LED Yellow 1.6x0.8x0.7mm SMD - Forward Voltage 1.8-2.4V - Power 72mW - Technical Datasheet

1. Product Overview

This specification describes a compact yellow surface-mount LED (Light Emitting Diode) in a 1.6mm x 0.8mm x 0.7mm package. It is fabricated using a yellow chip and designed for general-purpose optical indication, switches, symbols, and displays. The device features an extremely wide viewing angle of 140 degrees, making it suitable for applications where uniform light distribution is required. It is compatible with all standard SMT assembly and solder processes, is RoHS compliant, and has a moisture sensitivity level of 3.

1.1 Features

• Extremely wide viewing angle (2θ1/2 = 140° typical)
• Suitable for all SMT assembly and solder processes
• Moisture sensitivity level: Level 3
• RoHS compliant

1.2 Applications

• Optical indicators
• Switches, symbols, and displays
• General illumination and signaling

2. Technical Parameters - In-Depth Analysis

2.1 Electrical/Optical Characteristics (at Ts=25°C, IF=20mA)

The forward voltage is sorted into three bins: B0 (1.8–2.0V), C0 (2.0–2.2V), and D0 (2.2–2.4V). The dominant wavelength is available in two bins: 2K (585–590nm) and 2L (590–595nm). Luminous intensity is categorized into five bins: F20 (80–100mcd), G10 (100–120mcd), G20 (120–150mcd), H10 (150–180mcd), and H20 (180–230mcd). Note that no selected bin code implies the full range. All measurements are made under standardized conditions.

2.2 Absolute Maximum Ratings

Care must be taken not to exceed these ratings. The forward voltage measurement tolerance is ±0.1V, dominant wavelength tolerance ±2nm, and luminous intensity tolerance ±10%. When operating, the maximum current should be decided after measuring the package temperature to ensure the junction temperature does not exceed 95°C.

3. Binning System

The LED is binned for forward voltage, dominant wavelength, and luminous intensity to enable consistent performance in applications requiring tight tolerance. The bin codes are printed on the label and are used for ordering identification. The following bins are available:

• Forward Voltage: B0 (1.8-2.0V), C0 (2.0-2.2V), D0 (2.2-2.4V)
• Dominant Wavelength: 2K (585-590nm), 2L (590-595nm)
• Luminous Intensity: F20 (80-100mcd), G10 (100-120mcd), G20 (120-150mcd), H10 (150-180mcd), H20 (180-230mcd)

Customers should specify the desired bin codes when ordering to ensure consistent color and brightness.

4. Performance Curve Analysis

The typical optical characteristics curves are provided to help designers understand the behavior of the LED under various conditions. Key curves include:

• Forward Voltage vs. Forward Current (Fig 1-6): Shows the exponential relationship between VF and IF. At 20mA, VF is typically around 2.0V (depending on bin).
• Forward Current vs. Relative Intensity (Fig 1-7): The relative light output increases nearly linearly with forward current up to 30mA.
• Pin Temperature vs. Relative Intensity (Fig 1-8): As the solder joint temperature rises, the light output decreases. At 85°C pin temperature, relative intensity may drop to about 80% of the 25°C value.
• Pin Temperature vs. Forward Voltage (Fig 1-9): Forward voltage decreases slightly with increasing temperature, approximately -2mV/°C.
• Forward Current vs. Dominant Wavelength (Fig 1-10): Increasing current causes a small shift in dominant wavelength (redshift). At 30mA, the shift is typically 1-2nm.
• Relative Intensity vs. Wavelength (Fig 1-11): The spectral distribution shows a peak around 590nm with a half bandwidth of about 15nm.
• Radiation Pattern (Fig 1-12): The LED emits light in a wide lambertian pattern with a half-angle of approximately 70° (140° viewing angle). The intensity at 70° is about half of that at 0°.

5. Mechanical & Packaging Information

5.1 Package Dimensions

The LED package measures 1.6mm × 0.8mm × 0.7mm. The top view shows a light emitting area (LED chip) centered. The bottom view reveals two solder pads: pad 1 (anode) is larger and pad 2 (cathode) is smaller. Polarity is indicated by a chamfer or mark on the package. The recommended soldering pattern (footprint) is 0.8mm × 2.4mm with 0.8mm spacing between pads. All dimensions are in millimeters with a tolerance of ±0.2mm unless otherwise noted.

5.2 Polarity Identification

The cathode side is typically marked with a small notch or dot. In the bottom view, the cathode pad is smaller and located at the same side as the polarity marking. Correct orientation is critical for proper operation.

6. Soldering & Assembly Guidelines

6.1 Reflow Soldering Profile

The recommended reflow soldering temperature profile is as follows:

• Average ramp-up rate: max 3°C/s (from Tsmin to Tp)
• Preheat: 150°C to 200°C, 60-120 seconds
• Time above 217°C (TL): max 60 seconds
• Peak temperature (Tp): 260°C, max 10 seconds
• Time within 5°C of Tp: max 30 seconds
• Cooling rate: max 6°C/s
• Time from 25°C to Tp: max 8 minutes

Reflow soldering should not be performed more than twice. If more than 24 hours elapse between two soldering operations, the LEDs must be baked to remove moisture. Manual soldering (with iron) should be done at ≤300°C for less than 3 seconds, only once.

6.2 Storage and Handling Precautions

Before opening the moisture barrier bag, store at ≤30°C and ≤75% RH for up to one year from date of manufacture. After opening, the LEDs must be used within 168 hours at ≤30°C and ≤60% RH. If the exposure time is exceeded or the desiccant has faded, bake at 60±5°C for at least 24 hours. Avoid mechanical stress, rapid cooling, and flexing of the PCB after soldering. The LED should not be soldered onto a warped PCB. Do not apply force or vibration during cooling.

7. Packaging & Ordering Information

7.1 Packaging Specification

Standard packaging: 4,000 pieces per reel. The carrier tape has a width of 8.0mm, pitch of 4.0mm, and includes a top tape. Reel dimensions: diameter 178±1mm, width 8.0±0.1mm, hub diameter 60±1mm, and spindle hole diameter 13.0±0.5mm.

7.2 Label Information

The label on the reel and moisture barrier bag contains the following fields: Part Number, Spec Number, Lot Number, Bin Code (for flux, chromaticity, forward voltage, wavelength), Quantity, and Date. An example label format is shown in the datasheet.

7.3 Moisture Resistant Packing

The reels are placed in a moisture barrier bag with a desiccant and humidity indicator card, then sealed. An outer cardboard box is used for shipping. The box includes a label with product information and handling precautions for electrostatic sensitive devices.

8. Application Guidelines

Typical applications for this yellow LED include:

• Status indicators on consumer electronics (e.g., power-on, network activity)
• Backlighting for switches and symbols
• Signal lamps in industrial control panels
• Automotive interior lighting (non-critical)
• General decorative lighting

Design considerations:

• Always use a current-limiting resistor to prevent exceeding the maximum forward current.
• Thermal management is important; ensure adequate heat sinking or PCB copper area to keep the junction temperature below 95°C.
• Avoid reverse voltage (VR > 5V) as it may cause migration and damage.
• The environment should limit sulfur compounds to <100ppm and halogen content (<900ppm each for Br and Cl, <1500ppm total) to prevent corrosion and discoloration of the LED.
• Do not use adhesives or materials that outgas volatile organic compounds (VOCs) that can attack the silicone encapsulant and cause light output degradation.

9. Technical Comparison

Compared to standard 0603 (1.6×0.8mm) yellow LEDs, this device offers a wider viewing angle (140° vs typical 120°) and a tighter wavelength binning (±2.5nm) for more consistent color. The package height of 0.7mm is suitable for low-profile designs. The thermal resistance of 450°C/W is moderate; designers should provide adequate copper area for heat dissipation. The ESD rating of 2kV (HBM) ensures good robustness in handling.

10. Frequently Asked Questions

1. Q: What is the recommended forward current for optimal efficiency? A: The typical test condition is 20mA. Operating at 20mA provides a good balance between brightness and power consumption.
2. Q: Can I drive this LED at 30mA continuously? A: Yes, 30mA is the maximum continuous forward current, but ensure the junction temperature does not exceed 95°C. Derating may be required at high ambient temperatures.
3. Q: How do I interpret the bin codes on the label? A: The bin codes specify the forward voltage (B0, C0, D0), wavelength (2K, 2L), and luminous intensity (F20, G10, etc.). A typical label might show: VF=B0, WLD=2K, IV=G10.
4. Q: What is the shelf life after opening the moisture barrier bag? A: The LEDs must be used within 168 hours (7 days) if stored at ≤30°C and ≤60% RH. Otherwise, baking is required.
5. Q: Can this LED withstand wave soldering? A: The datasheet specifies reflow soldering only. Wave soldering is not recommended because of the risk of thermal shock and mechanical stress.

11. Design-in Examples

Case 1: Status indicator with constant current. Use a resistor in series with a 5V supply. For IF=20mA and VF=2.0V (typical), the resistor value is (5-2)/0.02 = 150Ω. Power dissipation in the resistor is 0.02²×150 ≈ 60mW, use a 0805 or larger resistor.

Case 2: Multiple LEDs in parallel. Each LED must have its own series resistor to ensure balanced current sharing. Do not connect them directly in parallel without individual resistors.

Case 3: Thermal design. If the ambient temperature is 60°C and the total power dissipation is 72mW, the junction temperature rise above ambient is Pd × Rth = 0.072W × 450°C/W = 32.4°C. Junction temperature = 60 + 32.4 = 92.4°C, which is below the 95°C maximum. Adequate PCB copper area is essential to achieve the specified thermal resistance.

12. Operating Principle

This yellow LED is based on a semiconductor chip made from Gallium Arsenide Phosphide (GaAsP) or similar material doped with nitrogen to produce yellow light. When a forward voltage is applied across the p-n junction, electrons and holes recombine radiatively, emitting photons with energy corresponding to the bandgap. The peak wavelength is around 590nm, which appears yellow to the human eye. The narrow spectral bandwidth (~15nm) contributes to good color saturation.

13. Development Trends

Surface-mount LEDs continue to shrink in size while maintaining or improving luminous efficacy. For 0603 packages, luminous intensities exceeding 200mcd at 20mA are now common. Future developments include higher efficiency through improved chip structures (e.g., multi-quantum well designs) and better thermal management. The trend toward miniaturization and higher brightness will continue, driven by applications in wearable devices and portable electronics.