REFOND Yellow LED RF-YMRA30TS-AB-G - 2.8x3.5x1.85mm - 2.0-2.6V - 196mW - 584.5-594.5nm - Automotive Grade

1. Product Overview

The REFOND RF-YMRA30TS-AB-G is a high-performance yellow LED based on AlGaInP substrate technology. Packaged in a compact PLCC4 format with dimensions 3.50mm x 2.80mm x 1.85mm, this LED is designed for demanding automotive and industrial applications. It delivers a dominant wavelength range of 584.5nm to 594.5nm, providing a clear yellow emission. With a wide viewing angle of 120 degrees, it ensures excellent visibility and uniform light distribution.

1.1 Features

• PLCC4 surface-mount package for automated assembly
• Extremely wide 120° viewing angle
• Compatible with all SMT assembly and soldering processes
• Available on tape and reel for high-volume production
• Moisture sensitivity level 2 (MSL2)
• RoHS compliant and AEC-Q102 qualified for automotive reliability

1.2 Applications

• Automotive interior and exterior lighting (e.g., dashboard indicators, turn signals, tail lights)
• Switches and control panel indicators

2. Technical Parameters Deep Interpretation

2.1 Photoelectric Characteristics (at Ts=25°C, IF=50mA)

Forward Voltage (VF): Typical values range from 2.0V to 2.6V. This low forward voltage enables efficient operation in low-voltage circuits. The measurement tolerance is ±0.1V.

Reverse Current (IR): Maximum 10µA at VR=5V, indicating excellent rectification quality and minimal leakage.

Dominant Wavelength (λD): 584.5nm to 594.5nm, covering the yellow spectrum. Tolerance ±0.005nm.

Luminous Intensity (IV): Ranges from 1800mcd to 3500mcd at 50mA, providing high brightness for indicator and signaling applications. Tolerance ±10%.

Viewing Angle (2θ1/2): 120 degrees typical, ensuring wide light distribution suitable for automotive lamps.

Thermal Resistance (Junction to Solder): Real thermal resistance 94°C/W typical (max 105°C/W), electrical thermal resistance 80°C/W typical (max 90°C/W). Low thermal resistance helps maintain junction temperature under high-current operation.

2.2 Absolute Maximum Ratings

Power Dissipation (PD): 196mW maximum. Exceeding this may cause permanent damage.

Forward Current (IF): 70mA continuous, 100mA peak (1/10 duty cycle, 10ms pulse width). The operating current must be derated at high ambient temperatures as shown in the solder temperature vs. forward current curve.

Reverse Voltage (VR): 5V maximum. Reverse bias should be avoided in circuit design.

ESD (HBM): 2000V, requiring standard ESD precautions during handling.

Operating Temperature (TOPR): -40°C to +100°C.

Storage Temperature (TSTG): -40°C to +100°C.

Junction Temperature (TJ): 120°C maximum. Thermal management must ensure TJ does not exceed this limit.

3. Bin System

The RF-YMRA30TS-AB-G is sorted into bins for forward voltage, luminous intensity, and dominant wavelength to ensure consistency in applications.

3.1 Voltage Bins (VF at IF=50mA)

3.2 Luminous Intensity Bins (IV at IF=50mA)

3.3 Wavelength Bins (λD at IF=50mA)

Each LED is marked with its bin code on the label, allowing customers to select specific bins for color consistency or intensity matching.

4. Performance Curve Analysis

4.1 Forward Voltage vs. Forward Current (Fig 1-7)

As forward current increases from 0 to 70mA, forward voltage rises exponentially from about 1.8V to 2.6V. At 50mA (typical operating point), VF is approximately 2.3V. This curve helps designers estimate voltage drop and power dissipation at different currents.

4.2 Forward Current vs. Relative Luminous Flux (Fig 1-8)

Relative luminous flux increases almost linearly with forward current up to 50mA, then begins to saturate. At 70mA, relative flux is about 130% of the value at 50mA. For efficient operation, driving at 50mA is recommended to balance brightness and thermal management.

4.3 Junction Temperature vs. Relative Intensity (Fig 1-9)

As junction temperature rises from -40°C to +120°C, relative intensity decreases gradually. At 100°C, intensity drops to about 80% of the value at 25°C. This thermal derating is critical for high-temperature automotive environments.

4.4 Solder Temperature vs. Forward Current (Fig 1-10)

The maximum allowable forward current must be derated when solder temperature exceeds 25°C. At 100°C, the maximum current is about 30mA. Proper heat sinking is essential to maintain current capability.

4.5 Voltage Shift vs. Junction Temperature (Fig 1-11)

Forward voltage decreases linearly with increasing junction temperature at a rate of approximately -2mV/°C. At 100°C, VF drops by about 0.2V compared to -40°C. This negative temperature coefficient must be considered in constant-current driving circuits.

4.6 Radiation Pattern (Fig 1-12)

The LED exhibits a symmetric radiation pattern with half-angle of 60° (120° viewing angle). Relative intensity is 100% at 0°, decreasing to 50% at ±60°. This Lambertian-like distribution ensures uniform illumination in indicator applications.

4.7 Wavelength Shift vs. Junction Temperature (Fig 1-13)

Dominant wavelength shifts to longer wavelengths as temperature increases, at approximately +0.1nm/°C. Over the full temperature range (-40°C to +120°C), the shift can be up to 8nm, which may affect color consistency in multi-LED systems.

4.8 Spectrum Distribution (Fig 1-14)

The spectrum peaks at approximately 590nm with a full-width at half-maximum (FWHM) of about 20nm. The emission is narrow and well-defined in the yellow region, making it suitable for color-critical applications.

5. Mechanical and Package Information

5.1 Package Dimensions

The PLCC4 package is 3.50mm long, 2.80mm wide, and 1.85mm high (all dimensions ±0.05mm). The top view shows a rectangular body with a polarity mark. The bottom view reveals four solder pads: Pad 1 (cathode, marked by a corner cut), Pad 2 (anode), Pad 3 (cathode auxiliary), and Pad 4 (anode auxiliary). The polarity is clearly indicated. The recommended soldering pattern (Fig 1-5) has pad dimensions 0.80mm x 0.70mm with a pitch of 2.20mm and overall footprint 4.60mm x 2.60mm.

5.2 Polarity Identification

The cathode side is marked by a notch on the package corner. The top view shows a polarity mark (tab) indicating cathode. Correct orientation must be ensured during PCB assembly.

6. Soldering and Assembly Guide

6.1 Reflow Soldering Profile

The recommended reflow profile (Fig 3-1) follows standard JEDEC conditions. Key parameters: average ramp-up rate ≤3°C/s, preheat from 150°C to 200°C for 60-120 seconds, time above 217°C: 60 seconds max, peak temperature 260°C with a dwell time within 5°C of peak for 10 seconds max, cooling ramp-down ≤6°C/s. Total time from 25°C to peak ≤8 minutes. Reflow soldering should not exceed two passes; if more than 24 hours between passes, baking is required.

6.2 Manual Soldering

When hand soldering, use a soldering iron at ≤300°C for less than 3 seconds, and only one soldering event per joint.

6.3 Handling Cautions

• Do not apply mechanical stress to the silicone encapsulant surface during assembly.
• Avoid mounting on warped PCBs or bending the board after soldering.
• Do not apply force or vibration during cooling.
• Use proper pickup tools; avoid touching the lens surface directly.

7. Packaging and Ordering Information

Packaging: 2000 pieces per reel. The carrier tape (Fig 2-1) has sprocket hole pitch 4.00mm, component pocket pitch 8.0mm, and width 12mm. The reel (Table 2-1) has outer diameter 178mm, inner diameter 60mm, hub diameter 13mm. Each reel is sealed in a moisture barrier bag with silica gel and a humidity indicator card (MSL2). Labels include part number, spec number, lot number, bin codes (VF, IV, WLD), quantity, and date code.

Cardboard box packaging protects reels during shipment.

8. Application Recommendations

Automotive lighting: The AEC-Q102 qualification makes this LED ideal for automotive interior (ambient, reading lights) and exterior (turn signals, stop lights, taillamps) applications. For exterior use, ensure proper thermal management due to high ambient temperatures.

Switch illumination: With 120° viewing angle, it suits switch backlighting and indicator panels.

Design considerations: Use adequate current-limiting resistors. Operate at 50mA for normal brightness. Ensure PCB heat sink pads are designed to dissipate heat (thermal pad on bottom). Avoid reverse voltage and ESD. For sulfur-rich environments, ensure material compatibility (sulfur content <100ppm, bromine+chlorine <1500ppm).

9. Technology Comparison

Compared to conventional epoxy-encapsulated LEDs, this PLCC4 package with silicone encapsulation offers better high-temperature stability and wider viewing angle. The AlGaInP chip provides high efficiency in the yellow spectrum with low thermal droop. The automotive qualification ensures superior reliability over standard commercial LEDs, especially under vibration and temperature cycling.

10. Frequently Asked Questions

Q: What is the recommended forward current for long life?
A: 50mA is typical; derate above 25°C solder temperature.

Q: Can I drive this LED with a constant voltage source?
A: Not recommended without series resistor due to negative temperature coefficient. Use constant current or resistor.

Q: What is the storage life?
A: 1 year in unopened bag at ≤30°C, ≤75%RH. After opening, use within 24 hours or bake at 60°C for 24h.

Q: How to clean the LED after soldering?
A: Use isopropyl alcohol. Do not use ultrasonic cleaning.

Q: Is the LED resistant to sulfur?
A: Avoid sulfur and halogen exposure beyond specified limits as stated in handling precautions.

11. Practical Application Cases

Automotive tail light: A matrix of these yellow LEDs used for turn signal functions, driven at 50mA each, with thermal vias on PCB and aluminum core board for heat dissipation. Achieved uniform color and intensity meet ECE R6 regulations.

Dashboard indicator: Used as a warning light, with a current of 30mA to lower brightness, ensuring non-glare illumination. The wide viewing angle allows visibility from multiple seating positions.

12. Principle Introduction

The yellow LED is based on a direct bandgap semiconductor material system AlGaInP (Aluminum Gallium Indium Phosphide). The epitaxial layers are grown on a GaAs substrate. The quantum well structure emits photons with energy corresponding to yellow light (around 590nm). The chip is encapsulated in silicone to protect the wire bonds and to enhance light extraction. The PLCC4 package provides thermal and electrical paths via the leadframe.

13. Development Trends

In automotive lighting, the trend is toward smaller packages with higher luminous efficacy and extended reliability. This LED meets the AEC-Q102 standard, which is becoming mandatory for automotive-grade LEDs. Future developments may include even finer binning for color consistency and improved thermal performance using advanced die attach and package designs. The demand for yellow LEDs in rear combination lamps continues to grow with the adoption of LED-based signaling.