Table of Contents
- 1. Product Overview
- 1.1 General Description
- 1.2 Features
- 1.3 Application
- 2. In-Depth Technical Parameters
- 2.1 Electrical and Optical Characteristics
- 2.2 Absolute Maximum Ratings
- 3. Binning System Explanation
- 3.1 Forward Voltage (VF) Binning
- 3.2 Luminous Intensity (IV) Binning
- 3.3 Chromaticity Coordinate Binning
- 4. Performance Curve Analysis
- 4.1 Forward Current vs. Forward Voltage (IV Curve)
- 4.2 Forward Current vs. Relative Luminous Intensity
- 5. Mechanical and Package Information
- 5.1 Package Dimensions
- 5.2 Polarity Identification and Soldering Pattern
- 6. SMT Reflow Soldering and Handling Guidelines
- 6.1 Reflow Soldering Profile
- 6.2 Handling and Storage Precautions
- 7. Packaging and Ordering Information
- 7.1 Tape and Reel Specifications
- 7.2 Reliability Testing
- 8. Application Design Suggestions
- 8.1 Typical Application: Automotive Interior Lighting
- 8.2 Design Considerations
- 9. Technical Comparison and Advantages
- 10. Frequently Asked Questions (Based on Technical Parameters)
- 10.1 What driver voltage is needed for this LED?
- 10.2 Can I drive this LED with a 5V supply and a resistor?
- 10.3 How many LEDs can I connect in series?
- 11. Practical Design Case Study
- 11.1 Designing an Automotive HVAC Control Backlight
- 12. Technology Principle Introduction
- 13. Technology Trends
- LED Specification Terminology
- Photoelectric Performance
- Electrical Parameters
- Thermal Management & Reliability
- Packaging & Materials
- Quality Control & Binning
- Testing & Certification
1. Product Overview
1.1 General Description
This component is a white light emitting diode (LED) in a PLCC-2 (Plastic Leaded Chip Carrier) package. The device is fabricated using a blue semiconductor chip combined with a phosphor coating to produce white light. The compact surface-mount package measures 2.20 mm in length, 1.40 mm in width, and 1.30 mm in height, making it suitable for space-constrained applications.
1.2 Features
- Package: PLCC-2 form factor.
- Viewing Angle: Extremely wide viewing angle, typical 120 degrees.
- Assembly Compatibility: Designed for all standard Surface Mount Technology (SMT) assembly and soldering processes.
- Packaging: Available supplied on tape and reel for automated placement.
- Moisture Sensitivity: Rated at Moisture Sensitivity Level (MSL) 2.
- Environmental Compliance: Compliant with RoHS (Restriction of Hazardous Substances) and REACH (Registration, Evaluation, Authorisation and Restriction of Chemicals) regulations.
- Qualifications: Product qualification testing is based on the AEC-Q101 standard for stress test qualification of automotive-grade discrete semiconductors.
1.3 Application
The primary application for this LED is in automotive interior lighting. This includes applications such as dashboard backlighting, switch illumination, ambient lighting, and indicator lights within the vehicle cabin.
2. In-Depth Technical Parameters
2.1 Electrical and Optical Characteristics
All parameters are specified at a solder point temperature (Ts) of 25\u00b0C. This is a critical reference point for design calculations.
- Forward Voltage (VF): The typical voltage drop across the LED at a forward current (IF) of 20mA is 3.0 Volts. The minimum and maximum limits for production are 2.7V and 3.3V, respectively. The measurement tolerance is \u00b10.1V.
- Reverse Current (IR): The maximum leakage current when a reverse voltage (VR) of 5V is applied is 10 \u00b5A.
- Luminous Intensity (IV): The typical light output at IF=20mA is 1200 millicandelas (mcd), with a range from 800 mcd (min) to 1500 mcd (max). The measurement tolerance is \u00b110%.
- Viewing Angle (2\u03b81/2): Defined as the full angle at which luminous intensity is half the peak intensity. The typical value is 120 degrees, providing a very wide and uniform illumination pattern.
- Thermal Resistance (R\u03b8J-S): The thermal resistance from the LED junction to the solder point is a maximum of 300 \u00b0C/W. This parameter is crucial for thermal management design to prevent overheating.
2.2 Absolute Maximum Ratings
These ratings define the limits beyond which permanent damage to the device may occur. Operation under these conditions is not advised.
- Power Dissipation (PD): 99 mW maximum.
- Continuous Forward Current (IF): 30 mA maximum.
- Peak Forward Current (IFP): 100 mA maximum, specified under a 1/10 duty cycle with a 10ms pulse width.
