Table of Contents
- 1. Product Overview
- 2. Features and Benefits
- 3. Applications
- 4. Technical Parameter Deep Dive
- 4.1 Electrical and Optical Characteristics (at 25°C)
- 4.2 Absolute Maximum Ratings
- 5. Binning System
- 5.1 Forward Voltage and Luminous Intensity Bins (IF=20mA)
- 6. Performance Curve Analysis
- 6.1 Forward Voltage vs. Forward Current
- 6.2 Relative Intensity vs. Forward Current
- 6.3 Temperature Effects
- 6.4 Radiation Pattern
- 6.5 Spectrum Distribution
- 7. Mechanical and Packaging Information
- 7.1 Package Dimensions
- 7.2 Polarity Marking
- 8. Soldering and Assembly Guidelines
- 8.1 Reflow Soldering Profile
- 8.2 Hand Soldering
- 8.3 Repair
- 9. Packaging and Ordering Information
- 9.1 Packaging Specifications
- 9.2 Label Information
- 10. Reliability Testing
- 11. Handling Precautions
- 12. Application Design Considerations
- 12.1 Thermal Management
- 12.2 Color Consistency
- 13. Technical Comparison
- 14. Frequently Asked Questions
- 15. Practical Application Cases
- 15.1 Dashboard Ambient Lighting
- 15.2 Push-button Switch Illumination
- 16. Operating Principle
- 17. Industry Trends and Future Outlook
- LED Specification Terminology
- Photoelectric Performance
- Electrical Parameters
- Thermal Management & Reliability
- Packaging & Materials
- Quality Control & Binning
- Testing & Certification
1. Product Overview
The RF-A1A30-WYS5-A1 is a high-performance yellow Light Emitting Diode (LED) designed for demanding applications requiring reliability and optical consistency. Fabricated using a blue chip and yellow phosphor conversion technology, this device delivers a saturated yellow emission with a dominant wavelength around 585-595nm. The LED is housed in a compact PLCC package with dimensions of 3.50mm x 2.80mm x 1.84mm (LxWxH), making it suitable for surface-mount assembly processes. With an extremely wide viewing angle of 120 degrees, it ensures uniform illumination across large areas. The product is qualified according to AEC-Q101 stress test guidelines for automotive-grade discrete semiconductors, guaranteeing robust performance under harsh conditions. Moisture sensitivity is rated Level 2 per JEDEC standards, requiring proper handling and storage.
2. Features and Benefits
- PLCC Package: Industry-standard footprint compatible with automated pick-and-place equipment and reflow soldering processes.
- Extremely Wide Viewing Angle (120°): Ensures broad light distribution for applications like interior ambient lighting.
- High Luminous Intensity: Typical 1600mcd at 20mA, with a bin range up to 2300mcd.
- AEC-Q101 Qualification: Tested for automotive reliability including thermal shock, high-temperature life, and humidity bias.
- RoHS Compliant: Lead-free and meets European environmental directives.
- Moisture Sensitivity Level 2: Floor life of up to 1 year in sealed bag; 24 hours after opening under controlled conditions.
- ESD Robustness: Withstands up to 8000V Human Body Model (HBM), reducing risk of electrostatic damage during handling.
3. Applications
- Automotive Interior Lighting (dashboard, dome, reading lights)
- Switches and indicator lamps
- General backlighting
- Signage and decorative lighting
4. Technical Parameter Deep Dive
4.1 Electrical and Optical Characteristics (at 25°C)
| Parameter | Symbol | Test Condition | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Forward Voltage | VF | IF=20mA | 2.8 | 3.0 | 3.4 | V |
| Reverse Current | IR | VR=5V | — | — | 10 | µA |
| Luminous Intensity | IV | IF=20mA | 1200 | 1600 | 2300 | mcd |
| Viewing Angle | 2θ½ | IF=20mA | — | 120 | — | deg |
| Thermal Resistance (Junction-to-Solder) | RthJ-S | IF=20mA | — | — | 260 | °C/W |
The forward voltage ranges from 2.8V to 3.4V, with typical value of 3.0V at 20mA. This relatively narrow distribution aids in designing constant-current drivers. The luminous intensity binning allows selection according to brightness requirements, with three bins: M1 (1200-1500mcd), M2 (1500-1800mcd), and N1 (1800-2300mcd). The wide viewing angle of 120° ensures that the light spreads evenly, reducing hotspots.
