Yellow LED 3.0x1.4x0.52mm - Voltage 2.8-3.3V - 660mW - Automotive Grade - English Technical Datasheet

1. Product Overview

This yellow SMD LED is fabricated using a blue chip combined with yellow phosphor conversion. The package is an EMC (Epoxy Molding Compound) type with dimensions of 3.00mm x 1.40mm x 0.52mm, enabling ultra-thin designs for space-constrained applications. The LED offers an extremely wide viewing angle of 120 degrees, making it ideal for uniform light distribution in automotive interior and exterior lighting. It is fully compatible with standard SMT assembly and reflow soldering processes, supplied on tape and reel with a moisture sensitivity level of 2 (MSL2). The product is RoHS compliant and its qualification test plan follows the AEC-Q102 stress test standard for automotive-grade discrete semiconductors.

1.1 Features

• EMC package provides robust mechanical strength and excellent heat dissipation.
• Extremely wide viewing angle (2θ1/2 = 120° typical).
• Suitable for all SMT assembly and solder processes.
• Available on tape and reel (5,000 pcs/reel).
• Moisture sensitivity level: Level 2 (after opening, store ≤30°C/60%RH, use within 24 hours).
• RoHS compliant.
• Qualified according to AEC-Q102 guidelines for automotive stress tests.

1.2 Applications

Automotive lighting – both interior (dashboard, ambient lights) and exterior (side markers, turn signals, tail lights). The wide viewing angle and high luminous efficiency make it suitable for indicator and decorative lighting where uniform appearance is required.

2. Technical Parameters (Ts=25°C)

2.1 Electrical and Optical Characteristics (IF=140mA)

• Forward Voltage (VF): Min 2.8V, Typ –, Max 3.3V
• Reverse Current (IR): at VR=5V, Max 10μA
• Luminous Flux (Φ): Min 33.4 lm, Max 45.3 lm
• Viewing Angle (2θ1/2): Typ 120°
• Thermal Resistance (Rth JS real): Typ 38°C/W, Max 47°C/W
• Thermal Resistance (Rth JS electrical): Typ 28°C/W, Max 35°C/W
• Photoelectric conversion efficiency at 25°C, pulse mode: ηe = 27%

2.2 Absolute Maximum Ratings

• Power Dissipation (PD): Max 660 mW
• Forward Current (IF): Max 200 mA
• Peak Forward Current (IFP): Max 350 mA (1/10 duty, 10ms pulse)
• Reverse Voltage (VR): Max 5 V
• ESD (HBM): Max 8000 V
• Operating Temperature (TOPR): -40°C to +125°C
• Storage Temperature (TSTG): -40°C to +125°C
• Junction Temperature (TJ): Max 150°C

3. Binning System (IF=140mA)

3.1 Forward Voltage and Luminous Flux Bins

The LED is sorted into voltage bins (G1: 2.8-2.9V, G2: 2.9-3.0V, H1: 3.0-3.1V, H2: 3.1-3.2V, I1: 3.2-3.3V) and luminous flux bins (MB: 33.4-37 lm, NA: 37-40.9 lm, NB: 40.9-45.3 lm). The bin code printed on the label represents a combination of voltage and flux bin, e.g., G1MB.

3.2 Chromaticity Bins

The CIE chromaticity diagram defines two color bins for the yellow emission: AM1 and AM2. Both are within the ECE color standard region for automotive amber. The coordinates for AM1: (0.5490,0.4250), (0.5620,0.4380), (0.5790,0.4210), (0.5625,0.4160). For AM2: (0.5575,0.4195), (0.5750,0.4250), (0.5885,0.4110), (0.5760,0.4070).

4. Typical Optical Characteristics Curves

4.1 Forward Voltage vs Forward Current (Fig. 1-7)

The curve shows that at 2.8V the current is near zero, rising steeply to approximately 140mA at 3.2V, and reaching about 200mA at 3.4V. This emphasizes the need for constant current driving to avoid thermal runaway.

4.2 Relative Luminous Flux vs Forward Current (Fig. 1-8)

Relative flux increases almost linearly with current from 20mA to 200mA. At 140mA the relative flux is about 100% (reference), and at 200mA it reaches approximately 140%.