- Reverse Voltage (VR): 5 V maximum.
- Electrostatic Discharge (ESD): Human Body Model (HBM) rating of 8000V.
- Operating & Storage Temperature (TOPR, TSTG): -40\u00b0C to +100\u00b0C.
- Maximum Junction Temperature (TJ): 120\u00b0C. This is the highest temperature allowable at the semiconductor junction itself.
3. Binning System Explanation
To ensure consistency in mass production, LEDs are sorted into bins based on key electrical and optical parameters measured at IF = 20mA.
3.1 Forward Voltage (VF) Binning
LEDs are grouped into bins designated F2, G1, G2, H1, H2, and I1, corresponding to specific voltage ranges from 2.7-2.8V up to 3.2-3.3V. This allows designers to select parts with tighter voltage tolerances for their specific circuit requirements.
3.2 Luminous Intensity (IV) Binning
The luminous output is binned into three categories: L1 (800-1000 mcd), L2 (1000-1200 mcd), and M1 (1200-1500 mcd). This binning ensures brightness uniformity within an assembly.
3.3 Chromaticity Coordinate Binning
The white color point is defined within specific regions on the CIE 1931 chromaticity diagram. The datasheet defines three bins (TC1, TC2, TC3), each a quadrilateral area specifying the acceptable range of x and y color coordinates. The tolerance for these coordinates is \u00b10.005. This controls the hue and saturation of the white light, ensuring a consistent white appearance across multiple LEDs.
4. Performance Curve Analysis
4.1 Forward Current vs. Forward Voltage (IV Curve)
The characteristic curve shows a non-linear relationship. The forward voltage increases with current, starting around 2.5V at very low currents and rising to approximately 3.2V at the maximum continuous current of 30mA. This curve is essential for driver design, especially for constant-current drivers, to understand the required compliance voltage.
4.2 Forward Current vs. Relative Luminous Intensity
This curve demonstrates that light output is approximately proportional to current in the operating range. However, it is not perfectly linear, and efficiency (light output per unit of electrical power) typically decreases at very high currents due to increased heat generation. The curve confirms that 20mA is a standard operating point providing good efficiency and output.
5. Mechanical and Package Information
5.1 Package Dimensions
The PLCC-2 package has a body size of 2.20mm (L) \u00d7 1.40mm (W) \u00d7 1.30mm (H). All dimension tolerances are \u00b10.20mm unless otherwise specified on the drawing. The package includes a molded lens that creates the wide 120-degree viewing angle.
5.2 Polarity Identification and Soldering Pattern
The cathode (negative terminal) is identified by a distinctive marker on the package, typically a green dot, a notch, or a chamfered corner as shown in the diagram. A recommended solder pad land pattern (footprint) is provided for PCB layout. This pattern is designed to ensure reliable solder joints and proper alignment during reflow soldering.
6. SMT Reflow Soldering and Handling Guidelines
6.1 Reflow Soldering Profile
As an MSL Level 2 component, this LED must be soldered within 168 hours (1 week) of opening a moisture-sensitive bag under factory floor conditions (<30\u00b0C/60% RH). A standard lead-free (SAC305) reflow profile is suitable. Key parameters include a preheat ramp, a soak zone to activate flux, a peak temperature typically not exceeding 260\u00b0C, and a controlled cooling phase. The specific time above liquidus (e.g., 217\u00b0C) should be controlled to minimize thermal stress on the component.
6.2 Handling and Storage Precautions
- ESD Protection: Although the device has a high ESD withstand voltage (8000V HBM), standard ESD precautions (wrist straps, conductive mats, ionizers) must be followed during handling to prevent latent damage.
- Thermal Management in Operation: The maximum operating current should be determined after measuring the actual package temperature in the application. The junction temperature (TJ) must not exceed its absolute maximum rating of 120\u00b0C. Designers must consider the thermal resistance and ensure adequate heat sinking via the PCB pads and traces.
- Cleaning: If cleaning is required post-solder, use methods and solvents compatible with the plastic package material to avoid damage or discoloration of the lens.
7. Packaging and Ordering Information
7.1 Tape and Reel Specifications
The components are supplied on embossed carrier tape wound onto reels. The datasheet provides precise dimensions for the carrier tape pocket, tape width, pitch, and reel diameter. This information is vital for programming automated pick-and-place machines.
7.2 Reliability Testing
The product undergoes a suite of reliability tests based on AEC-Q101 guidelines. These tests may include (but are not limited to) High Temperature Operating Life (HTOL), Temperature Cycling (TC), High Temperature High Humidity Reverse Bias (H3TRB), and other stress tests to validate performance under automotive conditions.
