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LTP-747KA LED Dot Matrix Display Datasheet - 0.7 Inch (17.22mm) Character Height - Red Orange - AlInGaP Technology - Simplified Chinese Technical Documentation

LTP-747KA is a technical specification sheet for a 0.7-inch (17.22mm) high, 5x7 dot matrix LED display using AlInGaP red-orange chips. It includes detailed specifications, pin definitions, dimensions, and electrical/optical characteristics.
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PDF Document Cover - LTP-747KA LED Dot Matrix Display Datasheet - 0.7-inch (17.22mm) Character Height - Red-Orange - AlInGaP Technology - Simplified Chinese Technical Document

1. Product Overview

LTP-747KA is a single-character, 5x7 dot matrix alphanumeric display module. Its primary function is to provide clear, bright visual output for characters and symbols in various electronic applications. The core component of this display is a light-emitting diode (LED) chip made from advanced aluminum indium gallium phosphide (AlInGaP) semiconductor material, responsible for producing the iconic red-orange light output. This material technology is renowned for its high efficiency and excellent performance characteristics.

The device is constructed with a gray panel and features white dots or segments, which enhances the contrast and readability between the light-emitting elements and the background. The display is classified according to its luminous intensity, meaning the units are binned or sorted based on their measured light output to ensure consistent brightness within a specified range for applications requiring uniform illumination.

2. Detailed Technical Specifications

This section provides a detailed and objective analysis of the key technical parameters specified in the specification document.

2.1 Optical Characteristics

Optical performance is the core of display functionality. Key parameters are measured under specific test conditions, typically at an ambient temperature (TA) of 25°C.

2.2 Electrical Characteristics

Understanding electrical behavior is crucial for proper circuit design and ensuring long-term reliability.

2.3 Absolute Maximum Ratings and Thermal Considerations

These ratings define the limits beyond which permanent damage to the device may occur. They are not conditions for normal operation.

3. Grading and Classification System

The datasheet clearly states that the device is "classified by luminous intensity." This implies the existence of a grading process.

4. Performance Curve Analysis

The datasheet references "Typical Electrical/Optical Characteristic Curves." Although specific charts are not provided in the text, we can infer their standard content and significance.

5. Mechanical and Packaging Information

5.1 Physical Dimensions

The character height of this display is 0.7 inches, equivalent to 17.22 mm. The package dimension drawing (referenced but not shown in the text) will detail the overall length, width, height, pin pitch, and segment arrangement. Unless otherwise specified, the tolerance for all dimensions is defined as ±0.25 mm (0.01 inch). This level of precision is crucial for mechanical fit on a printed circuit board (PCB).

5.2 Pin Connections and Internal Circuitry

This device has 12 pins. The pin definitions are clear: Pin 1: Column 1 anode, Pin 2: Row 3 cathode, Pin 3: Column 2 anode, and so on. The internal circuit diagram shows that the rows use a common cathode configuration. This means each of the 7 rows is connected to the cathodes of all 5 LEDs in that row. The 5 column lines are connected to the anodes of the LEDs in each column. This matrix arrangement allows control of 35 independent points (5x7) using only 12 pins (5+7) through multiplexing technology.

5.3 Polarity Identification

Although not explicitly stated in the text, the pin numbers and internal circuit diagram provide the necessary information for polarity. The pin definition table is the authoritative guide for correctly connecting the anode and cathode. Incorrect polarity connection (applying forward bias to the cathode) will prevent the LED from lighting up and may damage it if the voltage exceeds the reverse voltage rating (5V).

6. Welding and Assembly Guide

The key guideline provided is the soldering temperature profile: the temperature measured 1.6 mm below the package body must not exceed 260°C for more than 3 seconds. This is a standard guideline for wave soldering or reflow soldering processes. For manual soldering, a temperature-controlled soldering iron should be used, and contact time with the pins should be minimized to prevent heat conduction along the pins and damage to the internal chip. Proper electrostatic discharge (ESD) precautions should be observed during handling and assembly to prevent damage to the semiconductor junction.

