LED Chip Specification - Dimensions 1.6x0.8x0.4mm - Voltage 2.6-3.5V - Power 0.105W - White Light - Technical Document

1. Product Overview

This document provides a comprehensive technical specification for a miniature white Light Emitting Diode (LED) designed for surface-mount technology (SMT) applications. The product is characterized by its compact footprint and wide viewing angle, making it suitable for space-constrained electronic designs requiring reliable optical indication.

1.1 Product Positioning and Core Advantages

The LED is positioned as a high-reliability, general-purpose indicator component. Its core advantages stem from its miniature package size of 1.6mm x 0.8mm x 0.4mm, which allows for high-density PCB layouts. The device features an extremely wide viewing angle of 140 degrees (typical), ensuring visibility from various perspectives. It is fully compliant with standard SMT assembly processes, including reflow soldering, and adheres to RoHS environmental standards. The moisture sensitivity level is rated at MSL 3, indicating robust handling characteristics for most manufacturing environments.

1.2 Target Market

The primary target markets include consumer electronics, industrial controls, automotive interior lighting, and general instrumentation. Specific applications are broad, encompassing backlighting for switches and symbols, status indicators on various devices, and general illumination in display panels where small size and diffuse light output are critical.

2. In-Depth Technical Parameter Analysis

The following sections provide a detailed breakdown of the key electrical, optical, and thermal parameters specified for this LED, measured at a standard junction temperature of 25°C.

2.1 Photoelectric Characteristics

The luminous intensity is specified at a forward current (I_F) of 5mA. It is binned into several ranges, denoted by codes such as 1AP (90-120 mcd), G20 (120-150 mcd), 1AW (150-200 mcd), 1AX (200-250 mcd), and 1AY (250-300 mcd). This binning allows designers to select LEDs with consistent brightness levels for uniform appearance in multi-LED applications. The dominant wavelength and color are achieved by using a blue LED chip combined with a phosphor coating to produce white light, with specific chromaticity coordinates defined in the binning system.

2.2 Electrical Parameters

The forward voltage (V_F) is a critical parameter that affects power supply design. At I_F=5mA, the V_F is meticulously binned across ten ranges from F1 (2.6-2.7V) to J1 (3.4-3.5V). This precise voltage binning facilitates current matching in series or parallel circuits. The reverse current (I_R) is guaranteed to be a maximum of 10 µA at a reverse voltage (V_R) of 5V, indicating good diode characteristics and protection against minor reverse bias. Absolute maximum ratings define the operational limits: a continuous forward current of 30mA, a peak pulse current of 60mA (under specific conditions), and a maximum power dissipation of 105mW.

2.3 Thermal Characteristics

Thermal management is essential for LED longevity and performance stability. The thermal resistance from the junction to the solder point (R_θJ-S) is specified as 450 °C/W (typical). This value quantifies how effectively heat is transferred from the semiconductor junction to the PCB. The maximum allowable junction temperature (T_J) is 95°C. Exceeding this temperature can lead to accelerated light output degradation and reduced operational life. The operating and storage temperature range is specified from -40°C to +85°C, ensuring reliability in harsh environments.

3. Binning System Explanation

To ensure color and brightness consistency in production, the LEDs are sorted (binned) based on key parameters.

3.1 Forward Voltage Binning

As mentioned, the forward voltage is divided into ten distinct bins (F1, F2, G1, G2, H1, H2, I1, I2, J1, J2). Designers can use this information to group LEDs with similar V_F when designing constant-current driver circuits, minimizing current imbalance in parallel strings.

3.2 Luminous Flux Binning

The luminous intensity is binned into five primary groups (1AP, G20, 1AW, 1AX, 1AY). This allows for the selection of LEDs with matched brightness, which is crucial for applications like indicator arrays or backlighting strips where visual uniformity is paramount.

3.3 Color Coordinate Binning

The white light color is defined within the CIE 1931 chromaticity diagram. The specification provides bin codes (e.g., B3a, B3b, B4a, B4b, etc.) with corresponding sets of (x, y) coordinate pairs that define a quadrilateral area on the chromaticity chart. LEDs falling within these areas have a consistent white color temperature and tint. This binning is essential for applications requiring precise color matching, such as in multi-LED displays or status indicators where color perception is critical.

4. Performance Curve Analysis

While the PDF references typical optical characteristic curves, the specific graphs are not included in the provided text. However, based on the tabulated data, we can infer standard performance trends.

4.1 IV Characteristics Curve

A typical LED current-voltage (I-V) curve would show an exponential relationship. The forward voltage bins indicate the slight variation in the turn-on voltage across different production units. The curve would show that above the turn-on voltage (around 2.6V), the current increases rapidly with a small increase in voltage, highlighting the necessity for current-limiting circuitry in practical designs.

4.2 Temperature Dependence

LED performance is temperature-sensitive. Typically, the forward voltage decreases with increasing junction temperature (negative temperature coefficient), while the luminous output also decreases. The specified maximum junction temperature of 95°C and the thermal resistance value are key for modeling this dependence. Designers must ensure adequate PCB copper area or other heatsinking methods to maintain T_J within safe limits for optimal light output and longevity.

4.3 Spectral Distribution

As a phosphor-converted white LED, the spectral power distribution would consist of a primary peak from the blue LED chip (typically around 450-460nm) and a broader secondary peak in the yellow-green region emitted by the phosphor. The combination results in white light. The exact spectral shape and Correlated Color Temperature (CCT) are controlled by the phosphor composition and are reflected in the color coordinate binning data provided.

5. Mechanical and Packaging Information

5.1 Package Dimensions

The LED is housed in a compact surface-mount package with overall dimensions of 1.60mm (L) ± 0.20mm x 0.80mm (W) ± 0.20mm x 0.40mm (H). Detailed mechanical drawings show top, side, and bottom views. The bottom view clearly shows the two anode and cathode terminals, which are crucial for correct PCB footprint design.

5.2 Pad Design and Polarity Identification

A recommended solder pad pattern is provided in the documentation. The pad dimensions are typically 0.80mm x 0.80mm for each terminal with a gap of 0.80mm between them. Following this recommendation ensures proper solder joint formation and mechanical stability during reflow. Polarity is clearly marked on the component itself; typically, the cathode side may be indicated by a notch, a dot, or a green marking as per the diagram. Correct orientation is vital for circuit functionality.

6. Soldering and Assembly Guidelines

6.1 SMT Reflow Soldering Parameters

The product is suitable for all standard SMT assembly processes. While specific reflow profile parameters (preheat, soak, reflow peak temperature, cooling) are not detailed in the provided excerpt, standard lead-free (RoHS) reflow profiles with a peak temperature typically not exceeding 260°C are applicable. The moisture sensitivity level of 3 requires that the components be baked if exposed to ambient conditions for longer than the specified time (usually 168 hours) before reflow to prevent popcorn cracking during soldering.

6.2 Handling Precautions and Storage Conditions

Standard ESD (Electrostatic Discharge) precautions should be observed during handling, as the device has an ESD withstand voltage of 1000V (HBM). Components should be stored in their original moisture-resistant packing at temperatures between -40°C and +85°C and at a relative humidity below the level specified for MSL 3. Avoid mechanical stress on the LED lens during placement or cleaning processes.

7. Packaging and Ordering Information

7.1 Packaging Specifications

The LEDs are supplied in embossed carrier tapes wound on reels, which is standard for automated SMT pick-and-place machines. The specification includes detailed dimensions for the carrier tape pockets and the reel itself to ensure compatibility with feeders. This packaging method protects the components from physical damage and contamination during transportation and assembly.

7.2 Label Specifications

Reel labels contain essential information for traceability and correct usage, including the part number, bin codes for voltage and luminous intensity, quantity, date code, and lot number. Understanding this labeling is important for inventory control and ensuring the correct component variant is used in production.

8. Application Recommendations

8.1 Typical Application Scenarios

This LED is ideally suited for:

• Optical Indicators: Power status, battery level, or operational mode indicators in portable devices, home appliances, and industrial equipment.
• Switch and Symbol Backlighting: Illuminating buttons, keypads, or graphical symbols on control panels for enhanced visibility in low-light conditions.
• Display Backlighting: As a light source for small segmented or dot-matrix displays where uniform, diffuse lighting is required.
• General Decorative Lighting: Low-power accent lighting in consumer products.