8. Application Design Suggestions
8.1 Typical Application: Automotive Interior Lighting
For dashboard illumination, the wide viewing angle is beneficial for ensuring uniform light distribution across large panels or symbols. A constant-current driver is highly recommended over a constant-voltage/resistor combination to ensure stable light output regardless of minor variations in forward voltage or temperature. The driver should be designed to limit the current to a safe level, typically 20-30mA, based on thermal considerations.
8.2 Design Considerations
- Current Limiting: Always use a series resistor or, preferably, an active constant-current driver.
- Thermal Path: Maximize the copper area connected to the LED's thermal pad (solder points) on the PCB to act as a heat sink.
- Optical Design: Consider the 120-degree emission pattern when designing light guides, diffusers, or lenses to achieve the desired illumination effect.
9. Technical Comparison and Advantages
Compared to generic non-automotive grade LEDs, this component offers key differentiators:
- Automotive Qualification (AEC-Q101): This is a primary advantage, indicating the device is tested to withstand the harsh environmental conditions (temperature extremes, vibration, humidity) found in automotive applications.
- Controlled Binning: Detailed forward voltage and luminous intensity binning provide predictable performance, crucial for applications requiring visual consistency.
- Wide Viewing Angle: The 120-degree angle is advantageous for applications requiring broad, even illumination without secondary optics.
- Robust Package: The PLCC-2 package offers good mechanical stability and a reliable solder joint footprint.
10. Frequently Asked Questions (Based on Technical Parameters)
10.1 What driver voltage is needed for this LED?
The driver must supply a voltage higher than the maximum forward voltage of the LED string under worst-case conditions. For a single LED, a supply of at least 3.5V is recommended to account for the maximum VF of 3.3V and some margin.
10.2 Can I drive this LED with a 5V supply and a resistor?
Yes, but it requires careful calculation. For example, at a target of 20mA with a typical VF of 3.0V from a 5V supply: R = (5V - 3.0V) / 0.020A = 100\u03a9. The resistor power rating would be P = I^2 * R = (0.02^2)*100 = 0.04W, so a 1/8W or 1/10W resistor is sufficient. However, efficiency is low (~60%), and light output will vary with VF bin and supply voltage fluctuations.
10.3 How many LEDs can I connect in series?
The number depends on your driver's compliance voltage. For a 12V driver, accounting for some headroom: N = (12V - headroom) / Max VF. Using 2V headroom and 3.3V max: (12-2)/3.3 \u2248 3 LEDs in series. Always check the driver datasheet.
11. Practical Design Case Study
11.1 Designing an Automotive HVAC Control Backlight
Scenario: Illuminating four button symbols on a climate control panel. Uniform brightness and color are critical.
Design Steps:
1. Select LEDs from the same luminous intensity bin (e.g., L2: 1000-1200mcd) and chromaticity bin (e.g., TC2) to ensure consistency.
2. Design a simple constant-current driver circuit using a dedicated LED driver IC capable of 80mA total output (4 LEDs \u00d7 20mA).
3. Place the LEDs on the PCB with their centers aligned under the diffused areas of the button symbols.
4. Use a white solder mask on the PCB around the LEDs to reflect light upward and improve efficiency.
5. Ensure the PCB has sufficient thermal copper pours connected to the LED pads, as the enclosed space might limit airflow.
This approach ensures reliable, uniform, and long-lasting illumination.
12. Technology Principle Introduction
This is a phosphor-converted white LED. The fundamental light source is a indium gallium nitride (InGaN) semiconductor chip that emits blue light when forward-biased. This blue light strikes a layer of cerium-doped yttrium aluminum garnet (YAG:Ce) phosphor deposited on or near the chip. The phosphor absorbs a portion of the blue photons and re-emits them as yellow light. The combination of the remaining blue light and the converted yellow light is perceived by the human eye as white light. The exact shade of white (cool, neutral, warm) is determined by the ratio of blue to yellow light, which is controlled by the phosphor composition and thickness.
13. Technology Trends
The trend in such SMD LEDs for automotive and general lighting is towards:
Higher Efficiency (lm/W): Improving the light output per electrical watt, reducing energy consumption and thermal load.
Improved Color Rendering (CRI): Using multi-phosphor blends to produce light that renders colors more accurately, important for interior ambient lighting.
Tighter Color Consistency: Advances in phosphor application and binning processes yield LEDs with very small variations in chromaticity coordinates.
Increased Power Density: Developing packages that can handle higher drive currents in the same or smaller footprint, enabled by better thermal management materials and designs.
Integration: Incorporating multiple LED chips or driver components into a single package module.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |