White LED 1.6x0.8x0.7mm SMD - 3.0V Forward Voltage - 20mA - 60mW - Technical Data Sheet

1. Product Overview

1.1 General Description

This white LED is fabricated using a blue chip and phosphor conversion technology. The package dimensions are 1.6mm × 0.8mm × 0.7mm, making it suitable for compact SMD applications. The LED emits white light through the combination of blue chip emission and yellow phosphor, providing efficient illumination.

1.2 Features

• Extremely wide viewing angle of 140°.
• Suitable for all SMT assembly and solder processes.
• Moisture sensitivity level: Level 3 per JEDEC.
• RoHS compliant.

1.3 Applications

• Optical indicators.
• Switches, symbols, and displays.
• Household electrical appliances.
• General purpose indication.

2. Technical Parameter Analysis

2.1 Electrical and Optical Characteristics

The electrical and optical characteristics are specified at Ts=25°C with IF=20mA unless otherwise noted. The forward voltage (VF) is binned from G1 (2.8-2.9V) to J1 (3.4-3.5V), with typical values around 3.0V at 20mA. The luminous intensity (IV) ranges from 600 to 1100 mcd depending on bin code. The viewing angle is 140° (half angle). Reverse current is less than 10µA at VR=5V. Thermal resistance from junction to solder point is 450°C/W.

2.2 Absolute Maximum Ratings

Exceeding these ratings may cause permanent damage. Proper heat sinking is required to keep junction temperature below maximum.

3. Binning System

3.1 Forward Voltage Bins

Forward voltage is sorted into bins at IF=20mA. The bins cover from 2.8V to 3.5V with increments of 0.1V. Typical bins are G1 (2.8-2.9V), G2 (2.9-3.0V), H1 (3.0-3.1V), H2 (3.1-3.2V), I1 (3.2-3.3V), I2 (3.3-3.4V), J1 (3.4-3.5V).

3.2 Luminous Intensity Bins

Luminous intensity is binned from 600 to 1100 mcd. Common bins include 1BF (600-650 mcd), 1BG (650-700 mcd), 1BH (700-750 mcd), 1BI (750-800 mcd), 1BJ (800-850 mcd), 1BK (850-900 mcd), 1FA (900-950 mcd), 1FB (950-1000 mcd), LC1 (1000-1050 mcd), LC2 (1050-1100 mcd).

3.3 Chromaticity Bins

The LED is also sorted by chromaticity coordinates within the CIE 1931 diagram. Bins such as B11, B12, B21, B22, B51, K21, K31 provide tight color consistency. Each bin defines a quadrilateral region with specified x,y coordinates. For example, bin B11 has coordinates: (0.2423,0.2225), (0.2385,0.2244), (0.2449,0.2344), (0.2487,0.2325).

4. Performance Curves

4.1 Forward Voltage vs Forward Current

Figure 1-7 shows the forward voltage increases with forward current. At typical 20mA, VF is about 3.0V for the H1 bin.

4.2 Forward Current vs Relative Intensity

The relative intensity rises with forward current as shown in Figure 1-8. It is approximately linear up to 30mA.

4.3 Temperature Effects

Figures 1-9 and 1-10 demonstrate that pin temperature affects both relative intensity and forward current. Higher temperature reduces light output and increases forward voltage.

4.4 Forward Current vs Dominant Wavelength

Figure 1-11 shows that dominant wavelength shifts slightly with current. At 25°C, the wavelength remains stable over the operating range.

4.5 Relative Intensity vs Wavelength

Figure 1-12 gives the spectral distribution. The white LED spectrum has a blue peak around 450-460nm and a broad yellow phosphor emission.

4.6 Radiation Pattern

The radiation pattern in Figure 1-13 shows a wide lambertian distribution with half-angle of 140°. This ensures uniform light dispersion.

5. Mechanical and Packaging

5.1 Package Dimensions

The package measures 1.6mm (L) × 0.8mm (W) × 0.7mm (H). The top view shows the LED chip location. The side view indicates the thickness. The bottom view reveals two pads: pad 1 (cathode) and pad 2 (anode). A polarity mark is present on the bottom.

5.2 Soldering Patterns

Recommended soldering pads are provided in Figure 1-5. Each pad dimension is 0.8mm × 0.8mm with 0.8mm spacing. Overall footprint is 2.4mm in length.

5.3 Polarity Mark

The polarity mark indicates the cathode side. Ensure correct orientation during assembly to avoid reverse bias.

6. Soldering and Assembly Guide

6.1 SMT Reflow Soldering Profile

The recommended reflow profile:

• Ramp-up rate: max 3°C/s from Tsmin (150°C) to Tsmax (200°C).
• Preheat time: 60-120 seconds between 150-200°C.
• Time above 217°C: max 60 seconds.
• Peak temperature: 260°C, max 10 seconds.
• Cooling rate: max 6°C/s.
• Total time from 25°C to peak: max 8 minutes.

Reflow soldering should not exceed twice. If more than 24 hours between solders, baking is required.

6.2 Hand Soldering

When hand soldering, use iron temperature below 300°C for less than 3 seconds. Only one hand soldering is allowed.

6.3 Repairing

Repair after soldering is not recommended. If unavoidable, use a double-head soldering iron and verify LED characteristics.

6.4 Cautions

Do not mount LEDs on warped PCB. Avoid mechanical stress or rapid cooling after soldering.

7. Packaging and Ordering Information

7.1 Packaging Specification

LEDs are packaged in tape and reel format: 4000 pieces per reel.

7.2 Carrier Tape and Reel Dimensions

Carrier tape width 8mm, pitch 4mm. Reel outer diameter 178mm, hub diameter 60mm. Detailed dimensions are provided in Figure 2-1 and 2-2.

7.3 Label Form Specification

Each reel carries a label with part number, spec number, lot number, bin code (flux, chromaticity, voltage), wavelength code, quantity, and date.

7.4 Moisture Resistant Packing

Reels are sealed in moisture barrier bag with desiccant and humidity indicator. Follow MSL3 handling.

7.5 Cardboard Box

Reels are packed in cardboard boxes for shipment.

8. Reliability Testing

8.1 Test Items and Conditions

8.2 Failure Criteria

After testing, forward voltage must not exceed 1.1× upper spec limit. Reverse current must be below 2.0× upper spec limit. Luminous flux must not drop below 0.7× lower spec limit.

9. Application Notes

9.1 Thermal Design

Proper heat dissipation is critical. The junction temperature must not exceed 95°C. Use adequate PCB copper area and thermal vias to manage heat.

9.2 Circuit Design

Always include a current-limiting resistor to prevent current surge. Avoid reverse voltage. The circuit should ensure only forward bias during operation.

9.3 Environmental Precautions

Sulfur content in surrounding materials must be below 100ppm. Bromine and chlorine single content below 900ppm, total below 1500ppm. Avoid VOCs that may damage the LED encapsulant.

10. Storage and Handling

10.1 Storage Conditions

Before opening aluminum bag: store at ≤30°C and ≤75%RH for up to 1 year from date. After opening: store at ≤30°C and ≤60%RH for 168 hours. If exceeded, bake before use.

10.2 Baking

Bake at 60±5°C for at least 24 hours if moisture barrier has been compromised.

10.3 ESD Protection

LEDs are ESD sensitive (HBM 1000V). Use proper ESD precautions during handling and assembly.

11. Principles of Operation

The white LED uses a blue InGaN chip coated with a yellow phosphor (e.g., YAG:Ce). The blue light excites the phosphor to emit yellow light; the combination of blue and yellow yields white light. The exact color temperature depends on the phosphor composition and thickness.

12. Common Questions

Q: What is the recommended storage condition?

A: Before opening, ≤30°C and ≤75%RH for up to 1 year. After opening, 168 hours at ≤30°C and ≤60%RH.

Q: How many reflow cycles are allowed?

A: Maximum 2 times. If more than 24 hours between cycles, baking is required.

Q: What is the moisture sensitivity level?

A: MSL Level 3.

Q: Can the LED be used with pulse drive?

A: Yes, peak forward current is 60mA with 1/10 duty cycle and 0.1ms pulse width.

Q: What is the typical thermal resistance?

A: 450°C/W from junction to solder point.