8.2 Design Considerations

Key design factors include:

• Current Drive: Always use a constant current driver or a current-limiting resistor in series with the LED. The value should be calculated based on the desired forward current (not exceeding 30mA continuous) and the forward voltage bin of the chosen LED.
• Thermal Management: For continuous operation at higher currents, consider the thermal path. Use sufficient copper area on the PCB under and around the LED pads to act as a heatsink, keeping the junction temperature below 95°C.
• Optical Design: The wide 140-degree viewing angle provides a diffuse light pattern. For more directed light, external lenses or light guides may be needed. The small size allows for integration into tight spaces.

9. Technical Comparison

9.1 Differentiation Advantages

Compared to other miniature LEDs in the market, this product's key differentiators include its combination of an extremely wide viewing angle with a very compact 1608 package size (1.6x0.8mm). Many competitors offer similar sizes but with narrower viewing angles. The detailed and extensive binning for both voltage and luminous intensity provides a higher degree of consistency for demanding applications, reducing the need for post-production calibration or brightness matching circuits. Its MSL 3 rating offers better moisture resistance than some smaller chip-scale LEDs rated MSL 5 or 6, simplifying storage and handling procedures.

10. Frequently Asked Questions

10.1 Common Questions Based on Technical Parameters

Q: What is the purpose of the multiple forward voltage (V_F) bins?

A: V_F binning allows designers to select LEDs with nearly identical electrical characteristics. When connecting LEDs in parallel, using units from the same V_F bin minimizes current imbalance, ensuring uniform brightness and preventing one LED from hogging current and overheating.

Q: How do I choose the right luminous intensity bin?

A: Select the bin based on the required brightness for your application. For high-ambient-light conditions, a higher bin (e.g., 1AY) may be necessary. For low-power or indoor indicators, a lower bin (e.g., 1AP) might suffice, potentially saving power. Using a single bin across a product ensures visual consistency.

Q: The maximum junction temperature is 95°C. Is it safe to operate continuously at this temperature?

A: While the device can withstand 95°C, continuous operation at the maximum junction temperature will accelerate the degradation of the LED, reducing its luminous output over time (lumen depreciation). For long-term reliability, it is advisable to design the system to keep T_J significantly lower, ideally below 70-80°C under worst-case conditions.

11. Practical Use Cases

11.1 Design and Application Examples

Case 1: Multi-Legend Button Panel: A control panel for industrial machinery uses 20 of these LEDs to backlight various button legends. By specifying LEDs from the same luminous intensity bin (e.g., 1AW) and a tight forward voltage bin (e.g., G1), the designer can use a single current-limiting resistor value for all LEDs connected in parallel, achieving uniform illumination across the panel without complex drive electronics.

Case 2: Wearable Device Status Indicator: In a compact fitness tracker, a single LED of this type is used as a charging and notification indicator. The miniature 1.6x0.8mm footprint fits within the extremely limited internal space. The wide viewing angle ensures the light is visible even when the device is worn on the wrist at different angles. The low operating current (5-10mA) minimizes impact on battery life.

12. Working Principle Introduction

12.1 Objective Explanation of LED Technology

A Light Emitting Diode is a semiconductor device that emits light when an electric current passes through it. This phenomenon, called electroluminescence, occurs when electrons recombine with electron holes within the device, releasing energy in the form of photons. The color of the light is determined by the energy band gap of the semiconductor material. This specific product is a white LED, which is commonly created by combining a blue LED chip with a yellow phosphor coating. The blue light from the chip excites the phosphor, causing it to emit yellow light. The combination of blue and yellow light is perceived by the human eye as white. This method is efficient and allows for tuning the white color temperature by adjusting the phosphor composition.

13. Development Trends

13.1 Objective Overview of LED Industry Trends

The LED industry continues to evolve towards higher efficiency (more lumens per watt), smaller package sizes, and improved color rendering. For indicator and miniature lighting applications, trends include:

• Increased Integration: Combining multiple LED chips or integrating control ICs into the package.
• Enhanced Reliability: Improvements in materials and packaging to withstand higher temperatures and harsher environments, particularly for automotive and industrial uses.
• Color Consistency: Advancements in phosphor technology and binning processes to provide tighter color tolerances straight from production, reducing costs for end-users who require precise color matching.
• Flexible and Unconventional Substrates: Development of LEDs that can be mounted on flexible or curved PCBs, opening new design possibilities. While this specific component is a standard rigid SMT part, it represents the ongoing miniaturization that enables these broader trends.