Table of Contents
- 1. Description
- 1.1 General Description
- 1.2 Features
- 1.3 Applications
- 2. Package Dimensions
- 3. Electrical / Optical Characteristics at Ts=25°C
- Absolute Maximum Ratings (Ts=25°C)
- 4. Bin Range for Forward Voltage and Luminous Intensity (IF=20mA)
- 5. Typical Optical Characteristics Curves
- 6. Packaging
- 7. Reliability Test Items and Conditions
- 8. SMT Reflow Soldering Instructions
- 9. Handling Precautions
- 10. Storage Conditions
- LED Specification Terminology
- Photoelectric Performance
- Electrical Parameters
- Thermal Management & Reliability
- Packaging & Materials
- Quality Control & Binning
- Testing & Certification
1. Description
1.1 General Description
The white LED is fabricated using a blue chip and phosphor to achieve white light emission. The package is a standard PLCC2 (3.50mm x 2.80mm x 1.84mm) surface mount device. This LED is designed for high reliability and excellent optical performance in demanding applications.
1.2 Features
- PLCC2 package
- Extremely wide viewing angle (120°)
- Suitable for all SMT assembly and solder processes
- Available on tape and reel (2000pcs/reel)
- Moisture sensitivity level: Level 2
- Compliance with RoHS and REACH
- Qualification: Product qualification test plan based on AEC-Q101 guidelines for automotive grade discrete semiconductors
1.3 Applications
- Automotive interior lighting
- Switches
2. Package Dimensions
The package dimensions are 3.50mm (length) x 2.80mm (width) x 1.84mm (height). The LED features a clear silicone lens. The recommended soldering pattern is provided to ensure proper thermal and mechanical connection. Polarity is marked on the package. All dimensions are in millimeters with tolerances of ±0.2mm unless otherwise noted.
3. Electrical / Optical Characteristics at Ts=25°C
| Parameter | Symbol | Test Condition | Min. | Typ. | Max. | Unit |
|---|---|---|---|---|---|---|
| Forward Voltage | VF | IF=20mA | 2.5 | 2.8 | 3.1 | V |
| Reverse Current | IR | VR=5V | - | - | 10 | µA |
| Luminous Intensity | IV | IF=20mA | 1800 | 2450 | 3500 | mcd |
| Viewing Angle | 2θ1/2 | IF=20mA | - | 120 | - | deg |
| Thermal Resistance | RTHJ-S | IF=20mA | - | - | 300 | °C/W |
Absolute Maximum Ratings (Ts=25°C)
| Parameter | Symbol | Rating | Unit |
|---|---|---|---|
| Power Dissipation | PD | 93 | mW |
| Forward Current | IF | 30 | mA |
| Peak Forward Current (1/10 Duty, 10ms) | IFP | 50 | mA |
| Reverse Voltage | VR | 5 | V |
| ESD (HBM) | ESD | 8000 | V |
| Operating Temperature | TOPR | -40 to +100 | °C |
| Storage Temperature | TSTG | -40 to +100 | °C |
| Junction Temperature | TJ | 120 | °C |
Notes: Forward voltage measurement allowance tolerance ±0.1V. Color coordinates measurement allowance tolerance ±0.005. Luminous intensity measurement allowance tolerance ±10%.
4. Bin Range for Forward Voltage and Luminous Intensity (IF=20mA)
The LED is binned by forward voltage (VF) and luminous intensity (IV) for consistency. VF bins range from 2.5-2.6V (E2) to 3.0-3.1V (H1). IV bins are N1 (1800-2300 mcd), N2 (2300-2800 mcd), and O1 (2800-3500 mcd). Chromaticity bins (R00, R01, R02) are defined in the CIE 1931 diagram.
5. Typical Optical Characteristics Curves
The following characteristic curves are provided for design reference:
- Forward Voltage vs. Forward Current: Shows the typical I-V relationship.
- Forward Current vs. Relative Intensity: Demonstrates the linear increase of intensity with current.
- Solder Temperature vs. Relative Intensity: Indicates the decrease of intensity at higher solder point temperatures.
- Solder Temperature vs. Forward Current: Derating curve for maximum allowed current vs. solder point temperature.
- Forward Voltage vs. Solder Temperature: Shows the negative temperature coefficient of forward voltage.
- Radiation Diagram: Illustrates the wide 120° viewing angle.
- Chromaticity Coordinate Shift vs. Solder Temperature: Shows the slight shift of color coordinates with temperature.
- Spectral Distribution: The typical spectrum of the white LED.
6. Packaging
The LEDs are packaged in tape and reel with 2000 pieces per reel. The carrier tape dimensions are specified for automatic placement. The reel dimensions are 178mm (diameter) with a 13mm hub hole. A moisture barrier bag with desiccant and humidity indicator card is used for moisture-sensitive protection. The label includes part number, bin code, quantity, and date code.
7. Reliability Test Items and Conditions
The product is qualified through rigorous reliability testing based on AEC-Q101. Tests include:
- Reflow Soldering (260°C, 10 seconds)
- Moisture Sensitivity Level 2 (85°C/60%RH, 168 hours)
- Thermal Shock (-40°C to 125°C, 1000 cycles)
- Life Test (100°C, IF=20mA, 1000 hours)
- High Temperature High Humidity Life Test (85°C/85%RH, IF=20mA, 1000 hours)
Acceptance criteria: For forward voltage, the limit is U.S.L. × 1.1; for reverse current, U.S.L. × 2.0; for luminous flux, L.S.L. × 0.7.
8. SMT Reflow Soldering Instructions
Recommended reflow profile parameters: Preheat from 150°C to 200°C for 60-120 seconds. Ramp-up rate ≤3°C/s. Time above 217°C: max 60 seconds. Peak temperature: 260°C for max 10 seconds. Cooling rate ≤6°C/s. Total time from 25°C to peak: max 8 minutes. Do not exceed two reflow cycles; if more than 24 hours between soldering, the LEDs may absorb moisture and be damaged. For hand soldering, use iron at <300°C for less than 3 seconds, one time only. Repairing should be avoided but if necessary, use a double-head soldering iron. The silicone encapsulant is soft; avoid excessive pressure during pick-and-place.
9. Handling Precautions
- Avoid exposure to sulfur compounds above 100PPM in mating materials.
- Limit bromine and chlorine content in external materials: each <900PPM, total <1500PPM.
- Prevent volatile organic compounds (VOCs) from discoloring the silicone.
- Handle components by the sides using appropriate tools; do not touch the lens surface.
- Design the driving circuit to ensure current does not exceed absolute maximum ratings and use a series resistor for protection. Avoid reverse voltage.
- Thermal design is critical; consider heat generation to prevent degradation of brightness and color.
- Silicone encapsulant attracts dust; cleaning with isopropyl alcohol is recommended. Ultrasonic cleaning is not recommended.
10. Storage Conditions
| Condition | Temperature | Humidity | Time |
|---|---|---|---|
| Before opening aluminum bag | ≤30°C | ≤75% | Within 1 year |
| After opening bag | ≤30°C | ≤60% | Recommended within 24 hours |
| Baking (if exceeded storage or bag damaged) | 60±5°C | - | ≥24 hours |
ESD and EOS protection should be employed during handling and assembly, as LEDs are sensitive to electrostatic discharge.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |