White LED 3.2x1.6x0.7mm Specification - Voltage 2.7-3.5V - Power 105mW - English Technical Document

1. Product Overview

This white LED is fabricated using a blue chip combined with phosphor conversion, offering a compact 3.2mm x 1.6mm x 0.7mm surface mount package. It is designed for general purpose indication, displays, and household appliances. Key features include an extremely wide viewing angle (140°), suitability for all SMT assembly and solder processes, moisture sensitivity level 3, and RoHS compliance. The LED is available in multiple forward voltage and luminous intensity bins to suit various application requirements.

2. Technical Parameters Interpretation

2.1 Electrical and Optical Characteristics

At a test condition of IF = 20 mA and Ts = 25°C, the forward voltage (VF) is divided into eight bins from F2 (2.7 V – 2.8 V) to J1 (3.4 V – 3.5 V). Luminous intensity (IV) is measured under the same condition and spans from 600 mcd to 1200 mcd across twelve bins (1BF through LD2). The viewing angle (2θ1/2) is typically 140°, while reverse current (IR) at VR = 5 V is less than 10 µA. Thermal resistance (RthJ-S) is specified as 450 °C/W maximum.

2.2 Absolute Maximum Ratings

At Ts = 25°C, the absolute maximum ratings are as follows: power dissipation (Pd) 105 mW, forward current (IF) 30 mA, peak forward current (IFP) 60 mA (1/10 duty, 0.1 ms pulse), electrostatic discharge (ESD) 1000 V (HBM), operating temperature (Topr) -40°C to +85°C, storage temperature (Tstg) -40°C to +85°C, and junction temperature (Tj) 95°C. Designers must ensure that the LED is never operated beyond these limits and that adequate heat sinking is provided when operating near maximum current.

3. Binning System

To meet diverse application needs, the LED is sorted into bins for forward voltage, luminous intensity, and chromaticity. The voltage bins are labeled F2, G1, G2, H1, H2, I1, I2, J1, each covering a 0.1 V range. Intensity bins are designated 1BF (600–650 mcd) through LD2 (1150–1200 mcd). Chromaticity binning is based on CIE 1931 coordinates as shown in the chromaticity diagram (Fig. 1-6) and Table 1-3. All binning is performed at IF = 20 mA. This binning system allows customers to select components with tight tolerances for consistent optical performance in mass production.

4. Performance Curve Analysis

4.1 Forward Voltage vs. Forward Current

As shown in Fig. 1-7, the forward current increases nearly linearly with forward voltage in the range of 2.5 V to 3.5 V, with a typical operating point at 20 mA and approximately 2.8 V – 3.0 V for most bins.

4.2 Relative Intensity vs. Forward Current

Fig. 1-8 illustrates that relative luminous intensity rises with forward current up to 30 mA, following a slightly sub-linear trend. At 20 mA the relative intensity is normalized to 1.0.

4.3 Temperature Dependence

Fig. 1-9 shows that relative intensity decreases with increasing ambient temperature, dropping to about 0.85 at 85°C. Fig. 1-10 indicates that the maximum permissible forward current decreases as pin temperature rises, reaching zero at 120°C.

4.4 Chromaticity Shift with Current

Fig. 1-11 presents the CIE coordinate shift when forward current varies from 1 mA to 30 mA. The x and y coordinates shift slightly toward lower values with increased current, but remain within a narrow range.

4.5 Spectral Distribution

Fig. 1-12 shows the relative spectral intensity versus wavelength. The emission peak is around 450 nm (blue) with a broad phosphor component from 520 nm to 700 nm, giving the overall white appearance.

4.6 Radiation Pattern

Fig. 1-13 depicts the angular radiation characteristics. The luminous intensity remains above 80% of the maximum within ±40° and drops to 50% at approximately ±70°, confirming a very wide viewing angle of 140°.

5. Mechanical and Packaging Information

5.1 Package Dimensions

The LED is housed in a 3.2 mm × 1.6 mm × 0.7 mm package with a top view showing two anode/cathode pads. The bottom view indicates a pad layout with a 1.40 mm × 1.70 mm cathode and a smaller anode pad. The side view shows a lens height of 0.70 mm and overall thickness of 0.70 mm. Recommended soldering patterns are provided with a 1.50 mm × 1.60 mm pad for each electrode and a spacing of 2.10 mm between pads. Polarity is marked as shown in Fig. 1-4.