4.2 Absolute Maximum Ratings
| Parameter | Symbol | Rating | Unit |
|---|---|---|---|
| Power Dissipation | PD | 102 | mW |
| Forward Current (DC) | IF | 30 | mA |
| Peak Forward Current (1/10 Duty, 10ms) | IFP | 50 | mA |
| Reverse Voltage | VR | 5 | V |
| ESD (HBM) | — | 8000 | V |
| Operating Temperature | TOPR | -40 ~ +100 | °C |
| Storage Temperature | TSTG | -40 ~ +100 | °C |
| Junction Temperature | TJ | 120 | °C |
Care must be taken not to exceed these ratings. The maximum DC forward current is 30mA, but the peak current can reach 50mA with a 10% duty cycle and 10ms pulse width. Operating and storage temperature range is -40°C to +100°C, suitable for automotive interior environments.
5. Binning System
5.1 Forward Voltage and Luminous Intensity Bins (IF=20mA)
The LED is sorted into voltage bins (G1: 2.8-2.9V, G2: 2.9-3.0V, H1: 3.0-3.1V, H2: 3.1-3.2V, I1: 3.2-3.3V, I2: 3.3-3.4V) and intensity bins (M1: 1200-1500mcd, M2: 1500-1800mcd, N1: 1800-2300mcd). The chromaticity is defined by the 5E bin in the CIE 1931 diagram, with specific x,y coordinates ensuring consistent yellow color.
6. Performance Curve Analysis
6.1 Forward Voltage vs. Forward Current
The VF-IF curve shows a typical exponential increase: at 2.8V the current is near zero, at 3.0V it reaches 20mA, and at 3.15V it exceeds 30mA. This highlights the need for current regulation rather than voltage drive.
6.2 Relative Intensity vs. Forward Current
Luminous intensity increases almost linearly with current up to 30mA, reaching about 140% of the value at 20mA. At lower currents, efficiency is higher (relative intensity per mA is greater near 10mA).
6.3 Temperature Effects
As solder temperature rises from 25°C to 100°C, the relative luminous intensity drops by about 10-15%, while forward voltage decreases approximately linearly (about -2mV/°C). The maximum permissible forward current also derates with temperature: at 100°C solder point, it should be reduced to about 20mA. The chromaticity coordinates shift slightly with temperature; within -40°C to +100°C, the x,y shift is small but measurable.
6.4 Radiation Pattern
The radiation diagram shows a typical Lambertian distribution with half-intensity angle of ±60°, confirming the 120° viewing angle. The intensity drops to about 10% at ±90°.
6.5 Spectrum Distribution
The yellow emission peak is centered around 585-595nm, with a full width at half maximum (FWHM) of approximately 30nm. No emission below 500nm, ensuring pure yellow light.
7. Mechanical and Packaging Information
7.1 Package Dimensions
The LED package measures 3.50mm x 2.80mm x 1.84mm (length x width x height). The top view shows a rectangular outline with a rounded corner on the cathode side for polarity identification. The bottom view indicates two anode pads (A) and two cathode pads (C) with dimensions: anode pad 2.00mm x 1.25mm, cathode pad 2.40mm x 0.75mm. Recommended soldering pattern footprint matches standard PLCC-2/4 package.
7.2 Polarity Marking
The cathode side is marked with a chamfer in the bottom view (Fig.1-4). On the carrier tape, the polarity mark is printed on the tape pocket.
8. Soldering and Assembly Guidelines
8.1 Reflow Soldering Profile
The recommended reflow profile is based on JEDEC J-STD-020. Key parameters:
- Average ramp-up rate: 3°C/s max
- Preheat zone: 150°C to 200°C for 60-120s
- Time above 217°C: 60s max
- Peak temperature: 260°C for 10s max
- Cooling rate: 6°C/s max
- Time from 25°C to peak: 8 minutes max
Reflow soldering must not exceed twice, and the interval between two reflow cycles should be less than 24 hours to prevent moisture damage.
8.2 Hand Soldering
Hand soldering should be performed at a temperature below 300°C for less than 3 seconds, and only once. Avoid applying pressure on the silicone lens during heating.
8.3 Repair
Repairing after soldering is not recommended. If unavoidable, use a double-head soldering iron to avoid localized overheating.
9. Packaging and Ordering Information
9.1 Packaging Specifications
Standard packaging: 2000 pieces per reel. Carrier tape width: 8mm. Reel dimensions: 178mm diameter, 60mm hub diameter, 13mm spindle hole. The reel is sealed in a moisture barrier bag with a desiccant and humidity indicator card.
9.2 Label Information
The label includes part number, spec number, lot number, bin code (voltage, intensity, chromaticity), quantity, and date code.
10. Reliability Testing
Table 2-3 summarizes the reliability tests performed: reflow (260°C, 2x), moisture sensitivity (85°C/60%RH, 168h), thermal shock (-40°C to 125°C, 1000 cycles), high-temperature life (100°C, 20mA, 1000h), and high humidity life (85°C/85%RH, 20mA, 1000h). All criteria pass with 0 failures in 20 samples. Failure criteria: VF > 1.1x U.S.L, IR > 2x U.S.L, luminous flux < 0.7x L.S.L.
11. Handling Precautions
- Sulfur and Halogen Control: Avoid environments with sulfur compounds >100ppm. Bromine and chlorine in external materials should each be <900ppm and total <1500ppm.
- VOC Sensitivity: Silicone encapsulant can be degraded by volatile organic compounds; use only compatible adhesives and sealants.
- ESD Protection: Use grounded workstations, ionizers, and antistatic packaging. The LED withstands 8000V HBM, but handling should still minimize static.
- Mechanical Stress: Do not apply pressure on the silicone lens; handle by the sides only.
- Circuit Design: Always use a current-limiting resistor or constant-current driver to avoid overcurrent. Ensure reverse voltage is never applied.
- Storage: Unopened bags can be stored at ≤30°C and ≤75% RH for up to one year. After opening, use within 24 hours at ≤30°C and ≤60% RH. If exceed, bake at 60±5°C for >24h before use.
- Cleaning: Use isopropyl alcohol (IPA) for cleaning. Do not use solvents that attack silicone. Ultrasonic cleaning is not recommended.
12. Application Design Considerations
12.1 Thermal Management
With a thermal resistance of 260°C/W (junction-to-solder), proper heat sinking is critical when driving at high currents. The junction temperature must not exceed 120°C. For automotive interior applications, ensure the PCB has sufficient copper area for heat dissipation.
12.2 Color Consistency
The chromaticity bin 5E ensures a tight yellow color point. For multi-LED designs, order LEDs from the same bin to minimize color variation.
13. Technical Comparison
Compared to traditional through-hole yellow LEDs, this PLCC package offers lower profile (1.84mm height), compatibility with automated assembly, and higher reliability due to silicone encapsulation. Compared to other SMD yellow LEDs, it offers a wider viewing angle (120° vs typical 110°) and AEC-Q101 qualification, making it preferable for automotive applications.
14. Frequently Asked Questions
Q1: Can I drive this LED at 50mA continuously?
A: No, the absolute maximum DC forward current is 30mA. 50mA is only allowed for peak pulsed operation with 1/10 duty cycle and 10ms pulse width.
Q2: What is the typical wavelength of this yellow LED?
A: According to the chromaticity bin 5E, the dominant wavelength is approximately 588nm with CIE coordinates around (0.57, 0.42).
Q3: How should I store unused LEDs after opening the moisture barrier bag?
A: Bake at 60±5°C for >24 hours before use if the exposure time exceeds 24 hours. Always store in a dry environment (<60% RH) at <30°C.
Q4: Is this LED suitable for exterior automotive lighting?
A: It is qualified for interior applications per AEC-Q101. For exterior (e.g., stop lamps), additional validation may be needed as the package may not withstand the same environmental stress (e.g., UV, salt spray).
15. Practical Application Cases
15.1 Dashboard Ambient Lighting
In a car dashboard, an array of 10-20 yellow LEDs with a constant current driver (e.g., 15mA per LED) provides uniform backlighting. The wide viewing angle ensures no dark spots. With proper thermal management, the LEDs maintain consistent brightness over the vehicle's lifetime.
15.2 Push-button Switch Illumination
A single yellow LED behind a diffused switch cap offers clear indication. The high intensity (1600mcd) ensures visibility even in bright sunlight. ESD robustness minimizes failures during assembly.
16. Operating Principle
The LED uses a blue-emitting InGaN chip covered with a yellow phosphor (e.g., YAG:Ce). The blue light (~450nm) partially excites the phosphor, which emits yellow light (~550-600nm). The combination of transmitted blue and yellow phosphor emission produces a perceived yellow color. The phosphor is precisely controlled to achieve the specific chromaticity coordinates of the 5E bin.
17. Industry Trends and Future Outlook
The trend toward miniaturization and surface-mount packaging continues, with PLCC packages like this being widely adopted in automotive and general lighting. The automotive sector is moving toward LED-only interior lighting, driven by energy efficiency and design flexibility. Future developments may include even smaller packages (e.g., 3014 or 2016 sizes) with higher lumen densities, and improved thermal management through advanced substrate materials. The AEC-Q101 qualification will remain a benchmark for automotive reliability.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |