60°.

4.5 Spectrum Distribution

The spectrum (Fig. 1-14) spans from 380nm to 780nm with a peak around 450nm (blue chip) and a broad phosphor band from 500nm to 700nm. This combination yields a warm to neutral white correlated color temperature depending on the bin.

4.6 Color Shift vs Current and Temperature

Fig. 1-13 demonstrates that the chromaticity coordinates shift slightly with increasing temperature. The shift is more pronounced in the y direction. This information is vital for color-critical lighting applications.

5. Mechanical and Packaging Information

5.1 Package Dimensions

The package measures 3.00mm (length) × 1.40mm (width) × 0.52mm (height) with tolerances of ±0.2mm. The top view shows a rectangular light-emitting area of 2.61mm × 1.40mm. Two cathode and anode pads are located on the bottom for surface mount soldering.

5.2 Soldering Patterns

Recommended solder pad layout dimensions: 3.50mm (length) × 0.91mm (width) for each pad, with a pitch of 2.10mm. Proper pad design ensures good solder joint reliability and heat dissipation.

5.3 Polarity

The LED polarity is marked with a (+) and (-) sign on the package bottom. The cathode side is indicated by a flat edge on the package outline. Incorrect polarity may damage the LED.

6. SMT Reflow Soldering Guidelines

6.1 Reflow Profile

The recommended reflow soldering profile is based on JEDEC standards. Key parameters: preheating from 150°C to 200°C for 60-120 seconds, ramp-up rate ≤3°C/s, time above 217°C (TL) maximum 60 seconds, peak temperature 260°C with a dwell time of 10 seconds, and cooling rate ≤6°C/s. The total time from 25°C to peak should not exceed 8 minutes. Do not perform more than two reflow passes.

6.2 Precautions

Do not apply mechanical stress to the LED during heating or cooling. Avoid rapid cooling. The LED encapsulant is silicone, which is soft; avoid direct pressure on the lens. Use a proper pick-and-place nozzle with appropriate force. Components must not be mounted on warped PCBs.

7. Packaging and Ordering Information

7.1 Tape and Reel

The LED is supplied in tape and reel packaging with 5,000 pieces per reel. Carrier tape dimensions: width 8.0±0.1mm, pitch 4.0mm. Reel dimensions: diameter 178±1mm, hub diameter 60±1mm, and width 13.0±0.5mm. The tape includes a leader and trailer of 80-100 empty pockets.

7.2 Label Information

Each reel is labeled with Part Number, Spec Number, Lot Number, Bin Code (for flux, chromaticity, voltage), Quantity, and Date. The label also includes a barcode for inventory tracking.

7.3 Moisture Sensitivity

The MSL level is 2. The moisture barrier bag must be stored at ≤30°C and ≤75% RH before opening. After opening, the LEDs must be used within 24 hours or subjected to baking at 60±5°C for at least 24 hours.

8. Reliability Testing

The LED has passed standard reliability tests per AEC-Q101 guidelines. Test items include: Reflow soldering (260°C, 10s, 2 times), Moisture Sensitivity (MSL2, 85°C/60%RH, 168h), Thermal Shock (-40°C to 125°C, 1000 cycles), Life Test (105°C, IF=80mA, 1000h), and High Temperature High Humidity (85°C/85%RH, IF=80mA, 1000h). All tests require 0 failures in 20 samples. Failure criteria: forward voltage shift >10% above USL, reverse current >2x USL, or luminous flux drop >30% below LSL.

9. Storage and Handling Precautions

9.1 Storage Conditions

Unopened bags: store at ≤30°C and ≤75% RH for up to 1 year. After opening, use within 24 hours at ≤30°C and ≤60% RH. If exceeded, bake at 60±5°C for >24 hours.

9.2 ESD and EOS Protection

The LED is sensitive to electrostatic discharge (ESD). 90% of devices pass 8000V HBM. Use proper ESD protection measures: grounded workstations, ionizers, and antistatic packaging. Electrical overstress (EOS) must also be avoided by using current-limiting resistors and proper circuit design.

9.3 Chemical Compatibility

Avoid exposure to sulfur compounds >100PPM, bromine >900PPM, chlorine >900PPM, and total Br+Cl >1500PPM. Do not use adhesives that outgas volatile organic compounds (VOCs). For cleaning, isopropyl alcohol is recommended. Ultrasonic cleaning is not recommended as it may damage the LED.

10. Application Design Considerations

10.1 Thermal Design

Thermal management is critical for maintaining light output and lifetime. The thermal resistance from junction to solder point is 50°C/W. Adequate PCB copper area and thermal vias are recommended. The junction temperature must not exceed 125°C.

10.2 Current Derating

At ambient temperatures above 25°C, the maximum forward current must be derated. Refer to the derating curve (Fig. 1-10) which shows that at 100°C, the maximum current reduces to approximately 80mA. Always operate within the safe operating area.

10.3 Circuit Protection

Use a constant current driver or series resistor to limit current. A resistor of appropriate value (e.g., to set 80mA from a 5V supply) ensures stable operation. Reverse voltage protection (e.g., a diode) may be needed to prevent damage.

11. Technical Principle

This white LED uses a blue InGaN chip covered with a yellow-emitting phosphor (typically YAG:Ce). The blue light from the chip (peak ~450nm) partially excites the phosphor, which emits yellow light. The combination of blue and yellow light produces white light. The specific CIE chromaticity coordinates depend on the phosphor composition and concentration, enabling various color temperatures.

12. Frequently Asked Questions

1. Q: Can the LED be used with pulsed drive? A: Yes, the peak current rating is 350mA at 1/10 duty cycle and 10ms pulse width. Ensure the average power does not exceed 680mW.
2. Q: How to clean the LED after soldering? A: Use isopropyl alcohol. Do not use ultrasonic cleaning. If other solvents are used, verify compatibility with the silicone encapsulant.
3. Q: What happens if the storage time after bag opening exceeds 24 hours? A: The LED may absorb moisture, necessitating baking at 60±5°C for >24 hours before use.
4. Q: Can the LED be used in outdoor automotive exterior lighting? A: Yes, the device is AEC-Q101 qualified and operates from -40°C to +110°C, suitable for exterior applications. However, proper sealing against moisture and contaminants is required.
5. Q: Is the LED compatible with lead-free soldering? A: Yes, the recommended reflow profile is Pb-free with peak temperature 260°C.