Table of Contents
- 1. Product Overview
- 1.1 General Description
- 1.2 Features
- 1.3 Application
- 1.4 Package Dimension
- 1.5 Product Parameters
- 1.6 Typical Optical Characteristics Curves
- 2. Packaging
- 2.1 Packaging Specification
- 2.2 Moisture Resistant Packing
- 2.3 Cardboard Box
- 2.4 Reliability Test Items and Conditions
- 2.5 Criteria for Judging Damage
- 3. SMT Reflow Soldering Instructions
- 3.1 Reflow Profile
- 3.1.1 Soldering Iron
- 3.1.2 Repairing
- 3.1.3 Cautions
- 4. Handling Precautions
- 4.1 Storage and Handling
- 5. Binning System
- 6. Application Recommendations
- 7. Technical Comparison
- 8. Frequently Asked Questions
- 9. Practical Design Example
- 10. Operating Principle
- 11. Industry Trends
- LED Specification Terminology
- Photoelectric Performance
- Electrical Parameters
- Thermal Management & Reliability
- Packaging & Materials
- Quality Control & Binning
- Testing & Certification
1. Product Overview
1.1 General Description
This yellow SMD LED is fabricated using a highly efficient yellow chip and packaged in a compact 1.6mm x 0.8mm x 0.25mm form factor, commonly referred to as 0603 package. The LED delivers a dominant wavelength in the range of 585nm to 595nm, producing a pure yellow light output. It is designed for general-purpose indication and backlighting applications where low power consumption and small footprint are critical. The device supports standard SMT assembly processes and meets RoHS compliance requirements.
1.2 Features
- Extremely wide viewing angle of 140° for uniform light distribution.
- Suitable for all SMT assembly and soldering processes.
- Moisture sensitivity level: Level 3 (MSL 3) per JEDEC standard.
- RoHS compliant, free of hazardous substances.
- Available in multiple voltage, wavelength, and intensity bins for design flexibility.
- Low thermal resistance (450 K/W typical) aiding heat dissipation.
1.3 Application
- Optical indicators in consumer electronics, home appliances, and industrial equipment.
- Switch and symbol backlighting for user interfaces.
- General-purpose display and status indication.
- Automotive interior lighting (non-critical applications).
1.4 Package Dimension
The LED package has a compact outline: length 1.60mm, width 0.80mm, and height 0.25mm. The bottom view shows two anode/cathode pads with polarity markings. The top view indicates a light-emitting surface. The soldering pattern recommends a pad layout of 2.4mm x 0.8mm with a 0.8mm spacing. All dimensions are in millimeters with tolerances of ±0.2mm unless otherwise noted. The polarity is marked on the package to ensure correct orientation during assembly.
1.5 Product Parameters
All electrical and optical parameters are specified at an ambient temperature of 25°C (Ts=25°C) unless otherwise indicated.
| Parameter | Symbol | Condition | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Forward Voltage (Bin A0) | VF | IF=20mA | 1.6 | -- | 1.8 | V |
| Forward Voltage (Bin B0) | VF | IF=20mA | 1.8 | -- | 2.0 | V |
| Forward Voltage (Bin C0) | VF | IF=20mA | 2.0 | -- | 2.2 | V |
| Forward Voltage (Bin D0) | VF | IF=20mA | 2.2 | -- | 2.4 | V |
| Dominant Wavelength (Bin 2K) | λD | IF=20mA | 585 | -- | 590 | nm |
| Dominant Wavelength (Bin 2L) | λD | IF=20mA | 590 | -- | 595 | nm |
| Luminous Intensity (Bin F00) | IV | IF=20mA | 65 | -- | 100 | mcd |
| Luminous Intensity (Bin G00) | IV | IF=20mA | 100 | -- | 150 | mcd |
| Luminous Intensity (Bin H00) | IV | IF=20mA | 150 | -- | 230 | mcd |
| Luminous Intensity (Bin I00) | IV | IF=20mA | 230 | -- | 350 | mcd |
| Spectral Half Bandwidth | Δλ | IF=20mA | -- | 15 | -- | nm |
| Viewing Angle | 2θ1/2 | IF=20mA | -- | 140 | -- | deg |
| Reverse Current | IR | VR=5V | -- | -- | 10 | μA |
| Thermal Resistance (Junction to Solder) | RTHJ-S | IF=20mA | -- | -- | 450 | K/W |
Absolute Maximum Ratings at Ts=25°C
| Parameter | Symbol | Rating | Unit |
|---|---|---|---|
| Power Dissipation | Pd | 48 | mW |
| Forward Current (DC) | IF | 20 | mA |
| Peak Forward Current (Pulse) | IFP | 60 | mA |
| Electrostatic Discharge (HBM) | ESD | 2000 | V |
| Operating Temperature | Topr | -40 ~ +85 | °C |
| Storage Temperature | Tstg | -40 ~ +85 | °C |
| Junction Temperature | Tj | 95 | °C |
1.6 Typical Optical Characteristics Curves
The performance curves illustrate the behavior of the LED under varying conditions. Figure 1-6 shows the forward current versus forward voltage relationship, indicating a typical turn-on voltage around 1.8V to 2.0V for 20mA. Figure 1-7 demonstrates the relative intensity as a function of forward current, showing a linear increase up to 20mA. Figure 1-8 depicts the relative intensity versus ambient temperature, with a slight decrease at higher temperatures. Figure 1-9 provides the derating curve for forward current versus pin temperature, recommending current reduction above 60°C. Figure 1-10 shows the dominant wavelength shift with forward current; the wavelength remains nearly stable around 590nm. Figure 1-11 illustrates the spectral distribution with a peak at approximately 590nm and a half-bandwidth of about 15nm. Figure 1-12 is the radiation pattern diagram, confirming a wide 140° viewing angle with uniform emission.
2. Packaging
2.1 Packaging Specification
The LEDs are packaged in tape and reel format with 4000 pieces per reel. The carrier tape has a width of 8.0mm, with pocket pitch 4.0mm and component orientation according to feeding direction. The reel dimensions are: outer diameter 178mm, width 8.0mm, hub diameter 60mm, and arbor hole diameter 13.0mm. Each reel is labeled with part number, spec number, lot number, bin code (for flux, chromaticity, forward voltage, wavelength), quantity, and date code.
2.2 Moisture Resistant Packing
The reel is sealed in a moisture barrier bag (MBB) with a desiccant and humidity indicator card to maintain moisture level below MSL 3 requirements. The bag is vacuum-sealed and labeled with ESD precaution markings.
2.3 Cardboard Box
Multiple reels are packed in a standard cardboard box for shipping. The box is labeled with product information and shipping marks.
2.4 Reliability Test Items and Conditions
The LEDs have been qualified according to JEDEC standards: Reflow (260°C, 10s, 2 times), Temperature Cycle (-40°C to 100°C, 100 cycles), Thermal Shock (-40°C to 100°C, 300 cycles), High Temperature Storage (100°C, 1000h), Low Temperature Storage (-40°C, 1000h), and Life Test (25°C, 20mA, 1000h). Acceptance criteria: 0 failure out of 22 samples.
2.5 Criteria for Judging Damage
After reliability tests, the following limits apply: Forward voltage at 20mA must not exceed 1.1 times the upper specification limit (USL). Reverse current at 5V must not exceed 2.0 times USL. Luminous intensity at 20mA must not drop below 0.7 times the lower specification limit (LSL).
3. SMT Reflow Soldering Instructions
3.1 Reflow Profile
The recommended reflow soldering profile includes: Preheating from 150°C to 200°C for 60-120 seconds; ramp-up rate ≤3°C/s; time above 217°C (TL) for 60-150 seconds; peak temperature (TP) 260°C for max 10 seconds; cooling rate ≤6°C/s. Total time from 25°C to peak should be ≤8 minutes. Reflow soldering should not be done more than twice, and if more than 24 hours between soldering passes, the LEDs must be baked.
3.1.1 Soldering Iron
For hand soldering, use a soldering iron with temperature below 300°C and contact time less than 3 seconds. Hand soldering should be performed only once per LED.
3.1.2 Repairing
Repair after soldering is not recommended. If unavoidable, use a double-head soldering iron and pre-validate that the LED characteristics will not be damaged.
3.1.3 Cautions
Do not mount LEDs on warped PCB portions. After soldering, avoid mechanical stress or vibration during cooling. Do not rapidly cool the device.
4. Handling Precautions
4.1 Storage and Handling
- Before opening the moisture barrier bag: store at <30°C, <75%RH for up to 1 year from date code.
- After opening: store at <30°C, <60%RH and use within 168 hours (7 days). If the humidity indicator shows >60%RH, baking is required (60°C±5°C for 24 hours).
- The LED is sensitive to ESD (HBM 2000V). Proper ESD precautions must be taken during handling and assembly.
- Environmental compatibility: the mating materials must have sulfur content less than 100PPM; bromine <900PPM; chlorine <900PPM; total halogens <1500PPM. VOCs from fixture materials can cause discoloration; test compatibility in final application.
- Thermal design is critical: ensure the junction temperature does not exceed 95°C. Derate forward current if the ambient temperature exceeds 60°C.
- For circuit design, use current-limiting resistors to prevent overcurrent due to forward voltage variations. Do not apply reverse voltage.
5. Binning System
The LED is sorted into multiple bins to provide tight tolerance for critical parameters:
- Forward Voltage Bins: A0 (1.6-1.8V), B0 (1.8-2.0V), C0 (2.0-2.2V), D0 (2.2-2.4V). This allows designers to select a specific voltage range for consistent brightness in series or parallel circuits.
- Dominant Wavelength Bins: 2K (585-590nm) and 2L (590-595nm). Enables color uniformity in applications requiring multiple LEDs.
- Luminous Intensity Bins: F00 (65-100mcd), G00 (100-150mcd), H00 (150-230mcd), I00 (230-350mcd). Provides flexibility for different brightness requirements.
6. Application Recommendations
For typical applications such as indicator lights, design the forward current to 20mA using an appropriate resistor. Consider derating if the LED is operated in high ambient temperatures. The wide 140° viewing angle is ideal for front-panel indicators that need to be visible from many angles. For display backlighting, multiple LEDs can be used in series/parallel with proper current sharing. Ensure PCB pad design matches the recommended soldering pattern (0.8mm pads with 2.4mm pitch). Avoid exposing the LED to aggressive chemicals or environments with high sulfur content.
7. Technical Comparison
Compared to other 0603 yellow LEDs on the market, this device offers a very wide viewing angle (140° vs typical 120°), multiple binning options for voltage and wavelength, and a low thermal resistance that aids heat management. The MSL 3 rating is standard for moisture sensitivity, but the device’s robust package allows for standard SMT processes. The availability of intensity bins from 65mcd to 350mcd gives designers a wide brightness selection without overspecification.
8. Frequently Asked Questions
Q: How do I choose the correct voltage bin? A: Select the bin that matches your supply voltage minus the voltage drop across the current-limiting resistor. For example, if using 3.3V supply and 20mA, choose a forward voltage around 1.8-2.0V (Bin B0 or C0) to keep resistor power dissipation reasonable.
Q: Can I drive these LEDs at currents above 20mA? A: The absolute maximum DC current is 20mA; pulsed operation up to 60mA is allowed with 1/10 duty cycle and 0.1ms pulse width. Exceeding these limits may cause damage.
Q: Why are there multiple intensity bins? A: The binning accounts for natural process variations. Designers can order a specific intensity bin to meet minimum brightness without over-specifying, which helps cost control.
Q: How should I bake the LEDs if needed? A: Bake at 60±5°C for 24 hours if the bag has been opened for more than 168 hours or the humidity indicator shows >60%RH. Use only one bake cycle.
9. Practical Design Example
Consider an appliance indicator requiring a yellow LED visible at a distance of 2 meters with a 5V supply. Using Bin G00 (100-150mcd) and Bin B0 (1.8-2.0V), the current-limiting resistor value is (5V - 1.9V)/20mA = 155Ω, choose a standard 150Ω resistor. The power dissipation in the resistor is 62mW, well within 1/8W rating. For multiple LEDs in parallel, each must have its own resistor to avoid uneven current sharing due to forward voltage variation. The packaging ensures 4000 parts per reel, suitable for medium-volume production.
10. Operating Principle
Yellow LEDs typically use an AlInGaP (aluminum indium gallium phosphide) semiconductor structure. When current flows across the p-n junction, electrons recombine with holes, releasing photons with energy corresponding to the yellow portion of the spectrum (around 590nm). The emitted color is determined by the bandgap of the active material. The encapsulation includes a yellow-dyed clear epoxy or silicone that provides mechanical protection and improves light extraction. The wide viewing angle is achieved through careful lens design and the use of a diffusing encapsulant.
11. Industry Trends
The trend in SMD LEDs continues toward smaller packages (e.g., 0402, 0201) with higher efficacy. Yellow LEDs are being augmented by phosphor-converted amber using blue chips plus yellow phosphor, which offers better color stability. However, direct yellow chip LEDs remain popular for their simple drive circuitry and saturated color. The demand for automotive interior lighting and smart home devices drives the need for compact, reliable yellow indicators. The binning strategies employed in this datasheet align with industry practices to ensure consistent performance in volume applications.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |