White LED RF-A1F30-W57J-A8 Specification - Size 3.0x1.4x0.52mm - Forward Voltage 2.8-3.4V - Power 680mW - Automotive Grade

1. Product Overview

The White LED model RF-A1F30-W57J-A8 is a surface-mount device fabricated using a blue chip and phosphor conversion technology. It delivers high brightness and reliability suitable for demanding automotive lighting applications. The package dimensions are 3.00 mm x 1.40 mm x 0.52 mm, making it ideal for compact designs.

1.1 General Description

This white LED is produced by exciting yellow phosphor with a blue LED chip, resulting in a broad white spectrum. The product package is EMC (Epoxy Molding Compound) which provides excellent thermal performance and reliability. It is designed for automotive interior and exterior lighting.

1.2 Features

• EMC package for robust mechanical and thermal performance
• Extremely wide viewing angle of 120° (typical)
• Suitable for all SMT assembly and soldering processes
• Available on tape and reel for automated pick-and-place
• Moisture sensitivity level: Level 2 (per J-STD-020)
• RoHS compliant and lead-free
• Qualification based on AEC-Q102 stress test for automotive grade discrete semiconductors

1.3 Applications

Automotive lighting – both interior (dashboard, ambient) and exterior (side markers, brake lights, turn signals).

2. Technical Parameters

2.1 Electrical and Optical Characteristics (at Ts=25°C)

2.2 Absolute Maximum Ratings (at Ts=25°C)

Note: Forward voltage measurement tolerance is ±0.1V. Color coordinate measurement tolerance ±0.005. Luminous flux measurement tolerance ±10%. All measurements made under standardized environment. At 25°C pulse mode, photoelectric conversion efficiency is 41%.

3. Binning System

3.1 Forward Voltage and Luminous Flux Bins (IF=140mA)

The LEDs are sorted into bins for forward voltage (VF) and luminous flux (Φ). VF bins: G1 (2.8-2.9V), G2 (2.9-3.0V), H1 (3.0-3.1V), H2 (3.1-3.2V), I1 (3.2-3.3V). Flux bins: OB (50-55.3lm), PA (55.3-61.2lm), PB (61.2-67.8lm). This allows customers to select tight tolerance groups for consistent performance.

3.2 Chromaticity Bins

The CIE chromaticity diagram provides two bins: ZG0 and ZG1. The coordinates for ZG0: X1=0.3059 Y1=0.3112, X2=0.3122 Y2=0.3258, X3=0.3240 Y3=0.3258, X4=0.3177 Y4=0.3112. For ZG1: X1=0.3122 Y1=0.3258, X2=0.3185 Y2=0.3404, X3=0.3303 Y3=0.3404, X4=0.3240 Y4=0.3258. These bins ensure color uniformity.

4. Performance Curves

4.1 Forward Voltage vs. Forward Current

As forward current increases from 20mA to 200mA, forward voltage rises from approximately 2.7V to 3.4V. The curve is typical for InGaN LEDs, with a slope indicating series resistance.

4.2 Forward Current vs. Relative Luminous Flux

Relative luminous flux is nearly linear with forward current up to 200mA. At 140mA the flux is normalized to 100%; at 200mA it reaches about 150%.

4.3 Junction Temperature vs. Relative Luminous Flux

Increasing junction temperature reduces light output. At Tj=120°C, the relative flux drops to approximately 70% of the value at 25°C. Thermal management is critical.

4.4 Solder Temperature vs. Forward Current

The maximum allowable forward current decreases at higher ambient/solder temperatures. At Ts=100°C, the allowed current is about 80mA compared to 200mA at 25°C.

4.5 Voltage Shift vs. Junction Temperature

Forward voltage decreases by about 0.2V as temperature rises from -40°C to 140°C, with a coefficient of approximately -1.5 mV/°C.

4.6 Radiation Pattern

The radiation diagram shows a typical Lambertian distribution with a wide viewing angle of 120° at half intensity. Relative intensity is above 90% at ±40°.

4.7 Color Coordinate Shift vs. Junction Temperature and Forward Current

ΔCx and ΔCy shift negatively with increasing temperature (ΔCx ~ -0.01, ΔCy ~ -0.015 at 140°C). With increasing current, ΔCx and ΔCy also shift slightly negative. These shifts are within acceptable limits for automotive lighting.

4.8 Spectrum Distribution

The white LED emits a broad spectrum from 420nm to 700nm, peaking around 450nm (blue) and 560nm (phosphor). Correlated color temperature is approximately 5700K for the specified bin.

5. Mechanical and Packaging Information

5.1 Package Dimensions

Package: 3.00 mm (L) x 1.40 mm (W) x 0.52 mm (H). The back view shows two solder pads: anode (positive) and cathode (negative) with pad dimensions 0.50 mm x 0.86 mm (cathode) and 0.50 mm x 0.91 mm (anode). Recommended PCB land pattern: 2.10 mm x 0.40 mm for each pad with 1.00 mm spacing. Polarity is marked.

5.2 Carrier Tape and Reel

Packaging: 2000 pcs per reel. Carrier tape with 8.0 mm width, pocket pitch 4.0 mm. Reel dimensions: diameter 178 mm, hub 60 mm, flange width 13 mm. Tape includes leader and trailer sections of 80-100 empty pockets.

5.3 Label and Moisture Barrier Bag

Labels include part number, spec number, lot number, bin code, luminous flux, chromaticity bin, forward voltage, wavelength code, quantity, and date. The reel is sealed in a moisture barrier bag with desiccant and humidity indicator card. MSL Level 2 requires baking if exposure exceeds 24 hours at ≤30°C/60%RH.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

The recommended reflow profile (JEDEC) consists of: preheat from 150°C to 200°C for 60-120s; ramp-up ≤3°C/s; time above 217°C up to 60s; peak temperature 260°C for max 10s; cool-down ≤6°C/s. Total time from 25°C to peak ≤8 minutes. Maximum two reflow cycles allowed with >24h interval requiring baking.

6.2 Repair and Handling

Repair should be avoided. If necessary, use a dual-head soldering iron. Do not apply pressure on the silicone lens during heating. After soldering, do not warp or vibrate the board while cooling.

7. Storage and Handling Precautions

Sulfur and halogen compounds in the environment should be controlled: sulfur ≤100PPM, single bromine ≤900PPM, single chlorine ≤900PPM, total Br+Cl ≤1500PPM. VOCs can penetrate silicone and cause discoloration; use compatible adhesives. ESD protection required (HBM 8kV). For cleaning, isopropyl alcohol is recommended; avoid ultrasonic cleaning. Baking condition if moisture exposure exceeds limit: 60±5°C for ≥24h.

8. Reliability Testing

The following tests are conducted per AEC-Q102 guidelines: Reflow soldering (260°C, 10s, 2x), MSL2 preconditioning (85°C/60%RH, 168h), Thermal shock (-40°C ~125°C, 1000 cycles), Life test (Ta=105°C, IF=140mA, 1000h), High temperature high humidity (85°C/85%RH, IF=140mA, 1000h). Acceptance criteria: 0/1 failure per 20 samples. After test, forward voltage must not exceed 1.1x upper spec limit, reverse current ≤2x upper spec, and luminous flux ≥0.7x lower spec limit.

9. Application Design Considerations

Thermal design is paramount. The junction temperature must stay below 135°C. Use proper heat sinking and avoid exceeding absolute maximum ratings. Current should be limited with series resistors to prevent thermal runaway. Avoid reverse voltage. For automotive lighting, consider derating based on ambient temperature and board thermal resistance.

10. Comparison with Alternative Technologies

Compared to traditional PPA (polyphthalamide) package LEDs, the EMC package offers higher heat resistance, better UV stability, and lower thermal resistance. The wide viewing angle (120°) provides uniform illumination, beneficial for interior ambient light. AEC-Q102 qualification ensures reliability for harsh automotive environments.

11. Frequently Asked Questions

Q: Can I use this LED for exterior tail lights? A: Yes, the AEC-Q102 qualification covers exterior applications, but proper thermal management is necessary. Q: What is the typical lifetime? A: Based on LM-80 data (not included in this spec), L70 at 140mA and 85°C is typically >50,000 hours. Q: Is the LED compatible with lead-free soldering? A: Yes, the peak reflow temperature is 260°C, suitable for lead-free processes.

12. Application Examples

Automotive interior: dashboard backlighting, ambient light strips. Exterior: side marker lights, CHMSL (center high mount stop lamp), turn signal indicators. The compact size and wide beam make it suitable for linear lighting modules.

13. Operation Principle

The LED uses a blue InGaN chip coated with YAG:Ce phosphor. Blue light (450-465nm) from the chip excites the phosphor, which emits yellow light. The combination of blue and yellow produces white light (correlated color temperature ~5700K). The phosphor is embedded in silicone, which is encapsulated in the EMC package.

14. Development Trends

Automotive LED technology continues to evolve towards higher efficacy, smaller packages, and better thermal performance. EMC packages are replacing standard SMD for high-reliability applications. Integration with advanced driver ICs and adaptive lighting systems is becoming common. This LED aligns with the trend of using qualified components for functional safety (ISO 26262) and long-life requirements.