5.2 Carrier Tape and Reel

The LEDs are packaged in carrier tapes with a pitch of 2.00 mm, width 8.00 mm, and cavity dimensions matching the package. Each reel holds 4000 pcs. The reel has an outer diameter of 178 mm ± 1 mm, hub diameter of 60 mm ± 0.1 mm, and width of 13.0 mm ± 0.5 mm. A polarity mark is printed on the carrier tape to indicate orientation during pick-and-place.

5.3 Label and Moisture Barrier Bag

Each reel is labeled with part number, spec number, lot number, bin code, luminous flux (Ф), chromaticity bin (XY), forward voltage (VF), wavelength (WLD), quantity, and production date. The reel is sealed in a moisture barrier bag with desiccant and a humidity indicator card. The bag is then placed inside a cardboard box for shipment.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

Standard lead-free reflow soldering is recommended with a peak temperature of 260°C and a time above 217°C of 60 – 150 seconds. Preheating from 150°C to 200°C should last 60 – 120 seconds. The cooling rate must not exceed 6°C/s. A maximum of two reflow cycles is allowed, with a waiting time of at least 24 hours between cycles if the LEDs have been stored in a non-dry environment.

6.2 Hand Soldering and Rework

If manual soldering is required, a soldering iron set below 300°C should be used for no more than 3 seconds per pad, and the operation should be performed only once. Rework should be avoided; if unavoidable, a double-head soldering iron must be used to heat both pads simultaneously. Mechanical stress and rapid cooling after soldering must be prevented.

6.3 Storage and Baking Conditions

Before opening the moisture barrier bag, the LEDs can be stored for up to 1 year at ≤30°C and ≤75% RH. After opening, the LEDs must be used within 168 hours at ≤30°C and ≤60% RH. If the exposure time exceeds 168 hours or the humidity indicator shows excessive moisture, baking at 60°C ± 5°C for 24 hours is required before reflow.

7. Application Recommendations

This white LED is ideal for optical indicators, switches, symbols, display backlighting, and household electrical appliances. Designers should ensure that the driving circuit limits current to the absolute maximum ratings and includes a series resistor to avoid thermal runaway. Due to the wide viewing angle (140°), the LED is suitable for applications requiring uniform light distribution over a large area. For high ambient temperature environments, derating of forward current is necessary as indicated in Fig. 1-10.

8. Comparative Technical Advantages

Compared to conventional 3.2×1.6 mm white LEDs, this product offers a wider voltage binning range (2.7–3.5 V) and finer intensity binning steps (50 mcd intervals), enabling tighter optical matching in multi-LED arrays. The 140° viewing angle is wider than typical 120° devices, improving uniformity in backlight and indicator applications. The specified thermal resistance of 450°C/W is relatively low for this package size, aiding heat dissipation.

9. Frequently Asked Questions

Q: Can I use this LED in outdoor applications? A: The operating temperature range is -40°C to +85°C, making it suitable for indoor and some outdoor applications, but additional environmental protection (e.g., conformal coating) may be needed for high humidity or corrosive atmospheres.
Q: How do I handle ESD sensitivity? A: The LED has an HBM ESD rating of 1000 V. Use standard ESD precautions including grounded workstations, ionizers, and conductive packaging.
Q: What cleaning solvents are safe? A: Isopropyl alcohol is recommended. Avoid solvents that may attack the silicone encapsulant. Ultrasonic cleaning is not recommended.
Q: Why is the forward voltage binned so finely? A: Fine binning allows consistency in brightness and color in applications where multiple LEDs are driven in parallel without individual current regulation.

10. Practical Application Case

In a typical household appliance (e.g., washing machine display), four LEDs in the same intensity and voltage bin are used to provide uniform backlighting. The wide 140° viewing angle ensures readability from any direction. The LEDs are soldered onto a PCB with thermal pads connected to a copper pour for heat sinking. Reliability tests conducted per the specification showed no failures after 1000 hours of life test at 20 mA and 25°C ambient.

11. Operating Principle

The white LED consists of a blue-emitting InGaN/GaN flip chip or vertical chip coated with a yellow-emitting YAG:Ce phosphor. Blue light from the chip partially excites the phosphor, which emits yellow light. The combination of residual blue and yellow light produces white light. The exact correlated color temperature (CCT) depends on the phosphor composition and thickness; typical bins are in the cool white region (around 5000K–7000K) based on the chromaticity coordinates provided.

12. Development Trends

Ongoing trends in the LED industry include further miniaturization (e.g., 2.0×1.2 mm packages), higher luminous efficacy (targeting >130 lm/W for this footprint), improved phosphor stability, and reduced thermal resistance through advanced substrate materials. The integration of multiple chips in a single package (CSP) and finer binning tolerance (<0.5-step MacAdam ellipse) is becoming standard for high-end applications.