SMD Yellow LED Specification Sheet - Dimensions 1.6x0.8x0.7mm - Voltage 1.6-2.6V - Color 585-595nm

1. Product Overview

This document details the specifications for a high-performance, surface-mount color LED. The device is designed for modern electronic assembly processes and offers reliable performance in a compact form factor. Its primary function is to provide a stable yellow light output for various indication and display purposes.

Product Positioning & Core Advantages: This LED is positioned as a general-purpose indicator component suitable for mass production and automated assembly lines. Its core advantages include an extremely wide viewing angle, ensuring visibility from various positions, and full compatibility with standard SMT (Surface Mount Technology) assembly and soldering processes. This makes it ideal for high-volume consumer electronics, industrial controls, and appliance applications.

Target Market: The primary target markets include manufacturers of consumer electronics (e.g., TVs, audio equipment), home appliances, automotive interior lighting, industrial control panels, and general signage or status indicator applications where a clear, yellow visual signal is required.

2. Detailed Technical Parameter Analysis

2.1 Electro-Optical Characteristics

The electrical and optical performance is characterized under standard conditions (Ts=25°C). Key parameters define the operating window and performance expectations for the LED.

• Forward Voltage (V_F): Measured at a test current of 5mA, the forward voltage is binned into multiple grades from A1 (1.6V min, 1.7V max) to E2 (2.5V min, 2.6V max). This binning allows designers to select LEDs with consistent voltage drops for current regulation circuit design.
• Dominant Wavelength (λ_D): This parameter defines the perceived color of the LED. It is categorized into bins: D10 (585.0-587.5nm), D20 (587.5-590.0nm), E10 (590.0-592.5nm), and E20 (592.5-595.0nm), covering a yellow spectrum.
• Luminous Intensity (I_V): The light output, measured in millicandelas (mcd), is also binned. Grades range from A00 (8-12 mcd) to D00 (28-43 mcd) at 5mA. The spectral half bandwidth is typically 15nm, indicating a relatively pure color emission.
• Viewing Angle (2θ_1/2): A key feature is the very wide 140-degree viewing angle, providing a broad, uniform light distribution.
• Reverse Current (I_R): The maximum leakage current at a reverse voltage of 5V is 10 μA.
• Thermal Resistance (R_θJ-S): The junction-to-solder point thermal resistance is specified at a maximum of 450 °C/W, which is critical for thermal management calculations.

2.2 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage may occur. Operation should always be within these limits.

• Power Dissipation (P_d): 78 mW
• Continuous Forward Current (I_F): 30 mA
• Peak Pulse Forward Current (I_FP): 60 mA (under pulsed conditions: 0.1ms pulse width, 1/10 duty cycle).
• Electrostatic Discharge (ESD) Immunity: 2000V (Human Body Model).
• Temperature Ranges: Operating and storage temperature range is -40°C to +85°C.
• Maximum Junction Temperature (T_j): 95°C. This is a critical limit; the actual maximum operating current must be determined based on the thermal design of the application to ensure T_j is not exceeded.

3. Binning System Explanation

The product employs a comprehensive binning system to ensure consistency in key parameters, which is crucial for applications requiring uniform appearance or electrical performance.

• Voltage Binning: Forward voltage is sorted into 10 distinct bins (A1 to E2). Designers can select the appropriate bin to match their driver circuit's voltage regulation characteristics, improving efficiency and consistency across multiple units.
• Wavelength Binning: The dominant wavelength is sorted into four bins (D10 to E20). This allows for tight control over the shade of yellow, important for applications where color consistency is critical, such as in multi-LED arrays or status indicators that must match a specific color standard.
• Luminous Intensity Binning: Light output is sorted into four bins (A00 to D00). This enables designers to select a brightness level suitable for the application's ambient light conditions and viewing distance, or to ensure uniform brightness in an array.

4. Performance Curve Analysis

The provided characteristic curves offer deeper insight into the LED's behavior under varying conditions.

• I-V Curve (Forward Voltage vs. Forward Current): This curve shows the non-linear relationship between voltage and current. It is essential for designing appropriate current-limiting circuitry, as a small change in voltage can lead to a large change in current.
• Relative Intensity vs. Forward Current: This curve demonstrates how light output increases with current. It typically shows a sub-linear relationship at higher currents due to heating and efficiency droop.
• Relative Intensity vs. Pin Temperature / Forward Current vs. Pin Temperature: These curves highlight the negative impact of rising temperature on LED performance. As the pin (and, by extension, the junction) temperature increases, both light output and the forward voltage (for a given current) typically decrease. This underscores the importance of effective thermal management.
• Dominant Wavelength vs. Forward Current: This curve shows how the emitted color (wavelength) can shift slightly with operating current, which is a factor in high-precision color applications.
• Spectral Distribution (Relative Intensity vs. Wavelength): This graph displays the full emission spectrum of the LED, centered around the dominant wavelength with a typical half-bandwidth, confirming the color purity.
• Radiation Pattern Diagram: This polar plot visually represents the 140-degree wide viewing angle, showing the angular distribution of light intensity.

5. Mechanical & Package Information

5.1 Package Dimensions

The LED is housed in a compact SMD package with dimensions of 1.6mm (L) x 0.8mm (W) x 0.7mm (H). Tolerances for all dimensions are ±0.2mm unless otherwise specified. Detailed engineering drawings are provided, including top, side, and bottom views.

5.2 Polarity Identification and Solder Pad Design

The bottom view clearly indicates the anode and cathode pads. A recommended solder land pattern (footprint) is provided for PCB design, with dimensions for the pads and their spacing to ensure reliable soldering and proper alignment during the SMT process. Adhering to this footprint is critical for achieving good solder joint integrity and thermal conduction away from the LED.

6. Soldering & Assembly Guidelines

6.1 SMT Reflow Soldering

The component is fully compatible with standard infrared or convection reflow soldering processes. Specific instructions regarding the reflow profile (preheat, soak, reflow peak temperature, and cooling rates) should be followed to prevent thermal shock, tombstoning, or damage to the LED encapsulation. The moisture sensitivity level (MSL) is classified as Level 3.

6.2 Handling and Storage Precautions

• ESD Precautions: Standard ESD handling procedures must be observed during all handling and assembly stages due to the device's sensitivity.
• Moisture Sensitivity: As an MSL Level 3 component, the bag must be baked if the exposure time exceeds the specified limit (typically 168 hours at ≤ 30°C/60% RH) before reflow soldering.
• Cleaning: If cleaning is necessary after soldering, use approved methods and solvents that are compatible with the LED's epoxy lens material.
• Storage: Store in the original moisture barrier bag at conditions within the specified storage temperature range (-40°C to +85°C).

7. Packaging & Ordering Information

The LEDs are supplied in industry-standard packaging suitable for automated pick-and-place machines.

• Carrier Tape & Reel: Detailed specifications for the embossed carrier tape dimensions (pocket size, pitch) and the reel dimensions (diameter, hub size, width) are provided.
• Labeling: Specifications for the reel label include necessary information for traceability and correct handling.
• Moisture Barrier Bagging: The reels are packed in moisture barrier bags with desiccant and humidity indicator cards to maintain the MSL rating.
• Master Carton: Specifications for the outer cardboard box used for shipment are included.

8. Application Suggestions

8.1 Typical Application Scenarios

• Status Indicators: Power-on, standby, function activation, or fault indicators in consumer electronics, appliances, and industrial equipment.
• Backlighting: Edge-lighting for small symbols, icons, or legends on front panels and membrane switches.
• General Decorative Lighting: Low-level ambient or accent lighting where a yellow color is desired.

