T20 Series 2016 White LED Datasheet - Size 2.0x1.6x0.75mm - Voltage 2.9-3.2V - Power 0.48W - English Technical Document

1. Product Overview

The T20 Series 2016 is a compact, high-performance white light-emitting diode (LED) designed for general and architectural lighting applications. This top-view LED utilizes a thermally enhanced package design to ensure reliable operation and long lifespan under demanding conditions. Its primary advantages include a high luminous flux output, excellent current handling capability, and a wide 120-degree viewing angle, making it suitable for a variety of illumination needs where consistent, bright, and efficient light is required.

The target market for this component includes manufacturers of interior lighting fixtures, retrofit lamps, and decorative lighting systems. Its small footprint and robust performance characteristics make it an ideal choice for space-constrained designs that do not compromise on light quality or output.

2. Technical Parameter Deep Dive

2.1 Electro-Optical Characteristics

Under standard test conditions (forward current IF = 60mA, junction temperature Tj = 25°C), the LED exhibits key performance metrics. The typical forward voltage (VF) is 2.9V, with a maximum of 3.2V. The luminous flux varies with correlated color temperature (CCT):

• 2700K (Ra80): Minimum 22 lm, Typical 24.5 lm
• 3000K (Ra80): Minimum 24 lm, Typical 25.5 lm
• 4000K-6500K (Ra80): Minimum 24 lm, Typical 27.0 lm

Tolerances are ±7% for luminous flux and ±2 for color rendering index (Ra). The dominant half-intensity angle (2θ1/2) is 120 degrees, providing a broad, even light distribution.

2.2 Electrical and Thermal Parameters

The absolute maximum ratings define the operational limits. The maximum continuous forward current (IF) is 150 mA, with a pulsed forward current (IFP) of 225 mA under specific conditions (pulse width ≤ 100µs, duty cycle ≤ 1/10). The maximum power dissipation (PD) is 480 mW. The device can operate in ambient temperatures from -40°C to +105°C and can withstand a maximum junction temperature (Tj) of 120°C.

The thermal resistance from the junction to the solder point (Rth j-sp) is typically 38 °C/W when mounted on an MCPCB with electrical power applied at IF=60mA. This parameter is critical for thermal management design to prevent overheating and ensure longevity.

3. Binning System Explanation

3.1 Luminous Flux and CCT Binning

The LEDs are sorted into bins based on luminous flux and correlated color temperature (CCT) to ensure color and brightness consistency within an application. For example, for a 4000K LED with Ra80-82:

• Code 1H: Luminous flux between 24 lm (Min) and 26 lm (Max).
• Code 1J: Luminous flux between 26 lm (Min) and 28 lm (Max).
• Code 1K: Luminous flux between 28 lm (Min) and 30 lm (Max).

Similar bins exist for other CCTs (2700K, 3000K, 5000K, 5700K, 6500K).

3.2 Forward Voltage Binning

To aid in circuit design for consistent current drive, LEDs are also binned by forward voltage (VF) at IF=60mA:

• Code G3: VF between 2.6V and 2.8V.
• Code H3: VF between 2.8V and 3.0V.
• Code J3: VF between 3.0V and 3.2V.

The measurement tolerance for VF is ±0.1V.

3.3 Chromaticity Binning

The color consistency is tightly controlled using a 5-step MacAdam ellipse system on the CIE chromaticity diagram. Each CCT (e.g., 27M5 for 2700K, 40M5 for 4000K) has defined center coordinates (x, y) and ellipse parameters (a, b, Φ). This ensures minimal perceptible color variation between LEDs of the same bin. The Energy Star binning standard is applied to all products in the 2600K to 7000K range.

4. Performance Curve Analysis

The datasheet provides several graphs characterizing performance under varying conditions. These are essential for predicting real-world behavior.

• Forward Current vs. Relative Intensity: Shows how light output scales with drive current. It is crucial for determining the optimal operating point for efficiency and brightness.
• Forward Current vs. Forward Voltage: Illustrates the IV characteristic, important for driver design and power calculation.
• Ambient Temperature vs. Relative Luminous Flux: Demonstrates the derating of light output as temperature increases, highlighting the need for effective thermal management.
• Ambient Temperature vs. Relative Forward Voltage: Shows how VF decreases with rising temperature, a factor for constant-current driver stability.
• Chromaticity Coordinates vs. Ambient Temperature: Indicates any shift in color point with temperature, important for color-critical applications.
• Allowable Forward Current De-rating Curve: Defines the maximum safe operating current as a function of ambient or solder point temperature, preventing thermal runaway.

5. Mechanical and Package Information

5.1 Package Dimensions

The LED has a compact 2016 package size: 2.0 mm in length, 1.6 mm in width, and 0.75 mm in height (typical). The soldering pad pattern is designed for stable mounting and efficient heat transfer. The polarity is clearly marked: the cathode is identified on the package bottom view. All dimensions have a tolerance of ±0.1 mm unless otherwise specified.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

The component is compatible with Pb-free reflow soldering processes. The recommended profile parameters are:

• Preheat: From 150°C to 200°C over 60-120 seconds.
• Ramp-up rate (to peak): Maximum 3°C/second.
• Time above liquidous (TL=217°C): 60-150 seconds.
• Peak package body temperature (Tp): Maximum 260°C.
• Time within 5°C of Tp: Maximum 30 seconds.
• Ramp-down rate: Maximum 6°C/second.
• Total time from 25°C to peak temperature: Maximum 8 minutes.

Adhering to this profile is critical to prevent thermal damage to the LED die or package.

7. Part Numbering System

The part number follows the format: T □□ □□ □ □ □ □ – □ □□ □□ □. Key elements include:

• Type Code: "20" indicates the 2016 package.
• CCT Code: e.g., "27" for 2700K, "40" for 4000K.
• Color Rendering Code: "8" for Ra80.
• Chip Configuration: Codes for number of serial and parallel chips.
• Color Code: "M" for ANSI standard white.

This system allows precise identification of the LED's electrical and optical characteristics.

8. Application Suggestions

8.1 Typical Application Scenarios

This LED is well-suited for:

• Interior Lighting: Downlights, panel lights, and troffers requiring efficient, high-quality white light.
• Retrofit Lamps: Direct replacement for traditional incandescent or halogen bulbs in existing fixtures.
• General Lighting: Task lighting, accent lighting, and area illumination.
• Architectural/Decorative Lighting: Cove lighting, signage backlighting, and other aesthetic applications where consistent color and brightness are important.

8.2 Design Considerations

• Thermal Management: Given the typical Rth j-sp of 38 °C/W, proper heat sinking is essential. Use an MCPCB with adequate thermal vias and consider the ambient environment to keep the junction temperature below 120°C.
• Current Drive:** Always use a constant-current driver appropriate for the forward voltage bin and desired operating current (max 150mA continuous). Do not exceed the absolute maximum ratings.
• ESD Protection: The device has an ESD withstand level of 1000V (HBM). Implement standard ESD precautions during handling and assembly.
• Optical Design: The 120-degree viewing angle provides wide dispersion. For focused beams, secondary optics (lenses) will be required.

9. Technical Comparison and Differentiation

Compared to standard LEDs in similar packages, the T20 Series 2016 offers several advantages:

• Thermally Enhanced Package: The design improves heat dissipation from the junction, allowing for higher drive currents or longer lifespan at standard currents compared to non-enhanced packages.
• High Current Capability: A maximum continuous current of 150mA enables higher light output from a single, small-footprint device.
• Strict Binning: The use of 5-step MacAdam ellipses and detailed flux/voltage bins ensures superior color and brightness uniformity in multi-LED applications, reducing the need for manual sorting or calibration.
• Robust Reflow Compatibility: Withstands standard lead-free reflow profiles up to 260°C peak temperature, making it suitable for automated, high-volume SMT assembly lines.

10. Frequently Asked Questions (Based on Technical Parameters)

Q: What is the difference between the "Typical" and "Minimum" luminous flux values?
A: The "Typical" value represents the average output from production. The "Minimum" value is the guaranteed lower limit for the specified bin. Designers should use the minimum value for worst-case scenario calculations to ensure their application meets brightness requirements.

Q: How does ambient temperature affect performance?
A: As shown in the derating curves, increasing ambient temperature reduces light output (luminous flux) and slightly decreases forward voltage. Exceeding the maximum junction temperature can lead to accelerated degradation or failure. Proper heat sinking is critical.

Q: Can I drive this LED with a constant voltage source?
A: It is not recommended. LEDs are current-driven devices. Their forward voltage has tolerance and varies with temperature. A constant voltage source could lead to excessive current and damage the LED. Always use a constant-current driver or a circuit that limits current.

Q: What does the "5-step MacAdam ellipse" mean for color consistency?
A: A MacAdam ellipse defines a region on the color chart where color differences are imperceptible to the average human eye. A "5-step" ellipse is a common industry standard for tight color control. LEDs within the same 5-step ellipse will appear to have an identical white color under normal viewing conditions.

11. Practical Design and Usage Case

Case: Designing a 4000K LED Panel Light
A designer is creating a 600x600mm flat panel light for office use, targeting an illuminance of 500 lux. Using the T20 Series 2016 LED in 4000K (bin 1J, 26-28 lm), they calculate the number of LEDs needed based on the minimum flux (26 lm), optical efficiency of the light guide/diffuser system (e.g., 70%), and the desired total luminous flux. They select a constant-current driver that delivers 60mA per LED string. The PCB layout incorporates adequate copper pads for heat dissipation, following the recommended soldering pattern. By ensuring all LEDs are from the same CCT and flux bin (e.g., 1J), they achieve uniform brightness and color across the entire panel without visible hotspots or color shifts.

12. Operating Principle Introduction

A white LED typically consists of a semiconductor chip that emits blue light when current flows through it (electroluminescence). This blue light then strikes a phosphor coating deposited on or around the chip. The phosphor absorbs a portion of the blue light and re-emits it as yellow light. The combination of the remaining blue light and the converted yellow light is perceived by the human eye as white light. The exact shade of white (CCT) is determined by the composition and thickness of the phosphor layer. The color rendering index (Ra) indicates how accurately the LED light reveals the true colors of objects compared to a natural light source.

13. Technology Trends

The LED industry continues to evolve towards higher efficacy (more lumens per watt), improved color rendering (higher Ra and R9 values for reds), and better color consistency (tighter binning). There is also a trend towards miniaturization of packages while maintaining or increasing light output, as seen in this 2016 package. Furthermore, reliability and longevity under high-temperature operation are key focus areas, driving advancements in package materials, thermal interfaces, and phosphor technology. The compatibility with standard automated assembly processes remains a fundamental requirement for widespread adoption in lighting manufacturing.