RF-40QI32DS-FH-N White LED Specification - PLCC-2 Package - 2.8x3.5x1.82mm - 3.0V - 60mA - 22.5lm - 4290K CRI97

1. Product Overview

This document details the specifications for a high-color-rendering white light-emitting diode (LED) in a standard PLCC-2 surface-mount package. The device is fabricated using a purple semiconductor chip combined with phosphor to produce white light, making it suitable for applications requiring accurate color representation.

1.1 Core Advantages

The LED offers several key advantages that make it a reliable choice for modern electronic designs:

• PLCC-2 Package: Industry-standard package ensuring compatibility with automated assembly processes.
• Extremely Wide Viewing Angle: A typical 120-degree half-intensity angle provides uniform light distribution.
• Full SMT Compatibility: Designed for use in all standard surface-mount technology assembly and solder reflow processes.
• Tape and Reel Packaging: Available on carrier tape and reel for high-volume, automated pick-and-place assembly.
• Moisture Sensitivity: Rated at MSL (Moisture Sensitivity Level) 3, indicating standard handling precautions are required.
• Environmental Compliance: The product is compliant with RoHS (Restriction of Hazardous Substances) directives.

1.2 Target Market & Application

This LED is designed for general illumination and indication purposes where good color quality is important. Its primary application areas include:

• Optical status indicators on electronic devices and control panels.
• Backlighting for indoor information displays and signage.
• General tubular lighting applications.
• Broad general-purpose illumination where high CRI is beneficial.

Important Note: The product is explicitly stated as not suitable for use in flexible strip applications, likely due to mechanical stress considerations on the package.

2. In-Depth Technical Parameter Analysis

The performance of the LED is defined under standard test conditions at a junction temperature (Ts) of 25°C.

2.1 Electro-Optical Characteristics

The primary operating parameters at a forward current (IF) of 60mA are as follows:

• Forward Voltage (VF): 3.0V typical, with a range from 2.9V (Min) to 3.2V (Max). This parameter is crucial for calculating the series resistor value or constant-current driver design.
• Luminous Flux (Φ): 22.5 lumens typical, ranging from 20 lm (Min) to 26 lm (Max). This measures the total visible light output.
• Viewing Angle (2θ½): 120 degrees typical, defining the angular spread where light intensity is at least half of the peak intensity.
• Color Rendering Index (CRI): 97 typical, with a minimum of 95. This exceptionally high value indicates the LED's ability to reveal the true colors of illuminated objects faithfully, making it ideal for retail, museum, or task lighting.
• Reverse Current (IR): Maximum of 10 µA at a reverse voltage (VR) of 5V, indicating the leakage current in the off-state.
• Thermal Resistance (R_THJ-S): 20 °C/W typical from the junction to the solder point. This value is critical for thermal management design, as it defines how much the junction temperature will rise for each watt of power dissipated.

2.2 Absolute Maximum Ratings

These ratings define the stress limits beyond which permanent damage may occur. Operation under or at these limits is not guaranteed.

• Power Dissipation (P_D): 576 mW
• Continuous Forward Current (I_F): 180 mA
• Peak Forward Current (I_FP): 300 mA (at 1/10 duty cycle, 0.1ms pulse width)
• Reverse Voltage (V_R): 5 V
• Electrostatic Discharge (ESD) HBM: 2000 V (Note: Over 90% yield at this level, but ESD protection during handling is still required).
• Operating & Storage Temperature (T_OPR, T_STG): -40°C to +100°C
• Maximum Junction Temperature (T_J): 125°C

Critical Design Rule: The maximum operating current must be determined after measuring the actual package temperature in the application to ensure the junction temperature does not exceed 125°C.

3. Binning System Explanation

To ensure consistency in mass production, LEDs are sorted into bins based on key parameters measured at I_F = 60mA.

3.1 Forward Voltage (VF) Binning

LEDs are categorized into three voltage groups, which helps in designing stable power supplies and achieving uniform brightness in arrays.

• G2 Bin: 2.9V – 3.0V
• H1 Bin: 3.0V – 3.1V
• H2 Bin: 3.1V – 3.2V

3.2 Luminous Flux (Φ) Binning

Light output is sorted into three flux groups, allowing designers to select the appropriate brightness level for their application.

• QED Bin: 20 – 22 lumens
• QGD Bin: 22 – 24 lumens
• QHA Bin: 24 – 26 lumens

3.3 Chromaticity / Color Temperature Binning

The document references a CIE 1931 chromaticity diagram and provides specific coordinate sets (e.g., 40A, 40B, 40C, 40D, 40K) that define quadrilateral or hexagonal regions on the diagram. The primary bin mentioned for this part number appears to be centered around a correlated color temperature (CCT) of approximately 4290K, as indicated by the "40K" bin code and the part number suffix. The precise color coordinates ensure tight control over the white point, which is essential for applications where color consistency across multiple LEDs is critical.

4. Performance Curve Analysis

4.1 Forward Voltage vs. Forward Current (I-V Curve)

The characteristic I-V curve shows the relationship between the voltage applied across the LED and the resulting current. For this device, at the typical operating current of 60mA, the forward voltage is approximately 3.0V. The curve is non-linear, exhibiting a standard diode turn-on characteristic. This data is essential for selecting an appropriate current-limiting driver topology (resistive or constant-current).

4.2 Relative Luminous Intensity vs. Forward Current

This curve demonstrates how the light output scales with drive current. The output increases sub-linearly with current. While driving at higher currents yields more light, it also generates more heat, which can reduce efficiency (luminous efficacy) and potentially shorten the LED's lifespan if thermal management is inadequate. Operating at or below the recommended 60mA ensures optimal performance and reliability.

5. Mechanical & Packaging Information

5.1 Package Dimensions and Tolerances

The PLCC-2 package has the following critical dimensions (all in millimeters, with a general tolerance of ±0.05mm unless specified):

• Overall Length: 3.50 mm
• Overall Width: 2.80 mm
• Overall Height: 1.82 mm (typical)
• Lead Width: 0.48 mm (typical)
• Lead Spacing: 2.10 mm (between anode and cathode centers)

Detailed top, side, bottom, and polarity views are provided in the dimensional drawings.

5.2 Polarity Identification and Solder Pad Pattern

Clear polarity marking is essential for correct assembly. The package design incorporates a polarity indicator. The recommended solder pad land pattern is also provided to ensure a reliable solder fillet and proper alignment during reflow soldering, which is critical for thermal performance and mechanical strength.

6. Soldering & Assembly Guidelines

6.1 SMT Reflow Soldering Instructions

The LED is suitable for standard infrared or convection reflow soldering processes. Adherence to the recommended reflow profile is crucial. Key parameters typically include:

• Preheat: A gradual ramp-up to activate the solder paste flux and minimize thermal shock.
• Soak/Preflow: A period at a temperature below the liquidus point to ensure uniform heating of the component and board.
• Reflow: A peak temperature zone where the solder paste melts. The peak temperature must be controlled to avoid damaging the LED's internal materials (epoxy, phosphor, wire bonds) while ensuring proper solder joint formation. The maximum body temperature should not exceed the rated limit.
• Cooling: A controlled cool-down period to solidify the solder joints.

Consult the specific SMT instructions section for the exact temperature-time profile.

6.2 Handling and Storage Precautions

• ESD Protection: Although the device has a 2000V HBM ESD rating, standard ESD precautions (grounded workstations, wrist straps) must be used during handling to prevent cumulative damage.
• Moisture Sensitivity: As an MSL Level 3 component, the bag must be baked before soldering if the exposure time outside the dry pack exceeds the specified limit (typically 168 hours at ≤30°C/60% RH).
• Avoid Mechanical Stress: Do not apply excessive force to the lens or leads.
• Cleanliness: Avoid contamination of the lens surface, as it can reduce light output.

7. Packaging and Reliability

7.1 Packaging Specification

The product is supplied in a moisture-resistant barrier bag with desiccant, placed on embossed carrier tape wound onto a reel. Detailed dimensions for the carrier tape pockets and the reel itself are provided to ensure compatibility with automated assembly equipment. A label on the reel specifies part number, quantity, bin codes, and lot traceability information.

7.2 Reliability Test Items

The product undergoes a series of reliability tests to ensure long-term performance under various environmental stresses. While specific conditions are listed in a dedicated table, typical tests for LEDs include:

• High-Temperature Operating Life (HTOL): Tests longevity under continuous operation at elevated temperature.
• Temperature Cycling: Tests resistance to thermal shock and mechanical stress from expansion/contraction.
• Humidity Testing: Evaluates resistance to moisture ingress.
• Solder Heat Resistance: Verifies the package can withstand the soldering process.

Specific criteria for judging failures (e.g., changes in forward voltage, luminous flux, or catastrophic failure) after these tests are defined.

8. Application & Design Considerations

8.1 Thermal Management

Given the thermal resistance of 20°C/W, effective heat sinking is paramount, especially when driving at currents above the nominal 60mA or in high ambient temperatures. The primary heat dissipation path is through the solder pads to the printed circuit board (PCB). Using a PCB with thermal vias under the LED's thermal pad (if applicable) connected to a ground plane or dedicated heatsink area is a standard practice to lower the thermal resistance from junction to ambient (R_THJ-A). Always calculate the expected junction temperature: T_J = T_A + (P_D * R_THJ-A), and ensure T_J < 125°C.

8.2 Electrical Drive

For optimal stability and longevity, drive the LED with a constant current source rather than a constant voltage with a series resistor, especially in applications where temperature varies or consistent brightness is required. The constant current source automatically adjusts the voltage to maintain the set current, compensating for the negative temperature coefficient of the LED's forward voltage.

8.3 Optical Design

The 120-degree viewing angle produces a lambertian-like emission pattern. For applications requiring a narrower beam, secondary optics (lenses or reflectors) must be used. The high CRI makes this LED suitable for areas where color discrimination is important, but designers should be aware that high-CRI white LEDs often have a slightly lower luminous efficacy compared to standard white LEDs.

9. Technical Comparison & Differentiation

Compared to standard mid-power white LEDs, this product's key differentiator is its exceptionally high Color Rendering Index (CRI ≥95). Most general-purpose white LEDs have a CRI in the 70-80 range. This high CRI is achieved through precise phosphor formulation and process control, making it ideal for applications where color quality cannot be compromised, albeit potentially at a higher cost point and slightly lower efficiency than standard white LEDs.

10. Frequently Asked Questions (Based on Technical Data)

10.1 What is the recommended operating current?

The specifications are primarily characterized at 60mA, which is the recommended typical operating point for balanced performance of light output, efficacy, and reliability. It can be operated up to the absolute maximum of 180mA, but only with excellent thermal management to keep the junction temperature in check.

10.2 How do I interpret the bin codes when ordering?

The part number (e.g., RF-40QI32DS-FH-N) often contains encoded information. You must specify the required V_F bin (G2, H1, H2) and Flux bin (QED, QGD, QHA) based on your circuit design and brightness requirements. The "40" in the part number and the referenced "40K" chromaticity bin indicate the nominal color temperature group.

10.3 Why is it not suitable for flexible strips?

Flexible strips undergo constant bending and flexing during installation and use. The rigid PLCC-2 package and its solder joints are susceptible to cracking under such repeated mechanical stress, leading to failure. LEDs for flexible strips typically use a softer, more resilient package or are specially coated to withstand bending.

11. Practical Use Case Example

Scenario: Designing a high-quality task lamp. A designer needs uniform, bright light with excellent color rendition for a desktop task lamp. They select this LED for its high CRI (97), ensuring documents and objects appear in their true colors. They design a metal-core PCB (MCPCB) to act as a heatsink, driving 12 LEDs in series with a constant-current driver set to 60mA per LED. The wide 120-degree viewing angle provides good coverage without harsh shadows. The designer specifies the H1 voltage bin and QGD flux bin to ensure consistent brightness and voltage drop across all 12 LEDs in the series string.

12. Operational Principle

This is a phosphor-converted white LED. A gallium nitride-based semiconductor chip emits light in the purple/ultraviolet spectrum. This primary light is not emitted directly. Instead, it excites a layer of phosphor material deposited on or around the chip. The phosphor absorbs the high-energy purple photons and re-emits light across a broader spectrum in the yellow and red regions. The combination of the unconverted residual purple/blue light from the chip and the broad yellow/red emission from the phosphor mixes to produce white light. The exact composition and thickness of the phosphor layer determine the correlated color temperature (CCT) and Color Rendering Index (CRI) of the resulting white light.

13. Technology Trends

The general trend in LED technology is towards higher efficacy (more lumens per watt), better color quality (higher CRI and more precise color consistency), and increased reliability. For mid-power packages like the PLCC-2, improvements often come from more efficient chip designs, advanced phosphor formulations with narrower emission bands for better color gamut, and improved package materials for lower thermal resistance and higher maximum operating temperatures. The industry is also focusing on reducing costs and improving sustainability through material choices and manufacturing processes. The product documented here represents a current implementation emphasizing high color quality within a standard, cost-effective package format.