4.3 Relative Luminous Flux vs Junction Temperature (Fig. 1-9)

As junction temperature rises from -40°C to 150°C, the relative luminous flux decreases approximately linearly. At 125°C, the flux is about 80% of the value at 25°C, showing moderate thermal sensitivity typical of phosphor-converted LEDs.

4.4 Maximum Forward Current vs Solder Temperature (Fig. 1-10)

To keep the junction temperature within limits, the maximum allowed forward current decreases as the solder point temperature increases. At Ts=25°C, IF,max = 200mA; at Ts=125°C, IF,max drops to about 40mA.

4.5 Voltage Shift vs Junction Temperature (Fig. 1-11)

Forward voltage decreases with increasing temperature at a rate of approximately -2mV/°C. This effect must be considered in circuit design to avoid current increase in constant-voltage drives.

4.6 Radiation Diagram (Fig. 1-12)

The radiation pattern is Lambertian-like, with intensity dropping to 50% at ±60°, confirming the 120° viewing angle (full width at half maximum).

4.7 Chromaticity Coordinate Shift vs Temperature and Current (Fig. 1-13, 1-14)

Both ΔCx and ΔCy shift within ±0.01 over the full temperature range and ±0.005 over the current range, indicating good color stability.

4.8 Spectrum Distribution (Fig. 1-15)

The emission spectrum peaks around 590-595nm (yellow) with a full width at half maximum of about 40nm. The blue pump peak near 455nm is completely absorbed by the phosphor, confirming efficient conversion.

5. Mechanical and Packaging Information

5.1 Package Dimensions

The LED body dimensions are 3.00±0.2mm length, 1.40±0.2mm width, and 0.52±0.2mm height. The top view shows a rectangular outline with a centered light-emitting area. The back view identifies the cathode and anode terminals: the larger pad is typically the cathode (marked with a "-" symbol). The recommended PCB pad layout includes a 2.10mm x 0.86mm pad for the cathode and a 1.60mm x 0.86mm pad for the anode, with a spacing of 0.50mm between them.

5.2 Polarity Identification

The cathode side is indicated by a smaller corner mark (e.g., a notch or dot) on the package top. The back side has a clear "+" and "-" marking.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

The recommended reflow profile includes: preheat from 150°C to 200°C over 60-120 seconds; ramp-up to peak temperature ≤3°C/s; time above 217°C (TL) max 60 seconds; peak temperature (TP) 260°C with dwell time ≤10 seconds within 5°C of peak; cool-down ≤6°C/s. The total time from 25°C to peak should not exceed 8 minutes. Do not perform more than two reflow passes; if the interval between passes exceeds 24 hours, the LED may be damaged due to moisture absorption.

6.2 Repairing and Handling

Repair after soldering is not recommended. If unavoidable, use a dual-head soldering iron and verify that the LED characteristics are not degraded. During handling, do not apply pressure on the silicone encapsulant surface. Use proper vacuum nozzles with controlled force. Avoid bending the PCB after soldering to prevent mechanical stress on the solder joints.

7. Packaging and Ordering Information

7.1 Carrier Tape and Reel

The LEDs are packaged in carrier tape (8mm width) with 5,000 units per reel. The reel measures 178mm diameter, 60mm width, 13mm hub diameter. Tape leader and trailer each have 80-100 empty pockets.

7.2 Moisture Resistant Packing and Label

Each reel is placed in a moisture barrier bag with a desiccant and a humidity indicator card. The bag is sealed and labeled with part number, spec number, lot number, bin code, quantity, and date. The label also includes luminous flux, chromaticity bin, forward voltage bin, and wavelength code.

7.3 Storage Conditions

Before opening: ≤30°C, ≤75% RH, within 1 year from date of packaging. After opening: ≤30°C, ≤60% RH, use within 24 hours. If the desiccant has faded or the storage time exceeded, bake at 60±5°C for ≥24 hours before use.

8. Reliability Test Items

The LED passed the following tests according to AEC-Q102 and JEDEC standards:

• Reflow (260°C peak, 10 sec): 2 cycles, 0/1 fail.
• MSL2 (85°C/60%RH, 168 hrs): 0/1 fail.
• Thermal Shock (-40°C to +125°C, 1000 cycles): 0/1 fail.
• Life Test (Ta=105°C, IF=140mA, 1000 hrs): 0/1 fail.
• High Temperature High Humidity Life Test (85°C/85%RH, IF=140mA, 1000 hrs): 0/1 fail.