8.2 Design Considerations

• Current Limiting: Always drive the LED with a constant current source or a current-limiting resistor in series with a voltage source. The value should be calculated based on the desired brightness and the forward voltage bin of the LED to ensure the current does not exceed the absolute maximum rating.
• Thermal Management: Ensure the PCB design provides adequate thermal relief, especially when operating at higher currents or in high ambient temperatures. The maximum junction temperature must not be exceeded. The thermal resistance value can be used to estimate the temperature rise.
• Optical Design: Consider the wide viewing angle when designing light guides or lenses to effectively utilize or control the emitted light.

9. Technical Comparison & Differentiation

Compared to generic through-hole LEDs or less optimized SMD LEDs, this product offers distinct advantages:

• Superior Wide-Angle Performance: The 140-degree viewing angle is exceptionally broad for an SMD LED, providing more uniform illumination without hot spots.
• Robust Binning System: The multi-parameter binning (V_F, λ_D, I_V) provides a high level of consistency, which is often lacking in lower-cost alternatives.
• Optimized for Automation: The packaging (tape & reel) and SMT compatibility streamline high-volume manufacturing, reducing assembly time and cost compared to manual insertion.
• Balanced Performance: It offers a good combination of brightness, efficiency, and reliability in a standard, widely used package size.

10. Frequently Asked Questions (FAQ)

Q1: What is the recommended operating current for this LED?

A1: While the absolute maximum continuous current is 30mA, a typical operating current for general indication is 5mA to 20mA. The exact current should be chosen based on the required brightness and thermal design, ensuring the junction temperature remains below 95°C.

Q2: How do I interpret the voltage bins (A1, B2, etc.)?

A2: These codes represent the forward voltage range of the LED at 5mA. For example, an "A1" bin LED will have a V_F between 1.6V and 1.7V. Selecting a specific bin helps in designing more predictable and efficient driver circuits.

Q3: Can I use this LED in outdoor applications?

A3: The operating temperature range is -40°C to +85°C, which covers many outdoor conditions. However, the specific lens material's resistance to UV radiation and weather sealing of the final product assembly must be evaluated for long-term outdoor durability.

Q4: Why is thermal management important for LEDs?

A4: Excessive heat reduces light output (luminous intensity), shifts the color (wavelength), and significantly shortens the LED's lifespan. Operating above the maximum junction temperature can cause catastrophic failure.

11. Design and Application Case Study

Scenario: Designing a Status Indicator Panel for an Industrial Controller.

A designer needs multiple uniform yellow LEDs to indicate various machine states (Run, Stop, Error, Warning). By specifying LEDs from the same wavelength bin (e.g., E20: 592.5-595nm) and luminous intensity bin (e.g., C00: 18-28 mcd), visual consistency is guaranteed across the panel. Using the recommended solder pad layout ensures reliable automatic assembly. The designer calculates a 15mA drive current using a series resistor, based on the system's 5V supply and the typical V_F of the selected voltage bin. Thermal analysis of the PCB layout confirms the junction temperature remains well below the 95°C limit, ensuring long-term reliability.

12. Technical Principle Introduction

This LED is a solid-state light source. It is fabricated using a semiconductor chip that emits light when electrical current passes through it in the forward direction. The specific yellow color is achieved by using a chip material system (e.g., based on AlInGaP or similar) engineered to emit photons at wavelengths within the yellow region of the visible spectrum (approximately 585-595 nm). The light is then shaped and partially diffused by the epoxy encapsulation to produce the characteristic wide viewing angle.

13. Technology Trends

The general trend in SMD LEDs like this one continues toward higher efficiency (more light output per unit of electrical power), improved color consistency and saturation, and further miniaturization. There is also a focus on enhancing reliability under higher temperature and humidity conditions. The widespread adoption of automated optical inspection (AOI) in manufacturing places greater emphasis on the precision of component placement and the consistency of optical characteristics, which is addressed by the detailed binning systems found in specifications like this one.