7. Application Suggestions

7.1 Typical Application Scenarios

Due to its 5x7 dot matrix format being highly suitable for generating alphanumeric characters, the LTP-747KA is ideal for applications requiring clear, single-character readouts. Examples include:

7.2 Design Considerations

8. Technical Comparison and Differentiation

Although no direct comparison with other models is provided, according to its datasheet, the key differentiating factors of the LTP-747KA include:

9. Frequently Asked Questions (Based on Technical Parameters)

9.1 What is the difference between Peak Forward Current (90mA) and Test Condition Current (32mA)?

Peak Forward Current (90mA) is an Absolute Maximum Rating—the highest instantaneous current the LED can withstand without immediate damage. The 32mA used in the luminous intensity test is a typical operating condition measured in a multiplexed (1/16 duty cycle) system. In that case,averageThe current is much lower (32mA / 16 = 2mA). The design must ensure the instantaneous current remains below 90mA, and the average current per point stays below 13mA (considering temperature derating).

9.2 How to understand the 1/16 duty cycle specification?

This represents the standard multiplexing driving method. To control 7 rows with 5 columns, a common technique is to activate one row at a time, cycling rapidly through all 7 rows. If each row is on for an equal duration, its activation time is 1/7 of the total time. The 1/16 duty cycle is a conservative, standardized test condition that allows for comparison between different displays, even if the actual multiplexing scheme in your application is 1/7 or 1/8 duty cycle.

9.3 Me ya sa ake ba da kewayon ƙarfin lantarki mai gaba (matsakaicin 2.05V, na al'ada/mafi girma 2.6V)?

Forward voltage (VF) has a natural variation due to manufacturing tolerances in the semiconductor material. Circuit design must accommodate this range. The current-limiting resistor should be calculated usingMaximum value VF(2.6V) calculation, to ensure that even devices with high VFcan obtain sufficient voltage to turn on and achieve the required current. Using typical values for calculation may lead to the risk of insufficient drive for certain units.

10. Design and Use Case Examples

Scenario:Design a single-character temperature readout display for an industrial controller operating in environments up to 50°C.

  1. Character Set:A 5x7 matrix can display digits 0-9 and letters, such as "C" for degrees Celsius.
  2. Driver Selection:A microcontroller with at least 12 I/O pins or a dedicated display driver IC (e.g., MAX7219) will be used to handle the multiplexing timing.
  3. Current Calculation:Set an average dot current required for a good brightness. Assume we choose an 8mA average. At 50°C, apply derating: Derating = (50°C - 25°C) * 0.17 mA/°C = 4.25 mA. Maximum allowed average current at 50°C = 13 mA - 4.25 mA = 8.75 mA. Our set target of 8mA is safe.
  4. Resistance Calculation:For 1/7 multiplexing (7 rows), the peak current per point needs to reach 8mA * 7 = 56mA to achieve an average of 8mA. This is below the 90mA peak rating. Using a 5V supply and VF(max)=2.6V, the current limiting resistor is R = (5V - 2.6V) / 0.056A ≈ 42.9Ω. A standard 43Ω resistor will be used.
  5. PCB layout:The display placeholder will match the dimensional drawing. Sufficient space will be left around the package for airflow.

The LTP-747KA operates based on the principle of electroluminescence in a semiconductor p-n junction. When a forward voltage exceeding the diode's built-in potential is applied (anode positive relative to the cathode), electrons from the n-type AlInGaP layer recombine with holes from the p-type layer. This recombination event releases energy in the form of photons (light). The specific composition of the AlInGaP alloy (aluminum, indium, gallium, phosphorus) determines the semiconductor's bandgap energy, which directly dictates the wavelength (color) of the emitted light—in this case, a red-orange color of approximately 621 nm. The chip is mounted on an opaque gallium arsenide (GaAs) substrate, which helps reflect light upward, improving the overall light extraction efficiency from the top surface of the device. The 5x7 matrix is formed by individually addressable LEDs arranged in this grid pattern, controlled by an external multiplexing circuit that rapidly sequences power to the rows and columns to create the visual illusion of a stable, fully illuminated character.

12. Technology Trends and Background

AlInGaP LED technology used in the LTP-747KA is a major advancement compared to earlier LED materials like GaAsP. It achieves higher brightness, higher efficiency, and better temperature stability, enabling LEDs to be used in a wider range of indicator and display applications. The trend in display technology subsequently shifted towards higher-density dot matrices, full-color RGB matrices, and the widespread application of organic LED (OLED) and micro-LED displays in high-resolution screens. However, single-character and multi-character alphanumeric dot matrix displays like the 5x7 format remain highly relevant in industrial, appliance, and instrumentation environments for cost-effective, reliable, and easily readable interfaces that do not require full graphical functionality. Regardless of scale or technology, the basic driving principles—multiplexing and current control—remain the cornerstone of LED display design.

AlInGaP LED technology, as used in the LTP-747KA, represented a significant advancement over earlier LED materials like GaAsP. It enabled higher brightness, improved efficiency, and better temperature stability, making LEDs viable for a wider range of indicator and display applications. The trend in display technology has since moved towards higher-density dot matrices, full-color RGB matrices, and the widespread adoption of organic LED (OLED) and micro-LED displays for high-resolution screens. However, single and multi-digit alphanumeric dot matrix displays like the 5x7 format remain highly relevant for cost-effective, reliable, and easily readable interfaces in industrial, appliance, and instrumentation contexts where full graphical capability is not required. The underlying drive principles—multiplexing and current control—remain fundamental to LED display design regardless of the scale or technology.

Detailed Explanation of LED Specification Terminology

Complete Explanation of LED Technical Terminology

I. Core Indicators of Optoelectronic Performance

Terminology Units/Representation Popular Explanation Why It Is Important
Luminous Efficacy lm/W (lumens per watt) The luminous flux emitted per watt of electrical power; the higher the value, the more energy-efficient it is. Directly determines the energy efficiency rating and electricity cost of the lighting fixture.
Luminous Flux lm (lumen) The total amount of light emitted by a light source, commonly known as "brightness". Determines whether a luminaire is bright enough.
Viewing Angle ° (degrees), such as 120° The angle at which light intensity drops to half determines the beam width. Affects the illumination range and uniformity.
Color Temperature (CCT) K (Kelvin), e.g., 2700K/6500K The warmth or coolness of light color; lower values are yellowish/warm, higher values are whitish/cool. Determines the lighting atmosphere and suitable application scenarios.
Color Rendering Index (CRI / Ra) Unitless, 0–100 The ability of a light source to restore the true color of an object, Ra≥80 is recommended. Affects color authenticity, used in high-demand places such as shopping malls and art galleries.
Color Tolerance (SDCM) MacAdam Ellipse Steps, e.g., "5-step" A quantitative indicator of color consistency; a smaller step number indicates higher color consistency. Ensure no color difference among the same batch of luminaires.
Dominant Wavelength nm (nanometer), e.g., 620nm (red) The wavelength values corresponding to the colors of colored LEDs. Determines the hue of monochromatic LEDs such as red, yellow, and green.
Spectral Distribution Wavelength vs. Intensity Curve Display the intensity distribution of light emitted by the LED across various wavelengths. Affects color rendering and color quality.

II. Electrical Parameters

Terminology Symbol Popular Explanation Design Considerations
Forward Voltage Vf The minimum voltage required to light up an LED, similar to a "starting threshold". The driving power supply voltage must be ≥ Vf; when multiple LEDs are connected in series, the voltages add up.
Forward Current If The current value that makes the LED emit light normally. Constant current drive is often used, as the current determines brightness and lifespan.
Matsakaicin ƙarfin wutar lantarki ta bugun jini (Pulse Current) Ifp Peak current that can be withstood in a short time, used for dimming or flashing. Pulse width and duty cycle must be strictly controlled, otherwise overheating damage will occur.
Reverse Voltage Vr The maximum reverse voltage that an LED can withstand; exceeding it may cause breakdown. The circuit must be protected against reverse polarity or voltage surges.
Thermal Resistance Rth (°C/W) The resistance to heat flow from the chip to the solder joint. A lower value indicates better heat dissipation. High thermal resistance requires a more robust heat dissipation design; otherwise, the junction temperature will rise.
ESD Immunity V (HBM), e.g., 1000V The higher the value, the more resistant it is to electrostatic damage. Anti-static measures must be taken during production, especially for high-sensitivity LEDs.

III. Thermal Management and Reliability

Terminology Key Indicators Popular Explanation Impact
Junction Temperature Tj (°C) The actual operating temperature inside the LED chip. For every 10°C reduction, lifespan may double; excessively high temperatures cause lumen depreciation and color shift.
Lumen Depreciation L70 / L80 (hours) The time required for brightness to drop to 70% or 80% of its initial value. Directly defines the "service life" of an LED.
Lumen Maintenance % (e.g., 70%) The percentage of remaining brightness after a period of use. Characterizes the ability to maintain brightness after long-term use.
Color Shift Δu′v′ or MacAdam ellipse The degree of color change during use. Affects the color consistency of the lighting scene.
Thermal Aging Material performance degradation Deterioration of packaging materials due to prolonged high temperatures. May lead to decreased brightness, color shift, or open-circuit failure.

IV. Packaging and Materials

Terminology Common Types Popular Explanation Characteristics and Applications
Packaging Type EMC, PPA, Ceramic The housing material that protects the chip and provides optical and thermal interfaces. EMC tahan panas baik, biaya rendah; keramik pendinginan unggul, umur panjang.
Struktur chip Face-up, Flip Chip Chip electrode arrangement method. Flip Chip offers better heat dissipation and higher luminous efficacy, suitable for high-power applications.
Phosphor coating YAG, silicate, nitride Covered on the blue light chip, partially converted into yellow/red light, mixed into white light. Different phosphors affect luminous efficacy, color temperature, and color rendering.
Lens/Optical design Plane, Microlens, Total Internal Reflection Optical structure on the encapsulation surface, controlling light distribution. Determine the beam angle and light distribution curve.

V. Quality Control and Binning

Terminology Binning Content Popular Explanation Purpose
Luminous Flux Classification Codes such as 2G, 2H Group by brightness level, each group has a minimum/maximum lumen value. Ensure consistent brightness for the same batch of products.
Voltage binning Codes such as 6W, 6X Group by forward voltage range. Facilitates driver power matching and improves system efficiency.
Color binning. 5-step MacAdam ellipse Group by color coordinates to ensure colors fall within an extremely small range. Ensure color consistency to avoid uneven color within the same luminaire.
Color temperature binning 2700K, 3000K, etc. Grouped by color temperature, each group has a corresponding coordinate range. To meet the color temperature requirements of different scenarios.

VI. Testing and Certification

Terminology Standard/Test Popular Explanation Significance
LM-80 Lumen Maintenance Test Record brightness attenuation data under constant temperature conditions over a long period of illumination. Used to estimate LED lifetime (combined with TM-21).
TM-21 Standard for Life Projection Projecting lifetime under actual use conditions based on LM-80 data. Provide scientific life prediction.
IESNA Standard Illuminating Engineering Society Standard Covers optical, electrical, and thermal testing methods. Industry-recognized basis for testing.
RoHS / REACH Environmental Certification Ensure products are free from hazardous substances (e.g., lead, mercury). Market access requirements for entering the international market.
ENERGY STAR / DLC Energy Efficiency Certification Energy Efficiency and Performance Certification for Lighting Products. Commonly used in government procurement and subsidy programs to enhance market competitiveness.