Failure criteria: VF > 1.1×U.S.L, IR > 2.0×U.S.L, luminous flux < 0.7×L.S.L.

9. Handling Precautions

9.1 Environmental Contaminants

Sulfur compounds in the environment or mating materials must not exceed 100 ppm to prevent corrosion of silver components. Halogen content (Br, Cl) should be individually <900 ppm and total <1500 ppm. VOCs from fixture materials can penetrate silicone and cause discoloration; compatibility testing is recommended.

9.2 Electrostatic Discharge (ESD) and Electrical Over Stress (EOS)

The LED has an ESD withstand voltage of 8 kV (HBM). However, standard ESD precautions must be observed, including grounded workstations and ionizers. Never apply reverse voltage; ensure circuit design allows only forward bias during operation.

9.3 Thermal Management

Due to thermal resistance of up to 47°C/W (real), proper heat sinking is critical. The junction temperature must not exceed 150°C. Derate forward current appropriately at high ambient temperatures. Use thermal simulation or measurement to verify the design.

10. Application Notes and Design Considerations

10.1 Circuit Design

A constant-current driver is strongly recommended to maintain stable luminous flux and prevent thermal runaway. If a resistor is used for current limiting, account for the negative temperature coefficient of VF. For series/parallel arrays, consider current imbalance due to VF binning and thermal coupling.

10.2 PCB Layout

Use the recommended solder pad dimensions. Ensure sufficient copper area for heat dissipation, particularly on the cathode pad which is the main thermal path. Avoid sharp edges in traces to reduce ESD risk.

10.3 Cleaning

If post-solder cleaning is required, use isopropyl alcohol. Do not use ultrasonic cleaning as it may damage the wire bonds or silicone. Verify that other solvents do not attack the package.

11. Principle of Operation

The yellow LED uses a blue-emitting InGaN chip coated with a YAG:Ce phosphor that down-converts a portion of the blue light to yellow light. The mixture of blue and yellow yields a perceived amber color. The phosphor is dispersed in a silicone matrix that also serves as the primary optic. This approach achieves high efficiency (27% photoelectric conversion) and excellent color stability over temperature and current.

12. Comparison with Other LED Types

Compared to direct-emission AlInGaP yellow LEDs, the phosphor-converted approach offers a wider color tunability, better thermal stability of wavelength, and higher ESD robustness (8kV vs typical 2kV for AlInGaP). However, the AlInGaP direct emission may have a narrower spectrum and potentially higher efficiency at low currents. For automotive applications requiring stringent color bins and long lifetime, the EMC package and AEC-Q102 qualification make this LED a preferred choice.

13. Typical Application Cases

• Automotive interior ambient lighting: strips along dashboard or door panels requiring uniform yellow light.
• Exterior turn signals: combined with red LEDs to achieve dynamic lighting.
• Off-road vehicle marker lights: where high reliability and wide temperature range are needed.
• Instrument panel indicators: backlighting for warning symbols.

14. Frequently Asked Questions (FAQ)

• Q: What is the typical forward voltage at 140mA? Typically around 3.0-3.1V, depending on bin. The data sheet gives a range of 2.8-3.3V.
• Q: Can I drive this LED at 200mA continuously? Yes, provided the solder temperature is ≤25°C and adequate heat sinking keeps the junction below 150°C. At higher ambient temperatures, derating is required.
• Q: What is the meaning of thermal resistance values? Rth JS real (38°C/W) represents the thermal path from junction to solder point under real conditions; Rth JS electrical (28°C/W) is derived from electrical methods. Both are measured at 140mA and 25°C. Use the real value for worst-case thermal design.
• Q: How should I store open reels? After opening, store in a dry cabinet at <30°C and <60% RH, and use within 24 hours. If exceeded, bake at 60°C for 24 hours before use.

15. Development Trends

The demand for automotive-grade LEDs continues to grow with the adoption of advanced lighting systems. Phosphor-converted yellow LEDs are expected to see improvements in efficiency (e.g., >30% photoelectric conversion), higher temperature stability of chromaticity, and even smaller package sizes (e.g., 2.5x1.2mm). Integration of multiple colors in a single package and compatibility with adaptive driving beam (ADB) systems are emerging trends. The use of ceramic substrates instead of EMC may further enhance thermal performance for high-power applications.